Consideration of temperature and current stress testing on flip chip solder interconnects

This work discusses the experimental set-up and data interpretation for high temperature and current stress tests of flip chip solder joints using the four-point Kelvin measurement technique. The single solder joint resistance responses are measured at four different four-point Kelvin structure locations in a flip chip package. Various temperatures (i.e., 125–165 °C) and electric current (i.e., 0.6–1.0 A) test conditions are applied to investigate the solder joint resistance degradation behavior and its failure processes. Failure criterion of 20% and 50% joint resistance increases, corresponding to solder and interfacial voiding, are employed to evaluate the solder joint electromigration reliability. The absolute resistance value is substantially affected by the geometrical layout of the metal lines in the four-point Kelvin structure, and this is confirmed by finite element simulation.Different current flow directions and strengths yielded different joint resistance responses. The anode joint, where electrons flow from the die to the substrate, usually measured an earlier resistance increase than the cathode joint, where electrons flow in the opposite direction. The change in measured joint resistances can be related to solder and interfacial voiding in the solder joint except for ±1 A current load, where resistance drop mainly attributed to the broken substrate Cu metallization as a result of “hot-spot” phenomenon. The solder joint temperature increases above the oven ambient temperature by ～25 °C, ～40 °C and ～65 °C for 0.6 A, 0.8 A and 1.0 A stress current, respectively. It is found that two-parameter log-normal distribution gives a better lifetime data fitting than the two-parameter Weibull distribution. Regardless of failure criterion used, the anode joint test cells usually calculated a shorter solder joint mean life with a lower standard variation of 0.3–0.6, as compared to the cathode joint test cells with a higher standard variation of 0.8–1.2. For a typical flip chip solder joint construction, electromigration reliability is mainly determined by the under bump metallization consumption and dissolution, with intermetallic compound formation near the die side of an anode joint.     

Wood surface discolouration due to simulated indoor sunlight exposure

Wood surface colour is a very important quality criterion in the utilisation of wood, especially in indoor applications. In this study, an attempt was made to analyse wood surface discolouration due to artificial indoor light irradiation of the most frequently traded wood species in Europe altogether. Sixteen wood species, twelve hardwood and four softwood species, were exposed for 120 hours to a xenon-arc lamp equipped with a 3 mm window glass filter, in order to simulate natural sunlight behind a window glass. Eleven wood species were chosen and further exposed to irradiation for up to 600 hours. Colour measurements were performed by means of a colorimeter device on exposed and non-exposed areas of the samples. Using the CIE-L*a*b* colour measuring system, wood surface discolouration was measured and calculated according to ?L*, ?a*, ?b* and ?E* values. An idea of the different behaviour of these species and how they relate to each other could be given.     

Influence of the Impaction Angle on the Triboelectric Charging of Aerosol Nanoparticles

A low pressure impactor is used to measure triboelectric charging behavior of metallic nanoparticles. Ag nanoparticles, produced by spark discharge, were impacted onto Pt sputtered targets. The influence of the impaction angle and impaction velocity on the triboelectric charging was investigated. While for perpendicular impaction the charge transfer behavior of previous work was confirmed, the oblique impaction revealed new phenomena. Additional charge transfer was observable, which increases with obliqueness. The possibility of mass transfer between particle and target due to the high-energy collisions was also investigated. SEM characterization and Auger spectroscopy indicate mass transfer from the particle to the target surface.     

Trans-Splicing Improvement by the Combined Application of Antisense Strategies

Spliceosome-mediated RNA trans-splicing has become an emergent tool for the repair of mutated pre-mRNAs in the treatment of genetic diseases. RNA trans-splicing molecules (RTMs) are designed to induce a specific trans-splicing reaction via a binding domain for a respective target pre-mRNA region. A previously established reporter-based screening system allows us to analyze the impact of various factors on the RTM trans-splicing efficiency in vitro. Using this system, we are further able to investigate the potential of antisense RNAs (AS RNAs), presuming to improve the trans-splicing efficiency of a selected RTM, specific for intron 102 of COL7A1. Mutations in the COL7A1 gene underlie the dystrophic subtype of the skin blistering disease epidermolysis bullosa (DEB). We have shown that co-transfections of the RTM and a selected AS RNA, interfering with competitive splicing elements on a COL7A1-minigene (COL7A1-MG), lead to a significant increase of the RNA trans-splicing efficiency. Thereby, accurate trans-splicing between the RTM and the COL7A1-MG is represented by the restoration of full-length green fluorescent protein GFP on mRNA and protein level. This mechanism can be crucial for the improvement of an RTM-mediated correction, especially in cases where a high trans-splicing efficiency is required.     

