Synthesis of biodegradable PU/PEGDA IPNs having micro-separated morphology for enhanced blood compatibility

Summary New biodegradable hydrophobic polyurethane (PU)/hydrophilic poly (ethylene glycol) diacrylate (PEGDA) IPN was simultaneously synthesized with changing the molecular weight of PEGDA to investigate the effect of crosslinking density on the degree of phase separation. PU was modified using biodegradable poly(-caprolactone)diol and the hydroxy group of PEG was substituted to crosslinkable acrylate group having double bond, which induce photo-polymerization. The sturucture of PEGDA was confirmed by NMR. Because the reaction rate of PEGDA was faster than that of PU, the continuous matrix of the micro-separated PU/PEGDA IPNs having amphiphilic character was made of hydrophilic PEGDA-rich phase. All IPNs have sea-island morphology resulting from the suppressed phase separation. The effect of the degree of phase separation on blood compatibility was investigated.     

Preparation and morphology of electrically conductive and transparent poly(vinylchloride)-polypyrrole composite films

Summary The chemical process of preparing poly(vinylchloride)-polypyrrole composite films with high electrical conductivity and transparency has been studied. Pyrrole has been diffused into the poly(vinylchloride) matrix in the swelling medium of n-hexane and acetone mixture. The oxidative polymerization of the diffused pyrrole in the binary solvent system of acetonitrile and methanol gives high conductivity of the polypyrrole as well as the good penetration of the oxidant into the PVC polymer matrix. The analytical testing of the composite film shows the formation of homogeneous mixture of polypyrrole and poly(vinylchloride) conductive layer within the 1.0m of thickness on the film surface. The transparency of the composite film showed about 50–60% at 500 nm. The electrical conductivity of the composite was about 20 s/cm.     

Corrosion resistance of austenitic stainless steel separator for molten carbonate fuel cell

STS310S and SC-STS310S (simultaneously co-deposited chromium and aluminum onto 310S austenitic stainless steel substrate by pack-cementation process) were used as separator materials on the cathode side of a molten carbonate fuel cell. With the STS310S, corrosion proceeded via three steps; a formation step of unstable corrosion product, a protection step against corrosion until breakaway, and an advance step of corrosion after breakaway. The final corrosion product was LiFeO₂ and the loss of mass was 6.5 mg/cm² after a corrosion test of 480 hr at 650°C. The SC-STS310S showed more effective corrosion resistance, however, than did common STS310S. There was especially no corrosion loss on the SC-STS310S after the 480 hr corrosion test. It is anticipated that it will be very useful as an alternative separator on the cathode side off the MCFC in the future.     

Perceived Visual Complexity and Visual Search Performance of Automotive Instrument Cluster: A Quantitative Measurement Study

Advancements in technology have spurred the development of new in-vehicle applications. Drivers are faced with different driving contexts due to an increase in the number of devices that provide a wealth of diverse information. However, such a scenario can cause drivers to become distracted. Therefore, research on how the presentation of visual information can affect drivers’ performance is important. In this study, an analysis of quantifiable measurements that affect drivers’ perception of visual complexity and visual search performance was conducted. A questionnaire was administered to assess subjective perception of visual complexity, and a user experiment using eye tracking was designed to explore participants’ visual search performance. The results of subjective visual complexity perception and visual search performance suggested that some objective measurement variables were significantly related only to perceived visual complexity, whereas others affected both subjective and behavioral measurements. Thus it is possible to predict which quantifiable measurement variables affect subjective perception of visual complexity and which affect visual search performance. Therefore, this study allows understanding and explaining of perception of visual complexity by quantifiable measurements and the different ways by which these measurements affect visual search performance.     

Collapse-free thermal bonding technique for large area microchambers in plastic lab-on-a-chip applications

Bonding is an essential step to form microchannels or microchambers in lab-on-a-chip applications. In this paper, we present a novel plastic thermal bonding technique to seal and form large area microchambers (planar characteristic width and length on the order of 1 mm and characteristic thickness on the order of 10–100 μm) without collapse by introducing a holed pressure equalizing plate (HPEP) that includes holes of the same size and shape as the microchambers. To demonstrate the proposed technique, two types of large area microchambers [(1) 20 × 10 mm and 40 μm thick and (2) 12 × 2.5 mm and 120 μm thick] with microchannels were designed and replicated on plastic substrates by means of hot embossing and injection molding processes with prepared two nickel mold inserts. The replicated large area microchambers as well as the microchannels in the plastic lab-on-a-chip were successfully sealed (i.e., no leakage) and formed without any collapse by the proposed thermal bonding technique with the help of the HPEP.     

