Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards

Multi-layered printed circuit boards (PCBs) contain a multi-layered structure that is suitable for high-speed and high-frequency applications. Hence, they are used extensively in electronic packaging assemblies for high-density applications. However, numerous composite parts and complex material properties of multi-layer PCBs complicate the reliability simulation of PCB model. This paper deals with a finite element analysis intended to describe numerically the behavior of multi-layered multi-materials PCB model (combination of metallic and composite plies) in the drop-impact performance. Through the comparison of physical drop test results, the fully multi-layered model illustrates higher accuracy if compared with that of the traditional simplified isotropic model and orthotropic model. The effects of material properties for the multi-layer PCB under drop-impact shock have also been investigated.     

Microstructure evolution of the Sn–Ag–y%Cu interconnect

The lead free Sn–Ag–y%Cu (y = 0.0, 0.5, 1.0 and 2.0) interconnect interfacial microstructures and the microstructure evolution under thermal treatment (isothermal aging, 150 °C/1000 h) were studied in detail by using surface microetching microscopy and cross section microscopy. The corresponding mechanical and reliability behaviors were evaluated by performing shear test and fracture mode analysis before and after the thermal treatment. The results indicate: (i) The interconnects could have different microstructures and intermetallic compound (IMC), depending on the Cu content. The Cu–Sn IMC could have microstructures that were clusters or protrusion-like, Augustine grass leaf-like, scissor-like, tweezers-like, etc. (ii) Ag₃Sn IMCs were not observed at time zero for any interconnect groups, but they occurred after the aging for all groups. The Ag₃Sn IMC could have different microstructures, again depending on Cu content. For low Cu content, the Ag₃Sn IMCs were granules or nodules; for higher Cu content, Ag₃Sn IMCs were plate-like. (iii) The growth of Ag₃Sn plates was promoted by the growth of Cu–Sn IMCs, but indirectly linked to the Cu content. (iv) High Cu content (1.0 wt% and higher) could degrade the mechanical and reliability performances of the LF interconnect by providing a brittle joint, which was mainly achieved through the substantial growth of Cu–Sn IMCs and Ag₃Sn plates.     

Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition

Wire ball open failure at the interface of the gold wire and bonding pad of a multi-stack package (MSP) under high temperature storage (HTS) condition of 150 °C is studied. Failure analysis using FIB-SEM was conducted by in-plane moiré interferometry and FEA to clarify the failure mechanism. The ball open failure due to Kirkendall void that results from metal diffusion at high temperature was accelerated by the tensile stress imposed at the gold wire. The tensile stress developed at the gold wire when packages showing different warpage behaviours were stacked. Mechanical interaction between top and bottom packages caused unstable warpage, readily twisted and saddled. The wire came in contact with the photo-sensitive solder resist (PSR) dam because of the unstable warpage and this contact resulted in tensile stress at the gold wires. Solder flux residues reacted with the encapsulant, and as a result, the encapsulant of the top package adhered to the chip of the bottom package, and this adherence created additional tensile stress at the gold wires. To reduce the tensile stress at the wires, the PSR dam was removed, loop shape was altered from 45° to 90°, water soluble flux was applied, and cleaning process was added. HTS reliability was significantly improved and guaranteed after reducing the tensile stress at the wires.     

A Continuum Mechanics Approach for Crack Initiation and Crack Growth Predictions

Very often, different approaches are used for crack initiation and crack growth predictions. The current article introduces a recently developed approach that can be used for the predictions of both crack initiation and crack propagation. A basic assumption is that both crack nucleation and crack growth are governed by the same fatigue damage mechanisms and a single fatigue damage criterion can model both stages. A rule is that any material point fails to form a fresh crack if the total accumulated fatigue damage reaches a limit. For crack initiation predictions, the stresses and strains are obtained either directly from experiments or though a numerical analysis. For the prediction of crack growth, the approach consists of two steps. Elastic‐plastic stress analysis is conducted to obtain the detailed stress‐strain responses. A general fatigue criterion is used to predict fatigue crack growth. Compact specimens made of 1070 steel were experimentally tested under constant amplitude loading with different R‐ratios and the overloading influence. The capability of the approach to predict both crack initiation and the crack growth under these loading conditions was demonstrated by comparing the predictions with the experimental observations.     

Erosion-corrosion behavior of SiC particle-reinforced Al-Si alloy in NaOH slurry

The erosion-corrsosion behavior of SiC particle-reinforced Al-Si alloy has been studied in NaOH slurry simulating the mining atmosphere. The study was performed at two different sand concentrations, namely, 20 and 30 wt pct, and at a speed of 900 rpm. It is depicted that the wear rates decreased with increasing sand content, indicating that corrosion is the dominating mode of material removal. Further composite exhibited lower wear resistance than the laloys irrespective of the sand concentration. Scanning electron microscope (SEM) observations indicated the dissolution of dendrites of Al due to severe corrosion, leaving behind the network of Si. This ultimately results in the falling of Si particles from the matrix, leaving behind voids. This also results in the formation of voids around the SiC particles and leads to pullout of SiC particles from the matrix during the wear process.     

