Finite element analysis of advanced multilayer capacitors

We establish a systematic methodology to design and analyse electromagnetic components such as advanced multilayer ceramic capacitors (MLCCs) using the finite element (FE) method. We employ a coupled formulation to compute the interaction between the electric and magnetic fields. Unlike a linear distribution of current assumed in the circuit model, an accurate electrostatic solution to model the entire advanced MLCCs (4 × 4 × 27 = 432 cells) is presented. The FE solution is used to compute the lumped parameters for a range of frequencies. These lumped parameters are then used to compute the parasitic elements of the MLCCs. We introduce two algorithms to efficiently analyse the behaviour of a capacitor with changing frequency. The lower frequency (much below the self‐resonant frequency of the capacitor) algorithm separates the effect of the electric and magnetic fields and reduces the computational effort required to solve the FE problem, whereas, the high‐frequency algorithm couples the effect between the electric and the magnetic fields. We use these algorithms in conjunction with a new multiple scale technique to effectively determine the small values of R, L and C in MLCCs. The formulation, the implementation, and the numerical results demonstrate the efficacy of the present FE formulation and establish a systematic methodology to design and analyse advanced electromagnetic components. Copyright © 2003 John Wiley & Sons, Ltd.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Switched-Current Filters Revisited: Square-Root Domain Sampled-Data Filters

In this brief, the well-known switched-current (SI) filtering technique is revisited using the concept of the square-root domain (SRD) filtering. It is proved that SI filters are a subclass of the SRD filters, where sampled-data signal processing is performed. This is achieved by considering typical lossless and lossy SRD sampled-data integrator configurations, using a set of complementary SRD operators which are based on the quadratic I-V relationship of MOS transistor operated in the saturation. Circuit examples are given, where linear-domain integrator and third-order filter configurations were derived using appropriate SRD sampled-data building blocks     

On the effect of spatial variances in historical rainfall time series to CSO performance evaluation.

Historical, high-resolution rain series are the backbone of modern combined sewer overflow (CSO) structure design. These rain series are the input to the computational estimation of the performance of the measures with respect to CSO pollution abatement. However, those historical precipitation measurements are available at only a few locations. Frequently rain series have to be used from gauging stations at a significant distance. In order to judge and to compensate for this influence an estimate between rain characteristics and combined sewer outflow (CSO) performance indicators would be useful. In this paper such correlations have been sought for a collection of 37 rain series covering large areas of Europe. It was found that the mean annual rain volume can explain most of the variances for the performance indicators Number of overflows and CSO volume. For explaining the spatial differences in the efficiency of the CSO structure another rain characteristic, i.e. the maximum event with a return period of one year, is to be used.     

可拆装高架火炬的应用

结合工程实例,介绍了我国第一座可拆装高架火炬的基本原理及组成,并对可拆装高架火炬与普通高架火炬在安全、技术、安装、维修、占地面积、投资等方面进行了比较,还分析了高架火炬未来的发展趋势.     

A novel compact ring dual-mode filter with adjustable second-passband for dual-band applications

In this letter, a novel compact ring dual-mode with adjustable second-passband for dual-band applications are presented. A ring resonator with two different geometric dimensions are derived and designed to have identical fundamental and the first higher-order resonant frequencies, and to establish appropriate couplings in the structure. Moreover, the proposed filter has smaller size as compared with the basic topology of stopband filters and stepped-impedance-resonator (SIR) filters. The measured filter performance is in good agreement with the simulated response.     

Parametric effects on the transient Voltage performance of a DC superconducting cable

The objective of this work was to determine the significant parameters of a 3-GW 200-kV dc superconducting cable system which influence the transient voltage distribution in the various parts of the cable. The cable system consists of four coaxial metallic cylinders. It was found that the dielectric constant and the electrical resistivity of the soil significantly affect the severity of the transient voltages; lower dielectric constant and higher resistivity of the soil will increase the magnitudes of the transient voltages by increasing the earth-return impedance. It was also found that the effect of the conductor internal impedances of the cable is insignificant. Shorting the coaxial cylinders of the cryogen flow and the cryostat will lessen the severity of the transient voltages. Grounding the second, third, and fourth cylinders at regular intervals with low-impedance grounding impedance will also improve the transient performance of the cable. More research is needed to evaluate these procedures.