炼油厂全流程优化建模方法研究

为了克服使用线性规划和单处理单元非线性规划进行生产优化的内在缺点，在建立原油单元、催化裂化、催化重整和汽油调合等4个重要处理单元详细模型的基础上，将单处理单元非线性过程模型集成到一个全流程优化非线性模型中。优化的目标函数是使炼油厂全厂利润最大。决策变量是那些显著影响全厂效益的变量，约束条件是单个处理单元约束条件的集合。对某炼油厂进行实例研究，结果表明该全流程模型能有效处理全厂优化问题，所得利润在线性规划的基础上提高4．5％。     

一种基于无理数加密算法的数字签名方案

为了提高现代网络信息传输的安全性,利用无理数小数点后数字的无穷性、无规律性、分布均匀性,提出一种全新的加密算法,并用它所产生的密钥流进行数字签名,实现身份验证不可抵赖、信息传输无篡改,确保信息传输的完整性、真实性,达到提高加密效率、相互认证的效果。     

干涉型激光直写技术用于光盘防伪

利用作者研制的干涉型激光直写系统，阐述了干涉型激光直写设计OVD的方法，防伪特征，介绍了应用于光盘防伪的OVD技术和应用前景，给出了实验结果。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

钻井井喷失控井喷流出口速度预测方法研究

失控井喷流出口速度、喷口内压力、喷层产量都是井喷失控处理方案设计、作业施工中重要的基础数据。由于井喷失控井井口环境条件复杂，井喷失控后无法在井口安装测量仪表及在高速喷流中放入参照物，不能直接获取以上数据。文章利用地质、钻井过程获得的地层物性参数和气体动力学方程，探讨井喷失控井天然气喷流在不同井筒流动尺寸及组合的喷流速度预测模型，可应用薄剪切模型或RNG修正的k-ε模型定量描述速度场、温度场、浓度场颁。为井喷失控井处理方案设计、施工作业提供基础数据。     

利用AutoCAD编制电气CAD

介绍如何利用AutoCAD开发适合电气专业使用的CAD系统，通过编制电气CAD的功能菜单，构造电气元件库，增强CAD的专业性能。编制电气CAD可以有效地统一本单位电气制图标准，方便电气工程师使用CAD进行专业设计。     

光电平台无角位移减振机构运动分析

分析了光电平台的工作环境和角振动对成像质量的影响，应用空间机构学原理和减振理论，设计了一种既具减振功能又能抑制角位移的无角位移减振机构。对减振机构的减振机理及运动特性进行了分析，并利用三维建模软件和MSC．Visual Nastran 4D仿真分析软件对该减振机构进行了三雏实体仿真分析，通过输出的仿真数据及曲线检验无角位移减振原理的正确性。     

Second harmonic generation from a ferroelectric film

We derive an expression for transmittivity (T_SHG) of second harmonic generation (SHG) signals from a ferroelectric (FE) film. Intensities of up and down fields in the medium are investigated in relation to T_SHG. The derivations are made based on undepletion of input fields and nonlinear wave equation derived from the Maxwell equations. We present two cases: film without mirrors and with partial mirrors. Expressions for the newly derived nonlinear susceptibility coefficients of SHG for real crystal symmetry [J. Opt. Soc. Am. B 19 (2002) 2007] are used to get more realistic results. Variations in T_SHG with respect to film thickness are illustrated.     

通用串行总线(USB)接口芯片USBN9602的应用

简要介绍了通用串行总线USB的特点,对USB接口芯片USBN9602的内部结构、引脚、寄存器组作了详细的论述,并介绍了其应用。