Preparation of PbTiO3 thin films using an alkoxide-alkanolamine sol-gel system

The stable range of PbTiO₃ sol and the processing conditions of uniform thin films were investigated using a solution of titanium isopropoxide, three kinds of alkanolamines (monoethanolamine, diethanolamine, triethanolamine), lead acetate trihydrate and isopropanol. Depending on the sol state with various alkanolamine/alkoxide molar ratios, diethanolamine (DEA) was very effective in preparing uniform and dense oxide films through room-temperature reaction, owing to its superior stability during the hydrolysis and condensation reaction. Perovskite PbTiO₃ thin films were obtained on oxidized silicon wafer above 550 °C and completely pure films were obtained at 650 °C using DEA as a complexing agent. The dielectric constant and loss tangent of these thin films fired at 650 °C for 30 min were found to be 240 and 0.01 at 1 kHz, respectively.     

Designing Metallic and Insulating Nanocrystal Heterostructures to Fabricate Highly Sensitive and Solution Processed Strain Gauges for Wearable Sensors

All‐solution processed, high‐performance wearable strain sensors are demonstrated using heterostructure nanocrystal (NC) solids. By incorporating insulating artificial atoms of CdSe quantum dot NCs into metallic artificial atoms of Au NC thin film matrix, metal–insulator heterostructures are designed. This hybrid structure results in a shift close to the percolation threshold, modifying the charge transport mechanism and enhancing sensitivity in accordance with the site percolation theory. The number of electrical pathways is also manipulated by creating nanocracks to further increase its sensitivity, inspired from the bond percolation theory. The combination of the two strategies achieves gauge factor up to 5045, the highest sensitivity recorded among NC‐based strain gauges. These strain sensors show high reliability, durability, frequency stability, and negligible hysteresis. The fundamental charge transport behavior of these NC solids is investigated and the combined site and bond percolation theory is developed to illuminate the origin of their enhanced sensitivity. Finally, all NC‐based and solution‐processed strain gauge sensor arrays are fabricated, which effectively measure the motion of each finger joint, the pulse of heart rate, and the movement of vocal cords of human. This work provides a pathway for designing low‐cost and high‐performance electronic skin or wearable devices.     

Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress

The electromigration behavior of low-melting temperature Sn-58Bi (in wt%) solder joints was investigated with a high current density between 3 and 4.5 × 10³ A/cm² between 80 and 110 °C. In order to analyze the impact of various substrate metallizations on the electromigration performance of the Sn-58Bi joint, we used representative substrate metallizations including electroless nickel immersion gold (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG), and organic solderability preservatives (OSP). As the applied current density increased, the time to failure (TTF) for electromigration decreased regardless of the temperature or substrate metallizations. In addition, the TTF slightly decreased with increasing temperature. The substrate metallization significantly affected the TTF for the electromigration behavior of the Sn-58Bi solder joints. The substrate metallizations for electromigration performance of the Sn-58Bi solder are ranked in the following order: OSP-Cu, ENEPIG, and ENIG. Due to the polarity effect, current stressing enhanced the fast growth of intermetallic compounds (IMCs) at the anode interface. Cracks occurred at the Ni₃Sn₄ + Ni₃P IMC/Cu interfaces on the cathode sides in the Sn-58Bi/ENIG joint and the Sn-58Bi/ENEPIG joint; this was caused by the complete consumption of the Ni(P) layer. Alternatively, failure occurred via deformation of the bulk solder in the Sn-58Bi/OSP-Cu joint. The experimental results confirmed that the electromigration reliability of the Sn-58Bi/OSP-Cu joint was superior to those of the Sn-58Bi/ENIG or Sn-58Bi/ENEPIG joints.