Charge‐Generating Mode Control in High‐Performance Transparent Flexible Piezoelectric Nanogenerators

In this work, we demonstrate the mode transition of charge generation between direct‐current (DC) and alternating‐current (AC) from transparent flexible (TF) piezoelectric nanogenerators (NGs), which is dependent solely on the morphology of zinc oxide (ZnO) nanorods without any use of an AC/DC converter. Tilted ZnO nanorods grown on a relatively low‐density seed layer generate DC‐type piezoelectric charges under a pushing load, whereas vertically aligned ZnO nanorods on a relatively high‐density seed layer create AC‐type charge generation. The mechanism for the geometry‐induced mode transition is proposed and characterized. We also examine the output performance of TF‐NGs which employ an indium zinc tin oxide (IZTO) film as a TF electrode. It is demonstrated that an IZTO film has improved electrical, optical, and mechanical properties, in comparison with an indium tin oxide (ITO) film. Enhanced output charge generation is observed from IZTO‐based TF‐NGs when TF‐NGs composed of only ITO electrodes are compared. This is attributed to the higher Schottky barrier and the lower series resistance of the IZTO‐based TF‐NGs. Thus, by using IZTO, we can expect TF‐NGs with superior mechanical durability and power generating performance.     

High‐Performance Micro‐Solid Oxide Fuel Cells Fabricated on Nanoporous Anodic Aluminum Oxide Templates

Micro‐solid oxide fuel cells (μ‐SOFCs) are fabricated on nanoporous anodic aluminum oxide (AAO) templates with a cell structure composed of a 600‐nm‐thick AAO free‐standing membrane embedded on a Si substrate, sputter‐deposited Pt electrodes (cathode and anode) and an yttria‐stabilized zirconia (YSZ) electrolyte deposited by pulsed laser deposition (PLD). Initially, the open circuit voltages (OCVs) of the AAO‐supported μ‐SOFCs are in the range of 0.05 V to 0.78 V, which is much lower than the ideal value, depending on the average pore size of the AAO template and the thickness of the YSZ electrolyte. Transmission electron microscopy (TEM) analysis reveals the formation of pinholes in the electrolyte layer that originate from the porous nature of the underlying AAO membrane. In order to clog these pinholes, a 20‐nm thick Al₂O₃ layer is deposited by atomic layer deposition (ALD) on top of the 300‐nm thick YSZ layer and another 600‐nm thick YSZ layer is deposited after removing the top intermittent Al₂O₃ layer. Fuel cell devices fabricated in this way manifest OCVs of 1.02 V, and a maximum power density of 350 mW cm^?2 at 500 °C.     

Multiuser OFDM Using Cyclic Time Shift for Wireless Uplink Broadcasting

A combination of orthogonal frequency division multiplexing (OFDM) with frequency-division multiple access (FDMA) called orthogonal frequency-division multiple access (OFDMA) is regarded as a promising solution for improving the performance of interactive wireless broadcasting systems. This paper presents our investigation into reducing the multiple access interference (MAI) introduced by symbol timing misalignment in an OFDMA uplink system. To combat the MAI, we provide a new OFDMA symbol frame employing a simple symbol repetition coupled with a cyclic time shift for typical OFDMA uplink scenarios. Theoretical analysis and computer simulations are used to assess the performance of the proposed OFDMA uplink system. It is found that this scheme can decrease the probability of destroying the orthogonality among the users and provide the MAI-free reception.     

Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of Joints

Chip to chip bonding techniques using Cu bumps capped with thin solder layers have been frequently applied to 3D chip stacking technology. We studied the effect of joint microstructure on shear strength. Joints were formed by joining Sn/Cu bumps on a Si die and Sn/Cu layers on another Si die at 245–330°C using a thermo-compression bonder. Three different types of microstructures were fabricated in the joints by controlling the bonding temperature and time, (1) a Sn-rich phase with a Cu₆Sn₅ phase at the Cu interfaces, (2) a Cu₆Sn₅ phase in the interior with a Cu₃Sn phase at the Cu interfaces, and (3) one single Cu₃Sn phase throughout the whole joint. The joint having a single Cu₃Sn phase had the highest shear strength. Specimens were aged up to 2000 h at 150°C and 180°C. During aging, the microstructures of all joints were transformed in a single Cu₃Sn phase. The shear strength of the joints was very sensitive to the formation of Cu₃Sn and microvoids. Microvoids formed in the solder joints with a Cu₆Sn₅ phase with and without a Sn-rich phase during aging and decreased the shear strength of the joints. Conversely, aging did not induce the formation of microvoids in the joints which originally had only a Cu₃Sn phase and the shear strength was not decreased.     

