Optimization of Design Space for Vertically Stacked Junctionless Nanosheet FET for Analog/RF Applications

Silicon - This paper investigates the various device dimensions such as gate length (Lg), nanosheet thickness (TNS), and nanosheet width to optimize the design space for vertically stacked...     

An application of the technology acceptance model to the level of Internet usage by older adults

In this cross-sectional study, the principles of a technology acceptance model were used to identify variables related to the level of Internet usage by older adults. Community-dwelling older adults aged 60–88 years completed a postal questionnaire survey that elicited responses on the use of the Internet. Out of a sample of 592 older adults (236 males and 356 females), 50.7% used the Internet. A multiple linear regression analysis was carried out on the Internet users sample using the self-reported number of hours of Internet usage per week as the dependent variable. The results indicated that attitude toward using the Internet and good health status were statistically significant predictors of the level of Internet usage. A second multiple regression analysis using Internet activity as the dependent variable showed that attitude, usefulness, good health, and gender (males) were significant predictor variables.     

Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder

This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 °C, and for the composite counterparts, it is dependent on the percentage of copper nanopowder. Temperature recordings revealed the same temperature level of 221 °C for both melting (from solid to liquid) and final solidification (after recalescence) of the Sn-3.5%Ag solder. Addition of copper nanoparticles was observed to have no appreciable influence on melting temperature of the composite solder. However, it does influence solidification of the composite solder. The addition of 0.5 wt.% copper nanoparticles lowered the solidification temperature to 219.5 °C, while addition of 1.0 wt.% copper nanoparticles lowered the solidification temperature to 217.5 °C, which is close to the melting point of the ternary eutectic Sn-Ag-Cu solder alloy, Sn-3.7Ag-0.9Cu. This indicates the copper nanoparticles are completely dissolved in the eutectic Sn-3.5%Ag solder and precipitate as the Cu₆Sn₅, which reinforces the eutectic solder. Optical microscopy observations revealed the addition of 1.0 wt.% of copper nanoparticles to the Sn-3.5%Ag solder results in the formation and presence of the intermetallic compound Cu₆Sn_5. These particles are polygonal in morphology and dispersed randomly through the solder matrix. Addition of microsized copper particles cannot completely dissolve in the eutectic solder and projects a sunflower morphology with the solid copper particle surrounded by the Cu₆Sn₅ intermetallic compound coupled with residual porosity present in the solder sample. Microhardness measurements revealed the addition of copper nanopowder to the eutectic Sn-3.5%Ag solder resulted in higher hardness.     

Probing Human Telomeric DNA and RNA Topology and Ligand Binding in a Cellular Model by Using Responsive Fluorescent Nucleoside Probes

The development of biophysical systems that enable an understanding of the structure and ligand‐binding properties of G‐quadruplex (GQ)‐forming nucleic acid sequences in cells or models that mimic the cellular environment would be highly beneficial in advancing GQ‐directed therapeutic strategies. Herein, the establishment of a biophysical platform to investigate the structure and recognition properties of human telomeric (H‐Telo) DNA and RNA repeats in a cell‐like confined environment by using conformation‐sensitive fluorescent nucleoside probes and a widely used cellular model, bis(2‐ethylhexyl) sodium sulfosuccinate reverse micelles (RMs), is described. The 2′‐deoxy and ribonucleoside probes, composed of a 5‐benzofuran uracil base analogue, faithfully report the aqueous micellar core through changes in their fluorescence properties. The nucleoside probes incorporated into different loops of H‐Telo DNA and RNA oligonucleotide repeats are minimally perturbing and photophysically signal the formation of respective GQ structures in both aqueous buffer and RMs. Furthermore, these sensors enable a direct comparison of the binding affinity of a ligand to H‐Telo DNA and RNA GQ structures in the bulk and confined environment of RMs. These results demonstrate that this combination of a GQ nucleoside probe and easy‐to‐handle RMs could provide new opportunities to study and devise screening‐compatible assays in a cell‐like environment to discover GQ binders of clinical potential.     

Tailoring the growth of p-6P nanofibres using ultrathin Au layers: an organic-metal-dielectric model system

The influence of ultrathin Au cluster films on the growth of para-hexaphenyl (p-6P) fibres is investigated. Whereas p-6P at elevated temperatures forms long, mutually parallel fibres on plain mica, these fibres become shorter but taller on Au covered mica, up to a Au film thickness of approximately 8?nm. The degree to which fibres are mutually parallel decreases with increasing Au thickness. For thicker Au films the length of the fibres increases again, and their morphology changes from flat to faceted; for Au film thicknesses above 20?nm, fibre networks are formed. The spectroscopic properties of the fibres are not modified by the Au layer, enabling independent control of the fibre morphology by means of the intermediate metallic layer.