Observation and computer simulation of multicomponent chemical short-range order （MCSRO） for the bulk metallic glasses

The atomic configuration of chemical short-range order (CSRO) for the Zr-base metallic glasses was investigated by using nano-diffraction and high resolution transmission electronic microscopy (HRTEM) technology with a beam size of 0.5 rim. It is illustrated that the pattern of atomic configuration of CSRO might have various compound counterparts because of the chemical interaction of bonding atoms. Some atomic configuration of MCSRO is similar to the icosahedral structure with 10-fold symmetry of very weak spots. In deed, the nano-beam technology could clearly detect the evolution of atomic configuration in nanometer scale during the transformation from the metallic melt to the primary crystallization. The local atomic configuration of CSRO is also investigated by molecular dynamics simulation (MD) for the Zr2Ni compound in a wider temperature range. The CSRO in the melt could be pictorially demonstrated as distorted coordination polyhedron of the compound structure and/or the structure similar to cubo-octahedron analogs. The MD simulation illustrates that the atomic packing of long-range order disappears just above the melting point, but the chemical interaction of bonding atoms still exists that leads to form the various CSRO with the atomic configuration similar to stable or metastable unit cell of Zr2Ni compound. The icosahedral polyhedron became more abundance as the overheating temperature was raised.     

Strain rate sensitivity of tensile properties in high Nb containing TiAl alloys

The effect of strain rate on the yield strength of high Nb containing TiAl alloy was studied. The results show that the strain rate sensitivity varies with the test temperature, and the yield strength is not sensitive to the strain rate at room temperature but significantly sensitive to the strain rate at high temperature. An increase of the strain rate or a decrease of the temperature results in an obvious change of fracture mode. It is found that the strain rate sensitivity of this alloy varying with temperature is due to the dislocation climb generated at high temperature.     

The Densification of Cu／Ti System by Spark Plasma Sintering

In order to unclose the dynamics of SPS densification, a special sintering sample (Cul Ti wires compact) was designed. Characters of the shrinkage rates during sintering process and mierostructures of products fabrieated by the spark plasma sintering( SPS ) and hot-press .sintering were investigated. The experimental results reveal that a higher temperature field is formed at the connected area and conductive net of the compact. These high-temperature parts deformed more easily than other parts, which is believed to be the main cause of SPS fast densification, according to a hard-core and soft-hell material model.     

大洋多金属结核的非冶金加工应用

基于大洋多金属结核具有的特殊物理化学性质,本文重点介绍国内外开展的大洋多金属结核非冶金加工利用的研究情况。     

氮化硅晶须的研究现状

介绍了晶须的生长机理、氮化硅晶须的制备方法以及影响其生长的因素。阐述了氮化硅晶须增强复合材料的现状,指出加强晶须的基础研究,改进制备技术和降低成本是今后的发展方向。     

纳米TiO2改性内墙涂料研究

主要研究了纳米TiO2的加入对内墙涂料性能的影响。结果表明,加入2%纳米TiO2能极大地提高涂料降解甲醛的能力,但加入4%纳米TiO2反而使涂料的性能变差。涂料的常规性能研究也表明,加入少于2%的纳米TiO2对涂料的常规性能会有极大的提高。     

氧气在浮法玻璃生产中的应用

介绍了国内某玻璃厂浮法玻璃熔窑使用氧气助燃的一次尝试,简介了其中底烧法的使用方法、过程和效果,列举了有待改进的内容。     

Effects of Cu,Bi, and In on microstructure and tensile properties of Sn-Ag-X(Cu,Bi, In) solders

Effects of minor additions of Cu, Bi, and In on microstructure, melting temperature, and tensile properties of Sn-Ag-based lead-free solders were investigated. It was found that the intermetallic compounds (IMCs) Ag₂In and Cu₆Sn₅ are formed in In- and Cu-containing solders, respectively. At low concentration, Bi dissolved in the Sn matrix and tended to precipitate pure Bi particles at the solubility limit of 4 wt pct Bi. The formation of large Ag₃Sn precipitates from the solder matrix was suppressed when alloying bismuth into the Sn-Ag alloy. The Bi addition resulted in a significant linear increase of the ultimate tensile strength (UTS) of solders, which is attributed to a solid-solution hardening mechanism. Solder strengthening due to In and Cu is less pronounced and attributed to a dispersion strengthening mechanism. The additions of Cu, Bi, and In all depressed the melting temperatures of Sn-Ag-based solders; however, In is the most effective one.     

Characterization of (Y,Gd) BxV1-xO4-x:Eu Phosphor Prepared by Coprecipitation Reaction

White body-color (Y, Gd)BxV1- xO4-x :Eu3 phosphors were prepared by coprecipitation reaction. Under VUV excitation at 147 nm, the red emission colorimetric purity of (Y, Gd)BxV1- xO4-x :Eu3 phosphor is much better than that of commercial PDP (plasma display panels) phosphor (Y, Gd)BO3:Eu3 . But its relative emission intensity is only about 90% of the commercial phosphor.     

Research on Poly （Styrene-Crylicacid）-Suported Neodymium Complex Catalytic Copolymerization of Styrene and 4-Vinylpyridine

Research on Poly(Styrene-Crylicacid)-Suported Neodymium Complex Catalytic Copolymerization of Styrene and 4-Vinylpyridine