Predictive model of a reduced surface field p-LDMOSFET using neural network

Due to complex dynamics, it has been extremely difficult to model high power devices. A predictive model is constructed by using a backpropagation neural network (BPNN). The BPNN was applied to predict electrical characteristics of a reduced surface field p-channel lateral double-diffused MOSFET. Drain–source currents for applied drain–source voltages were measured with a HP4156A. Prediction performance of BPNN model was optimized with variations in training factors. With respect to the reference models, the optimized models demonstrated considerably improved predictions. Model predictions were highly consistent with actual measurements. Further improvement was obtained by constructing a modular network comprising multiple BPNNs.     

Room‐Temperature Metallic Fusion‐Induced Layer‐by‐Layer Assembly for Highly Flexible Electrode Applications

To fabricate flexible electrodes, conventional silver (Ag) nanomaterials have been deposited onto flexible substrates, but the formed electrodes display limited electrical conductivity due to residual bulky organic ligands, and thus postsintering processes are required to improve the electrical conductivity. Herein, an entirely different approach is introduced to produce highly flexible electrodes with bulk metal–like electrical conductivity: the room‐temperature metallic fusion of multilayered silver nanoparticles (NPs). Synthesized tetraoctylammonium thiosulfate (TOAS)‐stabilized Ag NPs are deposited onto flexible substrates by layer‐by‐layer assembly involving a perfect ligand‐exchange reaction between bulky TOAS ligands and small tris(2‐aminoethyl)amine linkers. The introduced small linkers substantially reduce the separation distance between neighboring Ag NPs. This shortened interparticle distance, combined with the low cohesive energy of Ag NPs, strongly induces metallic fusion between the close‐packed Ag NPs at room temperature without additional treatments, resulting in a high electrical conductivity of ≈1.60 × 10⁵ S cm^?1 (bulk Ag: ≈6.30 × 10⁵ S cm^?1). Furthermore, depositing the TOAS–Ag NPs onto cellulose papers through this approach can convert the insulating substrates into highly flexible and conductive papers that can be used as 3D current collectors for energy‐storage devices.     

Regularised nonlinear blind signal separation using sparsely connected network

A nonlinear approach based on the Tikhonov regularised cost function is presented for blind signal separation of nonlinear mixtures. The proposed approach uses a multilayer perceptron as the nonlinear demixer and combines both information theoretic learning and structural complexity learning into a single framework. It is shown that this approach can be jointly used to extract independent components while constraining the overall perceptron network to be as sparse as possible. The update algorithm for the nonlinear demixer is subsequently derived using the new cost function. Sparseness in the network connection is utilised to determine the total number of layers required in the multilayer perceptron and to prevent the nonlinear demixer from outputting arbitrary independent components. Experiments are meticulously conducted to study the performance of the new approach and the outcomes of these studies are critically assessed for performance comparison with existing methods.     

40 GHz Vertical Transition with a Dual‐Mode Cavity for a Low‐Temperature Co‐fired Ceramic Transceiver Module

A new vertical transition between a substrate integrated waveguide in a low‐temperature co‐fired ceramic substrate and an air‐filled standard waveguide is proposed in this paper. A rectangular cavity resonator with closely spaced metallic vias is designed to connect the substrate integrated waveguide to the standard air‐filled waveguide. Physical characteristics of an air‐filled WR‐22 to WR‐22 transition are compared with those of the proposed transition. Simulation and experiment demonstrate that the proposed transition shows a ?1.3 dB insertion loss and 6.2 GHz bandwidth with a 10 dB return loss for the back‐to‐back module. A 40 GHz low‐temperature co‐fired ceramic module with the proposed vertical transition is also implemented. The implemented module is very compact, measuring 57 mm × 28 mm × 3.3 mm.     

Soluble processed low-voltage and high efficiency blue phosphorescent organic light-emitting devices using small molecule host systems

We report low voltage driving and highly efficient blue phosphorescence organic light emitting diodes (PHOLEDs) fabricated by soluble process. A soluble small molecule mixed host system consisting of hole transporting 4,4’,4’’ tris(N-carbazolyl)triphenylamine (TCTA) and bipolar carrier transporting 2,6-bis(3-(carbazol-9-yl)phenyl)pyridine (26DCzPPy) exhibits high solubility with smooth surface properties. Moreover, this small molecule host shows the smoothest morphological property similar to a vacuum deposited amorphous film. A low driving voltage of 5.4 V at 1000 cd/m² and maximum external quantum efficiency 14.6% obtained in the solution processed blue PHOLEDs are useful for large area low cost manufacturing.