Shear Stress in Smooth Rectangular Open-Channel Flows

The average bed and sidewall shear stresses in smooth rectangular open-channel flows are determined after solving the continuity and momentum equations. The analysis shows that the shear stresses are function of three components: (1) gravitational; (2) secondary flows; and (3) interfacial shear stress. An analytical solution in terms of series expansion is obtained for the case of constant eddy viscosity without secondary currents. In comparison with laboratory measurements, it slightly overestimates the average bed shear stress measurements but underestimates the average sidewall shear stress by 17% when the width–depth ratio becomes large. A second approximation is formulated after introducing two empirical correction factors. The second approximation agrees very well (R2>0.99 and average relative error less than 6%) with experimental measurements over a wide range of width–depth ratios.     

超临界水的辐化反应研究

It is known that water exists in supercritical state above 374C and 22.1MPa, where gas phase and liquid phase are merged into a single phase. In the supercritical state, the density is controllable by changing the pressure. The properties such as the ionic product, solubilities of salts, gas and organic compounds, and dielectric constant of supercritical water are very different from those of water at room temperature.Recently much attention has been paid to supercritical water because many possible applications such as synthesis of functional materials, waste oxidation, and biomass conversion have been proposed by using above peculiar properties of the supercritical water. Thus, much intensive work is in progress all over the world. In addition, a new concept of nuclear reactor using the supercritical water as a coolant has been proposed, which has been chosen by DOE, USA as one of the forth generation nuclear reactors.Therefore, radiation chemistry study of the supercritical water seems inevitably important, yet little work has been done so far. We started radiation chemistry study of supercritieal water by pulse radiolysis and γ radiolysis five years ago. We have observed hydrated electrons as a first target. We also measured inorganic radicals, metal ions, organic radicals in high temperature and supercritical water by a pulse radiolysis technique. It was found that absorption spectra of the transient species are dependent on temperature. Some transients show red-shift, and some bands are blue-shifted, with increasing temperatures. A G-value evaluation of water decomposition products was also done by using methyl viologen as a scavenger and it was revealed that the values are significantly dependent not only on temperature but also on density in supercritical water. An extended study on the behavior of solvated eleclions in different alcohols at high temperatures and super critical state is also in progress.     

Ion-velocity dependence of high-density electronic excitation effects in oxide superconductors

Thin films of EuBa₂Cu₃O_y oxide superconductor have been irradiated with high energy heavy ions (80 MeV I, 125 MeV Br, 1.1 GeV Mo and 3.5 GeV Xe) having same electronic stopping power, S_e, in order to investigate the ion-velocity dependence of the electronic excitation effects under the constant electronic energy deposition. Although S_e is constant, a strong reduction in the irradiation effect on lattice parameter with increasing ion-velocity is observed in the low ion-velocity region around E  1 MeV/nucleon, while the ion-velocity dependence is hardly observed in the high ion-velocity region of E > 10 MeV/nucleon. If the observed velocity-dependence is assumed to be due to the change in the fraction of S_e contributing to defect creation, the fraction in the low velocity region (E  0.6 MeV/nucleon) is estimated to be about two times larger than that in the high velocity region (E > 10 MeV/nucleon).     

Study on Pb-Bi natural circulation phenomena

For the development of 45w%Pb-55w%Bi cooled direct contact boiling water small fast reactor (PBWFR), experimental study on Pb-Bi-water direct contact boiling two-phase flow has been performed using Pb-Bi-water direct contact boiling two-phase flow loop. For stable start-up of the boiling flow operation, Pb-Bi single-phase natural circulation must be realized in a Pb-Bi flow system of the loop before water injection into Pb-Bi. The Pb-Bi flow system consists of a four-heater-pin bundle, a chimney, an upper plenum, a level meter tank, a cooler, and an electromagnetic flow meter. A stable Pb-Bi single-phase natural circulation was realized in the range of flow rate from 1.5 l/min to 4.8 l/min by heating Pb-Bi in the heater-pin bundle with a power up to 7.7 kW. The inlet and outlet temperatures of the heater bundle were in the ranges from 243°C to 278°C, and from 251°C to 278°C, respectively. The natural circulation flow was simulated analytically using one-dimensional flow model including frictional, form and drag forces. Total hydraulic head through the loop were calculated from Pb-Bi densities at measured Pb-Bi temperatures in the loop. It was found that the calculated flow rate agreed well with the measured ones, which indicated the validity of the analytical models.