气动贯通式潜孔锤反循环连续取心取样钻进新技术在河南钼矿中应用

三道庄钼矿勘探生产中钻遇的地层非常复杂，采用其他方法均无法实现钻进，经过分析比较，决定采用贯通式潜孔锤反循环连续取心（样）钻进新技术来解决该地层钻进难、成孔难、取样难等三大问题。文章从钻进技术特点、工作原理等方面对该技术进行详细分析，得出其具有钻进效率高、岩心（样）采取率高、成孔质量好等突出优点。并介绍了钻进主要设备机具的配套、施工工序、操作要点、遇到问题的解决方法等。在河南钼矿露天采石场应用该项技术，有效避免了塌孔和卡钻事故，工程进展顺利、质量好、岩心（样）采取率在98％以上，取得了良好的效果。针对在生产试验中遇到的某些问题，作者提出了一些改进建议。     

深水海底泥浆举升钻井技术及其应用前景

为了解决深水钻井中遇到的问题，由Conoco公司领导的工业联合项目组研发了海底泥浆举升钻井（以下简称SMD）技术。采用该技术进行深水钻井时，隔水管内充满海水，泥浆用小直径管线从海底返回，在返回环空中形成两个压力梯度，实现双梯度控压钻井。文中着重介绍了SMD的理论依据、系统工作原理、系统关键设备以及SMD井控程序的HAZOP分析等。从技术适用性、经济性、装备以及可能存在的风险等方面对该技术在南中国海钻井中使用的可行性进行研究，并展望其应用前景。     

关于天然气水合物钻采工艺技术进展的研究

目前全球正面临着前所未有的能源危机，天然气水合物由于储量大、能量密度高而将成为一种诱人的新型能源。天然气水合物主要存在于冻土带和海洋，在地下处于低温和高压状态，以现有的技术，钻井和开采都存在很大的困难。简要介绍了天然气水合物的性质及储量，阐述了天然气水合物钻井的六个挑战及目前国外天然气水合物的两种钻探方法；同时阐述了以热力法、降压法和化学试剂注入法为主的天然气水合物开采方法，并针对天然气水合物钻采技术现状指出了下一步的研究方向。     

树立社会主义荣辱观 深入推进廉政文化建设

树立社会主义荣辱观与加强廉政文化建设是一脉相承的,要把社会主义荣辱观教育融入反腐倡廉之中,深入推进廉政文化建设,通过系统构建,整体推进,让廉政文化建设迈向更新更高的平台。     

多带抗噪声语音识别算法研究

根据Flether等人的研究,基于感知独立性假设的子带识别方法被用于抗噪声鲁棒语音识别。本文拓展子带方法,采用基于噪声污染假定的多带框架来减少噪声影响。论文不仅从理论上分析了噪声污染假定多带框架在识别性能上的潜在优势,而且提出了多带环境下的鲁棒语音识别算法。研究表明：多带框架不仅回避了独立感知假设要求,而且与子带方法相比,多带方法能更好的减少噪声影响,提高系统识别性能。     

蜕变——中国气象局华风影视大楼

华风气象影视大楼总面积4万平方米，根据空间功能不同分为办公大楼和商务写字楼两部分，办公大楼是集演播室、制作机房、办公室为一体的九层综合性建筑。设计师杨宇在刚接触到这个项目的时候，面对的是一个既成事实的建筑。     

Catalytic aminolysis of epoxide by alumina prepared from amine-protected Al precursor

The catalytic activities of alumina prepared from an Al alkoxide-amine adduct monomer for the reaction of cyclopentene oxide with piperidine was determined after various pretreatments, including calcination and exposure to moisture. They were compared with the activity of alumina prepared by the conventional hydrolysis method. It was found that the as-prepared sample from the alkoxide-amine monomer preparation was five times more active than a conventional preparation, suggesting that it has a higher density of surface Lewis acid sites. However, its activity was much more severely suppressed by exposure to moisture.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

基于USB总线的虚拟频谱分析仪设计

文章详细介绍了基于USB总线的虚拟频谱分析仪的设计过程。该仪器使用嵌入式混合处理器MC56F8323来实现动态信号的实时采集、频谱分析和数字滤波等功能。处理结果由USB2．0接口芯片CY7C68013上传至PC机．以完成数据显示、存储、绘制图形等功能。其中，CY7C68013工作于Slave FIFO模式，以实现与MC56F8323间的数据传输。该系统可同时对两路动态信号进行实时谱分析，每路采样频率高选500kHz。     

农村通信如何"突围"

农村通信作为农村地区信息化的基础，对于全面建设小康具有特殊的重要地位。介绍了我国农村通信的发展现状，分析了农村通信发展的困难压其原因，最后对农村压边远、欠发达地区通信的均衡震展提出了一些建议。