VLSI scaling methods and low power CMOS buffer circuit

Device scaling is an important part of the very large scale integration(VLSI) design to boost up the success path of VLSI industry, which results in denser and faster integration of the devices. As technology node moves towards the very deep submicron region, leakage current and circuit reliability become the key issues. Both are increasing with the new technology generation and affecting the performance of the overall logic circuit. The VLSI designers must keep the balance in power dissipation and the circuit’s performance with scaling of the devices. In this paper, different scaling methods are studied first. These scaling methods are used to identify the effects of those scaling methods on the power dissipation and propagation delay of the CMOS buffer circuit. For mitigating the power dissipation in scaled devices, we have proposed a reliable leakage reduction low power transmission gate(LPTG) approach and tested it on complementary metal oxide semiconductor(CMOS) buffer circuit. All simulation results are taken on HSPICE tool with Berkeley predictive technology model(BPTM) BSIM4 bulk CMOS files. The LPTG CMOS buffer reduces 95.16% power dissipation with 84.20% improvement in figure of merit at 32 nm technology node. Various process, voltage and temperature variations are analyzed for proving the robustness of the proposed approach. Leakage current uncertainty decreases from 0.91 to 0.43 in the CMOS buffer circuit that causes large circuit reliability.     

Solidification of thermoviscoelastic melts. Part 3: Effects of mold surface temperature differences on warpage and residual stresses

The solidification of a molten layer of amorphous thermoplastic between cooled parallel plates is used to model the mechanics of part warpage in the injection-molding process. Flow effects are neglected, and a thermorheologically simple thermoviscoelastic material model is assumed. The model allows material to be added to fill the space created by the pressure applied during solidification so that this model can be used to assess packing-pressure effects in injection molding. Parametric results are presented on the effects of the mold temperatures and the packing pressure—the pressure applied during solidification to counteract the effects of volumetric shrinkage of the thermoplastic—on the in-plane and through-thickness shrinkages, on warpage, and on residual stresses in plaque-like geometries. The packing pressure is shown to have a significant effect on part warpage. While the results are presented in terms of normalized variables based on the properties of bisphenol-A polycarbonate, they can be interpreted for other amorphous thermoplastics, such as modified polyphenylene oxide, polyetherimide, and acrylonitrile-butadiene-styrene.     

Microwave joining and repair of composite materials

A novel technique that uses microwave power for joining and repair of thermoplastic and thermoset composites and ceramics is discussed. Enhanced microwave heating resulting from the use of conducting polymers and chiral microinclusions shows considerable promise for joining and repair of composites. The method is attractive because it produces clean and reliable interfacial joints, it is fast, it does not entail alteration of the bulk materials, and it does not result in volumetric heating. System details, including magnetron, waveguides, circulators, coupling iris, and the applicator for delivering microwave power, are described. Material requirements for the efficient absorption of microwave power are discussed. Microwave heating can be increased by doping the components to be joined or by the use of microwave adhesive films. Recent developments in electromagnetic chirality for microwave absorption are introduced and the design of composite materials for enhanced absorptivity is discussed. Results are presented for the welding and repair of thermoplastic, thermoset, and ceramic components.     

Investigation of NPB Analogs That Target Phosphorylation of BAD-Ser99 in Human Mammary Carcinoma Cells

The design and development of a small molecule named NPB [3-{(4(2,3-dichlorophenyl)piperazin-1-yl}{2-hydroxyphenyl)methyl}-N-cyclopentylbenzamide], which specifically inhibited the phosphorylation of BAD at Ser99 in human carcinoma cells has been previously reported. Herein, the synthesis, characterization, and effect on cancer cell viability of NPB analogs, and the single-crystal X-ray crystallographic studies of an example compound (4r), which was grown via slow-solvent evaporation technique is reported. Screening for loss of viability in mammary carcinoma cells revealed that compounds such as 2[(4(2,3-dichlorophenyl)piperazin-1-yl][naphthalen-1-yl]methyl)phenol (4e), 5[(4(2,3-dichlorophenyl)piperazin-1-yl][2-hydroxyphenyl)methyl)uran-2-carbaldehyde (4f), 3[(2-hydroxyphenyl][4(p-tolyl)piperazin-1-yl)methyl)benzaldehyde (4i), and NPB inhibited the viability of MCF-7 cells with IC₅₀ values of 5.90, 3.11, 7.68, and 6.5 µM, respectively. The loss of cell viability was enhanced by the NPB analogs synthesized by adding newer rings such as naphthalene and furan-2-carbaldehyde in place of N-cyclopentyl-benzamide of NPB. Furthermore, these compounds decreased Ser99 phosphorylation of hBAD. Additional in silico density functional theory calculations suggested possibilities for other analogs of NPB that may be more suitable for further development.     

