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261.
Sheng-Fuh Chang Jia-Liang Chen Wen-Lin Chen Hann-Ping Hwang 《Microwave and Wireless Components Letters, IEEE》2004,14(6):304-306
A new quadrature broadside coupler is proposed, which employs an array of air-bridges to enhance directivity via its phase-equalization effect on the c-mode and /spl pi/-modes. The realization of air-bridges follows a standard MMIC fabrication process. An experimental chip fabricated on the 75-/spl mu/m GaAs substrate verifies the air-bridge effect and shows wideband characteristics of the coupling of 3.2/spl plusmn/0.4 dB, the insertion loss of 3.9/spl plusmn/0.4 dB, the output phase deviation from quadrature less than 6/spl deg/, and the isolation greater than 18 dB from 20 to 40 GHz. 相似文献
262.
Fon-Chieh Chang R. R. Fessler B. D. Merkle J. M. Borton W. M. Goldberger 《Particulate Science and Technology》2004,22(1):35-50
Electroconsolidation® is a process for densifying complex-shaped parts by using electrically conductive particulate solids as a pressure-transmitting medium. The part is immersed in a bed of the particulate medium contained in a die chamber. Sintering temperature is achieved by resistive heating of the medium while applying compaction pressure. The process is capable of ultrahigh temperatures and short cycle times and offers the potential for low processing costs.
Control of the process and selection of process conditions require knowledge of the temperatures within the die. Temperature gradients exist because of the high heating rate and because of variations of density and electrical resistivity of the medium due to the presence of the part. Direct measurement of temperature with thermocouples or other conventional means is impractical because of the high temperatures, high currents, and high pressures that are involved. Therefore, a computer model was developed to predict temperature as a function of time and applied voltage for any location in the die. The computer model is composed of three parts: a geometrical model to approximate the density and resistivity variations in the medium, a finite-element model to calculate the rate of resistive heating within each element, and a finite-difference model to calculate the temperature distribution based on solution of the heat-transfer equations. Predicted temperatures have been shown to be in excellent agreement with measurements, and numerical simulation provided encouraging consistency and reasonably accurate predictions of temperature profiles within the die. The model demonstrated the feasibility of a new process to achieve simultaneous application of pressure and heat to powder densification in Electroconsolidation. 相似文献
Control of the process and selection of process conditions require knowledge of the temperatures within the die. Temperature gradients exist because of the high heating rate and because of variations of density and electrical resistivity of the medium due to the presence of the part. Direct measurement of temperature with thermocouples or other conventional means is impractical because of the high temperatures, high currents, and high pressures that are involved. Therefore, a computer model was developed to predict temperature as a function of time and applied voltage for any location in the die. The computer model is composed of three parts: a geometrical model to approximate the density and resistivity variations in the medium, a finite-element model to calculate the rate of resistive heating within each element, and a finite-difference model to calculate the temperature distribution based on solution of the heat-transfer equations. Predicted temperatures have been shown to be in excellent agreement with measurements, and numerical simulation provided encouraging consistency and reasonably accurate predictions of temperature profiles within the die. The model demonstrated the feasibility of a new process to achieve simultaneous application of pressure and heat to powder densification in Electroconsolidation. 相似文献
263.
264.
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266.
Fabrication and characteristics of high-speed implant-confined index-guided lateral-current 850-nm vertical cavity surface-emitting lasers 总被引:2,自引:0,他引:2
Dang G.T. Mehandru R. Luo B. Ren F. Hobson W.S. Lopata J. Tayahi M. Chu S.N.G. Pearton S.J. Chang W. Shen H. 《Lightwave Technology, Journal of》2003,21(4):1020-1031
Process technology of high-speed implant-apertured index-guide lateral-current-injection top dielectric-mirror quantum-well 850-nm vertical cavity surface-emitting lasers (VCSELs) has been developed. Oxygen and helium implantation for aperture definition and extrinsic capacitance reduction, dielectric mirror formation, p- and n-ohmic contact formation, VCSEL resistance, and thermal analysis were investigated. Employing this technology, GaAs/AlGaAs-based 850-nm VCSELs with small signal modulation bandwidths up to 11.5 Gb/s and an eye diagram generated at 12 Gb/s by a pseudorandom bit sequence of 2/sup 31/-1 were achieved. The bit-error rates were below 10/sup -13/. The threshold current is as low as 0.8 mA for 7-/spl mu/m-diameter current apertures and typical slope efficiencies of 0.45-0.5 mA/mW were obtained. 相似文献
267.
Shi-Kuo Chang Costagliola G. Jungert E. Orciuoli F. 《Multimedia, IEEE Transactions on》2004,6(5):687-702
Sensor data fusion imposes a number of novel requirements on query languages and query processing techniques. A spatial/temporal query language called /spl Sigma/QL has been proposed to support the retrieval and fusion of multimedia information from multiple sources and databases. In this paper we investigate fusion techniques, multimedia data transformations and /spl Sigma/QL query processing techniques for sensor data fusion. Fusion techniques including fusion by the merge operation, the detection of moving objects, and the incorporation of belief values, have been developed. An experimental prototype has been implemented and tested to demonstrate the feasibility of these techniques. 相似文献
268.
269.
K-L Lin C-J Hsu I-M Hsu J-T Chang 《Journal of Materials Engineering and Performance》1992,1(3):359-361
It has been difficult to electrolytically obtain crack- free chromium plating because of the high stresses caused by several
factors. Accordingly, electroplating of nickel- chromium also encounters a similar problem. Cracks in chromium- containing
plating was ascribed, in a certain sense, to the formation of a hydride formed through hydrogen adsorption from the electrolyte.
A periodical pulse reverse plating current would enhance the release of hydrogen and hence the elimination of cracking. The
present work describes a successful process for obtaining crack- free nickel- chromium plating and the effects of experimental
variables on plating compositions. 相似文献
270.
E. P. Chang 《The Journal of Adhesion》1991,34(1):189-200
A viscoelastic window (VW) concept has been proposed to identify different types of pressure-sensitive adhesives (PSA's). Such viscoelastic windows are constructed from the values of dynamic storage modulus: G' and dynamic loss modulus G' at frequencies of 10-2 and 102 rad/sec. These frequencies are chosen because the range covers most of the time scales corresponding to the uses of PSA's at different application rates in performance tests. A four quadrant concept has also been recommended to categorize different types of PSA's based on the location of their VW's on the log-log cross plot of G' and G'. It was found that for most PSA's, the range of G' and G' at room temperature within these selected frequencies falls between 103 and 106 Pascals. The proposed four-quadrants (top-left hand quadrant of high G' and low G', top-right hand quadrant of high G' and high G', lower left hand quadrant of low G' and low G', and lower right-hand quadrant of low G' and high G') correspond respectively to (1) non-PSA or release coatings (2) high shear PSA's, (3) removable PSA's and medical PSA's and (4) quick and cold stick PSA's. It was also observed that the VW's of general purpose permanent PSA's occupy the central region which straddles part of the four quadrants. 相似文献