HDI工艺中取代涂树脂铜箔适合激光钻孔的半固化片

应用于HDI的激光钻孔半固化片的方法和其它常规材料相比具有的优缺点。     

移动卫星通信信道多普勒频移特性研究

在分析移动卫星通信信道特性的基础上，研究增加直射分量的多普勒实时频移和多径信号入射角范围及其变化对移动卫星通信信道多普勒频移特性的影响，推导了其不对称多普勒功率谱形式，对其进行了理论分析并给出了仿真结果。     

利用AutoCAD编制电气CAD

介绍如何利用AutoCAD开发适合电气专业使用的CAD系统，通过编制电气CAD的功能菜单，构造电气元件库，增强CAD的专业性能。编制电气CAD可以有效地统一本单位电气制图标准，方便电气工程师使用CAD进行专业设计。     

光电平台无角位移减振机构运动分析

分析了光电平台的工作环境和角振动对成像质量的影响，应用空间机构学原理和减振理论，设计了一种既具减振功能又能抑制角位移的无角位移减振机构。对减振机构的减振机理及运动特性进行了分析，并利用三维建模软件和MSC．Visual Nastran 4D仿真分析软件对该减振机构进行了三雏实体仿真分析，通过输出的仿真数据及曲线检验无角位移减振原理的正确性。     

通用串行总线(USB)接口芯片USBN9602的应用

简要介绍了通用串行总线USB的特点,对USB接口芯片USBN9602的内部结构、引脚、寄存器组作了详细的论述,并介绍了其应用。     

Computational analysis of thin coating layer failure using a cohesive model and gradient plasticity

Thermal barrier coatings (TBC) are widely used to prevent transient high temperature attack and allow components high durability. Due to strong inhomogeneous material properties the TBC failure often initiates near the interface between the brittle oxide layer and the ductile substrate. A reliable prediction of the TBC failure requires detailed information about the crack tip field and the consequent fracture criteria. In the present paper both cohesive model and gradient plasticity are used to simulate the failure process and to study interdependence of the interface stress distribution with the specific fracture energies. Computations confirm that combination of the two models is able to simulate different failure mechanisms in the TBC system. The computational model has the potential to give a realistic prediction of the crack propagation process.     

加强电站无功管理

加强电站无功管理，不但能改善供电质量，满足电网的要求，提高单位的经济效益，而且使设备的安全运行得到了保障。     

应用激光活化饵料藻种的研究

应用Nd:YAG激光(波长1.06μm,功率5w,照射时间0.5-3 min)和Ar+激光(波长488nm,功率70mw,照射时间5-15min)对长期保存的不同保存形式的塔胞藻(Pyramidomonassp.)进行辐照处理。研究了不同剂量激光辐照对藻体生长和叶绿素含量的影响。实验结果表明:照射剂量为60s的Nd:YAG激光及剂量为15min的Ar+激光对液体保存形式的藻种有较明显的促长效果,接种后这两种激光处理组的比生长速率分别较对照提高达53.33%和28.89%,叶绿素含量分别增加73.33%和65.69%。两种激光对液体保存藻种的活化效果均好于固体保存种。     

High resistivity measurement of SiC wafers using different techniques

To establish fast, nondestructive, and inexpensive methods for resistivity measurements of SiC wafers, different resistivity-measurement techniques were tested for characterization of semi-insulating SiC wafers, namely, the four-point probe method with removable graphite contacts, the van der Pauw method with annealed metal and diffused contacts, the current-voltage (I-V) technique, and the contactless resistivity-measurement method. Comparison of different techniques is presented. The resistivity values of the semi-insulating SiC wafer measured using different techniques agree fairly well. As a result, application of removable graphite contacts is proposed for fast and nondestructive resistivity measurement of SiC wafers using the four-point probe method. High-temperature van der Pauw and room-temperature Hall characterization for the tested semi-insulating SiC wafer was also obtained and reported in this work.