Study of thermal effects and self-heating phenomena in planar power SOI MOS transistors

Heat removal problems, thermal effects, and self-heating phenomena occurring during operation of planar power SOI MOS transistors are considered. Using device-technological simulating methods, the transistor characteristics and safe operation range were studied. It was shown that limitations of the safe operation range are mostly associated with structure self-heating rather than with the parasitic bipolar transistor.     

Robust Distributed Source Coding

We consider a distributed source coding system in which several observations must be encoded separately and communicated to the decoder by using limited transmission rate. We introduce a robust distributed coding scheme which flexibly trades off between system robustness and compression efficiency. The optimality of this coding scheme is proved for various special cases.     

Cooling and Solidification of Melted Drops in an Immiscible Cooling Medium

The cooling and solidification of melted drops during their movement in an immiscible cooling medium is widely employed for granulation in the chemical industry, and a study of these processes to provides a basis for the design of the granulation tower height and the temperature of the cooling medium is reported. A physical model of the cooling and solidification of the drop is established and the numerical calculation is performed. The influences of the key factors in the solidification, i.e., Bi number, drop diameter, temperature of the cooling medium, etc. are presented. The cooling and solidification during wax granulation in a water‐cooling tower and during urea granulation in an air‐cooling tower (spraying tower) are described in detail. Characteristics of the solidification and temperature distribution within the particle at different times are shown. The model and calculations can be used for structure design of the granulation tower and optimization of the operation parameters.     

Evaluation of ProKappa

ProKappa is an expert system tool kit developed by IntelliCorp in C using X-Windows for graphical interface. The SUN 3 or 4 version costs $9995/£7000 and $2595/£1800 for the interactive C environment.
This review covers ProKappa version 1.1, installed on a colour SUN SPARC Station 1 with the minimum recommended values of 12 Mb of memory and 30 Mb of swap space.
IntelliCorp can be contacted in the USA at 1975 El Camino Real West, Mountain View, CA 94040-2216 (+1 (415) 965-5500) and in the UK at 10 Jewry Street, Winchester, Hampshire SO23 8RZ (+44 (0)962 735348).     

Fractoemission from Lead Zirconate-Titanate

We present measurements of the electron, positive ion, and photon emission accompanying the fracture in vacuum of poly-crystalline 95/5 lead zirconate-titanate. The intensities of the charged-particle components of this fractoemission are shown to depend strongly on the direction (relative to the direction of fracture) and magnitude of polarization. The most intense emission is observed when the fracture surfaces are perpendicular to the polarization direction. The emission intensity increases monotonically with polarization. These results are interpreted in terms of a model involving charge separation on the fracture surfaces leading to a microdischarge during fracture. Implications to the interpretation of triboluminesence effects are discussed.     

Effect of grain boundaries on isothermal solidification during transient liquid phase brazing

The influence of liquid penetration at grain boundary regions on the rate of advance of the solid-liquid interface during isothermal solidification of transient liquid phase (TLP) brazed nickel joints has been examined. The test samples used in this study were Ohno-cast nickel with a grain size of >4 mm and a fine-grained nickel with a grain size of around 40 μm. Both Ni-base materials had the same chemical composition. The rate of isothermal solidification was greater when fine-grained nickel was employed during TLP brazing using Ni-11 wt pct P filler metal at 1200 °C. Liquid penetration at grain boundaries accelerates the isothermal solidification process by increasing the effective solid-liquid interfacial area and increasing the rate of solute diffusion into the base material. An analysis of electron channeling patterns has confirmed that random high-angle boundaries have a greater influence on the rate of isothermal solidification than ordered boundaries including small-angle or twin boundaries. Formerly Visiting Scientist, Department of Metallurgy and Materials Science, University of Toronto. Formerly Postdoctoral Fellow, Department of Metallurgy and Materials Science, University of Toronto