Auswirkungen des Pilotversuchs BDA auf die Grundwasserverhältnisse

This study investigates the impact of the sum of the structural measures on groundwater conditions in the context of the pilot test stretch in Bad Deutsch-Altenburg (BDA). The methodological approach was a comparison of the conditions for the exchange processes between groundwater and river water pre and post the selected structural work. The analyses of the groundwater conditions pre and post the structural work in the BDA pilot test show no substantial impact on the groundwater conditions so far. This is largely due to the effluent conditions between groundwater and surface water along this stretch of the Danube. The transfer of these results to other sections of the Danube with other boundary conditions is only partly possible. It appears that the continuous interaction of groundwater with the waters of the Danube and its branches is of significant importance for the conservation of the groundwater conditions. Therefore, from a water-management point of view, further measures against a decline in surface-water levels are essential for conserving the groundwater conditions.     

Statistical methods for reservoir fluid composition distribution analysis

This paper presents statistical methods for analyzing the molar distribution of components in petroleum fluids. Reservoir fluid characterization is very significant in Equation of State modeling and in some flow assurance- related problems. Heptanes plus components (C₇₊) are usually lumped together as a pseudo-component, hence, characterizing it improves modeling. Three statistical methods were assumed for analyzing the distribution of components using two reservoir fluid data. The statistical methods selected were validated for best fit of the molar distribution data using methods including the Kolmogorov–Smirnov test. The goodness of fit for each test is presented. A new model showing the relationship while using data of Kolmogorov–Smirnov test is presented with high r².     

A holographic transform domain image watermarking method

A transform domain image tagging orwatermarking method that survives image cropping (and, hence, is holographic) was proposed at Bell Labs in September 1994. This report analyzed in detail the various properties of this method and introduces an optimal procedure for watermark recovery.     

Removal of vancomycin administered during dialysis by a high‐flux dialyzer

Introduction: Hemodialysis patients frequently receive vancomycin for treatment of gram‐positive bacterial infections. This drug is most conveniently administered in outpatient dialysis units during the hemodialysis treatment. However, there is a paucity of data on the removal of vancomycin by high‐flux polyamide dialyzers. Methods: This is a prospective crossover study in which seven uninfected chronic hemodialysis patients at three dialysis units received vancomycin 1 gram intravenously over one hour immediately after the dialysis treatment (Phase 1), and vancomycin 1.5 grams during the last hour of dialysis treatment using a polyarylethersulfone, polyvinylpyrrolidone, polyamide high‐flux (Polyflux 24R) dialyzer (Phase 2). There was a three‐week washout period between phases. Serial serum vancomycin concentrations were used to determine the removal of vancomycin when administered during dialysis. Findings: Dialysis removed 35 ± 15% (range 18‐56%) of the vancomycin dose when administered during the last hour of dialysis. The calculated area under the curve (AUC) of vancomycin levels for 0‐44.5 hours from the start of infusion were similar between the two phases (AUC_{Phase 1} 884 ± 124 mg‐hr/L, mean ± SD; AUC_{Phase 2} 856 ± 208 mg‐hr/L; P=0.72). Serum vancomycin concentrations immediately prior to the next dialysis treatment following vancomycin administration were also similar between the two phases (13.1 ± 2.7 mg/L in Phase 1 and 12.3 ± 3.3 mg/L in Phase 2; P=0.55). Discussion: When using a polyarylethersulfone, polyvinylpyrrolidone, and polyamide high‐flux HD membrane with a 24R Polyflux dialyzer, vancomycin can be administered during the last hour of dialysis if the dose that is prescribed for intra‐dialysis dosing is empirically increased to account for intra‐dialytic drug removal.