A VLSI CMOS delay oriented waveform converter for polyphasefrequency synthesizer

In this paper, we present a waveform converter implemented on a 0.25-μm CMOS technology using a dedicated design methodology (Delay Oriented Design). The circuit converts a square wave signal in both in-phase and quadrature-phase sinusoidal differential outputs. It also multiplies the frequency by seven. The output frequency range of this converter extends from 1.05 GHz up to 2.17 GHz. This converter is dedicated for the design of a third-generation mobile phone synthesizer using a double-loop architecture. For an output frequency of 2 GHz, the measured phase noise at 10-kHz offset from the carrier is -97 dBc/Hz. The circuit consumes 50 mW from a 2.5-V supply     

Modelling thermal degradation of composite materials

A one–dimensional, transient thermal degradation heat transfer model for the response of composite materials when exposed to fire is presented. The model can handle layers of different materials. Material properties are functions of temperature. The reaction can be specified using Arrhenius‐type parameters or by inputting a density–temperature relationship determined by any experimental technique such as thermogravimetric analysis. The model is validated against the experimental data presented in Boyer's 1984 dissertation. Overall, the model provides excellent agreement with the experimental data. It is shown that very little difference is found between results arrived at by Arrhenius kinetics and results obtained by specifying the easier to measure density–temperature relationship. From this it is concluded that this technique is a viable alternative to Arrhenius‐type models. Copyright © 2006 John Wiley & Sons, Ltd.     

Effect of the Treatment Temperature on the Surface Drying Set of Sugi Boxed-Heart Square Timber

High-temperature and controlled humidity treatment before drying has proven to be highly effective in preventing surface checks by forming drying sets in the surface layer of boxed-heart square timber in Japan. In this study, we examined the differences of the surface drying sets on sugi timber under different treatment temperatures. As a result, the width of a surface check after drying was much smaller at a treatment temperature of 120°C than at 80°C, and this indicates that the drying set with 120°C treatment would be larger than that with 80°C treatment. Also we observed that treatment temperature had a greater effect on the drying set as the drying advanced.     

High-temperature sensible-heat storage options

Alkali-metal carbonate salts meet the requirements for high-temperature solar central receiver systems, but because of their corrosiveness they present special problems in the design of storage tanks. In order to reduce corrosion and temperature sufficiently to retain strength in the storage containing wall, internal and thermal insulation is required. We present design options and operation criteria for sensible-heat, molten-salt storage with internal insulation.     

BioFET sensor for detection of albumin in urine

Characterisation of a BioFET for detection of albumin in a mixture of human urine is presented. To avoid electrolyte effect of the urine, it was measured in PBS (phosphate buffer saline) at a fixed pH after albumin binding. The drain current was modulated by the albumin bound to the anti-albumin immobilised on the gate surface of the BioFET. The current variation ratio was likely to be proportional to the concentration of the albumin in the range 50-250 mg/1. The results show the feasibility of the BioFET as a urinary albumin sensor.     

A comparative study on the effect of VUV radiation in plasma SiOx-coated polyimide and polypropylene films

Wettability of polyimide (PI) and polypropylene (PP) films have been improved using SiO_x-like thin layers deposited from a mixture of hexamethyldisiloxane (HMDSO) and oxygen in a microwave distributed electron cyclotron resonance plasma reactor. The films wettability evolution behaviors were evaluated through the results of contact angle measurements, atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). The plasma depositions of SiO_x thin layers in presence of VUV radiation induce a contact angle decrease to about 7° and 35° for PI and PP films, respectively. XPS data showed that such difference in wettability is attributed to the increase of hydrophilic group's proportion at the surface of coated PI films due to VUV irradiation. AFM images showed that the PI surface topography remains relatively smooth when coated in presence of VUV radiation. However, in the case of PP films, AFM images revealed the growth of irregular structure due to a substrate etching effect supported by VUV radiation. For polymers coated without VUV irradiation, the deconvolution of the C1s peaks showed a significant decrease of CO bonds for both PI and PP substrates.     

La doping effects on intergrowth Bi2WO6–Bi3TiNbO9 ferroelectrics

La doping effects on intergrowth Bi₂WO₆–Bi₃TiNbO₉ ferroelectric ceramics were studied by X-ray diffraction, electron probe microanalysis and dielectric spectroscopy. It was found that the La³⁺ distribution, ferroelectric phase transition and dielectric relaxation behavior are apparently affected by La doping. With increasing La³⁺ content, the site of dopant ion varies, the grain growth of Bi₅TiNbWO₁₅ is restrained, the Curie temperature is reduced and broadened. Furthermore, two dielectric relaxation loss peaks were observed both in temperature and frequency spectra. The calculated relaxation parameters revealed the oxygen vacancy related to the relaxation process.     

Mechanism of resistance microwelding of crossed fine nickel wires

Resistance microwelding of fine crossed nickel wires is of increasing industrial importance for electrical connections in downsized electronic and medical devices, but the understanding of the process is very limited. A study has, therefore, been performed to clarify the basic joining mechanisms, in which the effects of main process parameters (welding current and force and weld time) were investigated by detailed mechanical testing and metallurgical examinations. A bonding mechanism with main process stages (wire cold collapse, surface melting, molten-phase squeeze-out and, solid-state bonding) was proposed. A new technique has also been developed to optimize the process by initiating the welding current well before the electrode force has reached its full nominal value.