Mixing in processing of thermoplastics by extrusion

Translated from Khimicheskoe i Neftyanoe Mashinostroenie, No. 8, pp. 9–11, August, 1993.     

Reduction of loading effect by tungsten etchback in a magneticallyenhanced reactive ion etcher

The plug loading effect occurring during the etchback of tungsten was investigated in a magnetically enhanced reactive ion etcher using SF ₆/Ar mixtures. It was found that while the plug loading effect is independent of varying SF₆/Ar flow rate ratio and magnetic field intensity, it is reduced under the condition of high selectivity of tungsten relative to TiN which was achieved at high chamber pressure and low RF power. It is proposed that when TiN is used as a glue layer, the W etch rate enhancement in the plug is mainly controlled by a local loading effect. Under the optimized etchback conditions the plug loss was successfully controlled without the tungsten residue left on severe topology     

The effects of plasma etching induced gate oxide degradation onMOSFET's 1/f noise

The effects of the plasma etching process induced gate oxide damages on device's low frequency noise behavior are investigated on MOSFET's fabricated with different field plate perimeter to gate area ratio antennas. Abnormal 1/f noise spectrum with a shoulder centered in the frequency range of 100 and to 1 kHz was frequently observed in small geometry devices, and it is attributable to a nonuniform distribution of oxide traps induced by plasma etching process     

The prospects of non-volatile phase-change RAM

Phase-change read-and-write memory (PRAM) is a promising memory that can solve the problems of conventional memory—scalability, read/write speed, and reliability. We will review the opportunities and technical challenges of PRAM. The most important challenge of PRAM is the reduction of the writing current. Various approaches to reduce the writing current will be reviewed and the prospects of PRAM are discussed.     

Complete joint weight enumerators and self-dual codes

We define the complete joint weight enumerator in genus g for codes over /spl Zopf//sub 2k/ and use it to study self-dual codes and their shadows. These weight enumerators are related to the theta series of the associated lattices and Siegel and Jacobi forms are formed from these series.     

Test Technology Technical Council Newsletter

This newsletter provides information on past and upcoming events related to the IEEE Computer Society's Test Technology Technical Council and the test community.     

Possibility of sewage and combined sewer overflow reuse with biological aerated filters.

The secondary effluent from municipal plants in Korea generally represents higher BOD with lower SS. Therefore, more soluble forms of organics and NH4-N need to be removed to improve its effluent for reuse. In this study reuse possibility of secondary effluent and CSO (combined sewer overflow) using BAF (biological aerated filter) was evaluated. The tertiary application with 1.2 h EBCT, SS, BOD and COD showed stable concentrations less than 1.3, 1.3 and 6.2 mg/L, respectively. Nitrogen could be nitrified even at 7 degrees suggesting BAF can be used for a water reuse method as well as an effective add-on facility in cold regions. However, BAF was not stable with CSO application at increased flow rates suggesting CSO must be equalised prior to application. Disinfection was necessary even during normal weather conditions.