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31.
Zhao Hongliang Lu Tingting Liu Fengqin Yin Pan Wang Sen 《JOM Journal of the Minerals, Metals and Materials Society》2019,71(5):1643-1649
JOM - The Isa/Ausmelt smelting technology with a top submerged lance (TSL) has been extensively used in copper smelting processes. However, the TSL is extremely vulnerable to damage and failure... 相似文献
32.
炼油达标污水回用处理试验研究 总被引:1,自引:0,他引:1
采用曝气生物滤池、多介质过滤、超滤、反渗透工艺,对炼油达标外排污水进行回用处理中试试验。结果表明,曝气生物滤池对油、COD和浊度去除效果良好,超滤、反渗透膜化学清洗周期达到 2个月以上,脱盐率稳定在98%以上,产水品质达到回用要求。 相似文献
33.
管道风险管理方法研究 总被引:6,自引:0,他引:6
按照管道风险管理的流程分别对管道风险评价、风险控制和决策支持、效能测试和响应进行了论述。针对目前国内管道行业的情况,提出了进行管道风险评价的有效方法及维护措施。着重介绍了国外管道风险可接受标准的情况,作为国内制定管道风险评价标准的参考。 相似文献
34.
35.
Chong D. Y. R. Lim B. K. Rebibis K. J. Pan S. J. Sivalingam K. Kapoor R. Sun A. Y. S. Tan H. B. 《Advanced Packaging, IEEE Transactions on》2006,29(4):674-682
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported 相似文献
36.
Generalized multiuser orthogonal space-division multiplexing 总被引:8,自引:0,他引:8
Zhengang Pan Kai-Kit Wong Tung-Sang Ng 《Wireless Communications, IEEE Transactions on》2004,3(6):1969-1973
This paper addresses the problem of performing orthogonal space-division multiplexing (OSDM) for downlink, point-to-multipoint communications when multiple antennas are utilized at the base station (BS) and (optionally) all mobile stations (MS). Based on a closed-form antenna weight solution for single-user multiple-input multiple-output communications in the presence of other receiver points, we devise an iterative algorithm that finds the multiuser antenna weights for OSDM in downlink or broadcast channels. Upon convergence, each mobile user will receive only the desired activated spatial modes with no cochannel interference. Necessary and sufficient conditions for the existence of OSDM among the number of mobile users, the number of transmit antennas at the BS, and the number of receive antennas at the MS, are also derived. The assumption for the proposed method is that the BS knows the channels for all MS's and that the channel dynamics are quasi-stationary. 相似文献
37.
A.L. Pan H.G. ZhengZ.P. Yang F.X. Liu Z.J. Ding Y.T. Qian 《Materials Research Bulletin》2003,38(5):789-796
Small Ag particles or clusters dispersed mesoporous SiO2 composite films were prepared by a new method: First the matrix SiO2 films were prepared by sol-gel process combined with the dip-coating technique, then they were soaked in AgNO3 solutions followed by irradiation of γ-ray at room temperature and in ambient pressure. The structures of these films were examined by X-ray diffraction (XRD), high-resolution transmission electron microscope (HRTEM), and optical absorption spectroscopy. It has been shown that the Ag particles grown within the porous SiO2 films are very small, and they are isolated and dispersed from each other with very narrow size distributions. With increasing the soaking concentration and an additional annealing, an opposite peakshift effect of the surface plasmon resonance (SPR) was observed in the optical absorption measurements. 相似文献
38.
HDPE/PS/HDPE-g-PS合金的相容性和力学性能研究 总被引:1,自引:0,他引:1
用自制接枝共聚物GR-Ⅰ、GR-Ⅱ相容剂研究其对HDPE/PS共混物相容性和力学性能的影响。通过SEM、DMA、DSC和力学性能测试表征,表明在HDPE/PS共混中加入这些相容剂其相容性和力学性能有一定提高 相似文献
39.
本文描述在Unix环境下开发的通用绘图软件NuSlide中的图形用户界面的设计思想和实际方法。其特点是基子面向对象的技术,提供多窗口、菜单驱动、选择面板、键盘输入等多种才法。该图形用户界面具有灵活性、可扩充性和易使用性。 相似文献
40.
DGPSL:A DISTRIBUTED GRAPHICS LIBRARY 总被引:1,自引:0,他引:1
DGPSL:ADISTRIBUTEDGRAPHICSLIBRARYShiJiaoying;PanZhigeng;ZhengWentingDGPSL:ADISTRIBUTEDGRAPHICSLIBRARY¥ShiJiaoying;PanZhigeng;... 相似文献