Formation of acrylamide in microwave-roasted sorghum and associated dietary risk

The effect of microwave roasting parameters (300, 450 and 600 W; 5, 10 and 15 min) on acrylamide content in sorghum grain was determined using High Pressure Liquid Chromatography (HPLC)-photo diode array (PDA) detector coupled with C-18 column. Samples roasted at 300 and 450 W did not possess acrylamide, whereas 600 W (15 min) favoured formation of 2740.19 µg/kg of acrylamide, levels far exceeding the defined European Union (EU) limits. The chronic daily intake (CDI) for acrylamide through consumption of such grain flour was 3.25–9.5-fold higher to Joint FAO/WHO Expert Committee on Food Additives (JECFA) defined high exposure limits. The margin of exposure (MOE) values ranged from 4.3 to 12.76 and from 11.07 to 32.27 for neoplastic and neurological effects, respectively, demonstrating high exposure and serious health concerns associated with dietary intake of this toxicant. This study assesses the risk for the Indian population and highlights the importance of optimising process parameters for food product to minimise such exposure risks.     

Waste Eggshell-Derived Calcium Oxide and Nanohydroxyapatite Biomaterials for the Preparation of LLDPE Polymer Nanocomposite and Their Thermomechanical Study

Waste eggshells were utilized to make calcium oxide (E-CaO) and hydroxyapatite (E-HAP). E-CaO obtained by heat treatment to eggshells was utilized for the synthesis of E-HAP. Melt compounding of E-CaO/E-HAP was performed with linear low-density polyethylene (LLDPE) on a Brabender Plastograph and ground the obtained formulation for injection molding. Addition of E-CaO/E-HAP in the LLDPE significantly enhanced the flame retardant ability and thermal stability of resultant composites. In the comparative study, E-HAP nanopowder-containing polymer composite showed increment in thermal and mechanical properties than the composite prepared using E-CaO.     

Analysis of the Quaternary Structure of Hemoglobin Beckman Variant and Molecular Interpretation of Its Functional Abnormality: A Mass‐Spectrometry‐Based Approach

Electrostatic attraction between α and β globin chains holds the subunits together in a tetrameric human hemoglobin molecule (α₂β₂). Compared to normal globin chains, the affinity of a mutant chain to its partner globin might be different in genetic variants of hemoglobin. This leads to an unequal abundance of normal and variant hemoglobin in heterozygous samples, even though the rates of synthesis of both the normal and variant chains are the same. The aforementioned affinities across various globin chains might be assessed by quantification of the different forms of the tetramers present in a variant hemoglobin sample. In the present study, by exploiting mass differences between globin chains, differently populated hemoglobin tetramers present in hemoglobin (Hb) Beckman, a β variant (βA135D), were structurally characterized. The relative populations of dissymmetric tetramers (α₂β₂, α₂ββ^V, and α₂β^V₂) indicated that both β and β^V have different affinities towards the α globin chain. Conformational dynamics analyzed from hydrogen/deuterium exchange kinetics of the three peptide fragments of Hb Beckman in its oxy state displayed molecular insight into its functional abnormality. However, in comparison to normal hemoglobin (α₂β₂), the point mutation did not show any change in the collision cross‐sections of the functionally active conformers of the variant hemoglobin molecules (α₂ββ^V and α₂β^V₂).     

High‐performance thermosets with tailored properties derived from methacrylated eugenol and epoxy‐based vinyl ester

A renewable chemical, eugenol, is methacrylated to produce methacrylated eugenol (ME) employing the Steglich esterification reaction without any solvent. The resulting ME is used as a low‐viscosity co‐monomer to replace styrene in a commercial epoxy‐based vinyl ester resin (VE). The volatility and viscosity of ME and styrene are compared. The effect of ME loading and temperature on the viscosity of the VE–ME resin is investigated. Moreover, the thermomechanical properties, curing extent and thermal stability of the fully cured VE–ME thermosets are systematically examined. The results indicate that ME is a monomer with low volatility and low viscosity, and therefore the incorporation of ME monomer in VE resins allows significant reduction of viscosity. Moreover, the viscosity of the VE–ME resin can be tailored by adjusting the ME loadings and processing temperature to meet commercial liquid molding technology requirements. The glass transition temperatures of VE–ME thermosets range from 139 to 199 °C. In addition, more than 95% of the monomer is incorporated and fixed in the crosslinked network structure of VE–ME thermosets. Overall, the developed ME monomer exhibits promising potential for replacing styrene as an effective low‐viscosity co‐monomer. The VE–ME resins show great advantages for use in polymer matrices for high‐performance fiber‐reinforced composites. This work is of great significance to the vinyl ester industry by providing detailed experimental support. © 2018 Society of Chemical Industry     

Adhesion and Debonding of Soft Elastic Films on Rough and Patterned Surfaces

With the help of simulations based on energy minimization, we have studied the effect of roughness of a rigid contactor with sinusoidal and step patterns on the adhesion-debonding cycle of a soft thin elastic film. The surface instability engendered by attractive forces between the contactor and the film produces a regularly spaced array of columns in the bonding phase. The inter-column spacing is governed largely by periodicity of the contactor pattern. Decreased periodicity of the pattern favors intermittent collapse of columns rather than a continuous peeling of contact zones. An increase in the amplitude of roughness decreases the maximum force required for debonding and increases the snap-off distance. The net effect results in a reduced work for debonding. Introduction of noise and increased step-size in simulations decreases the pull-off force and the snap-off distance, as in the case of a smooth contactor. Finally the study reveals that a patterned contactor can be used as a potential template in the patterning of soft interfaces.