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161.
船舶管系减振材料的应用研究 总被引:1,自引:1,他引:0
为适应我国舰船减振降噪的需要,试制出QGD-1和QGD-2两种穿孔型隔振垫,主要用于管路马脚,也可用于基座等振动部位。对两种隔振垫的阻尼性能、阻燃性能、耐油性能与国外同类产品进行了比较。经管路模型试验和水泵机组试验证明,这两种隔振垫可使管路系统振动加速度级明显下降。 相似文献
162.
本文提出了以通用阵列逻辑器件 GAL 和只读存贮器 EPROM 为核心器件的频率/待测量变换的设计方法。配以数字式传感器及用最小二乘法编制的曲线自动分段拟合程序生成的 EPROM 中的数据,可用于力、温度、光强等非电量的测量显示和控制。这种装置与采用微处理器的电路相比,有相同的测量精度,电路简单,而且保密性好. 相似文献
163.
Wang K.-C. Beccue S.M. Chang M.-C.F. Nubling R.B. Cappon A.M. Tsen T.C.-T. Chen D.M. Asbeck P.M. Kwok C.Y. 《Solid-State Circuits, IEEE Journal of》1992,27(10):1372-1378
A novel logic approach, diode-HBT logic (DHL), that is implemented with GaAlAs/GaAs HBTs and Schottky diodes to provide high-density and low-power digital circuit operation is described. This logic family was realized with the same technology used to produce emitter-coupled-logic/current-mode-logic (ECL/CML) circuits. The logic operation was demonstrated with a 19-stage ring oscillator and a frequency divider. A gate delay of 160 ps was measured with 1.1 mW of power per gate. The divider worked properly up to 6 GHz. Layouts of a DHL flip-flop and divider showed that circuit area and transistor count can be reduced by about a factor of 3, relative to ECL/CML circuits. The new logic approach allows monolithic integration of high-speed ECL/CML circuits with high-density DHL circuits with high-density DHL circuits 相似文献
164.
H.C. Kuo Y.H. Chang H.H. Yao Y.A. Chang F.-I. Lai M.Y. Tsai S.C. Wang 《Photonics Technology Letters, IEEE》2005,17(3):528-530
1.27-/spl mu/m InGaAs: Sb-GaAs-GaAsP vertical-cavity surface-emitting lasers (VCSELs) were grown by metal-organic chemical vapor deposition and exhibited excellent performance and temperature stability. The threshold current changes from 1.8 to 1.1 mA and the slope efficiency falls less than /spl sim/35% as the temperature raised from room temperature to 70/spl deg/C. With a bias current of only 5 mA, the 3-dB modulation frequency response was measured to be 8.36 GHz, which is appropriate for 10-Gb/s operation. The maximal bandwidth is measured to be 10.7 GHz with modulation current efficiency factor (MCEF) of /spl sim/5.25 GHz/(mA)/sup 1/2/. These VCSELs also demonstrate high-speed modulation up to 10 Gb/s from 25/spl deg/C to 70/spl deg/C. 相似文献
165.
Aluminum casting alloys exhibit creep behavior when the materials are exposed to high temperature and load. In this article,
the stress- and temperature-dependent creep behavior of a die casting A380-T5 aluminum alloy was simulated using a classical
constitutive model. The bolt-load retention behavior of the material was analyzed in a head bolt joint in an aluminum engine
under thermal cycle condition using the finite element method. In this simulation, transient thermal analysis was performed
first to calculate the metal temperature at the head bolt joint as a function of time during engine thermal cycling. This
temperature was then input as the thermal loading in the subsequent structural analysis to calculate its effect on the bolt-load
retention. The finite element analysis (FEA) model for the bolt-load retention simulation includes not only the plasticity
in all metal components but also the creep properties of head bolt threads in the cast aluminum engine block. The FEA model
was validated by good correlation between the predicted head bolt-load loss and the experimental measurement during engine
thermal cycling. The simulation results also indicated that creep in the head bolt threads of cast aluminum engine block was
mainly responsible for the load loss in the head bolt joint.
This article is based on a presentation given in the symposium entitled “Simulation of Aluminum Shape Casting Processing:
From Design to Mechanical Properties” which occurred March 12–16, 2006 during the TMS Annual Meeting in San Antonio, Texas
under the auspices of the Computational Materials Science and Engineering Committee, the Process Modeling, Analysis and Control
Committee, the Solidification Committee, the Mechanical Behavior of Materials Committee, and the Light Metal Division/Aluminum
Committee. 相似文献
166.
我国历史悠久,食文化源远流长。在我国,肉制品的生产再制有三千多年的历史。有关资料表明,我们的祖先最早是以肉类为主要食物的,随着人类的不断进步,进人了刀耕火种的时代,人们学会了用火烤肉,这就是最原始的熟肉制品,这是人类最重要的文明进步。在历史的长河中,人们不断总结经验,不断发明创造,到现在, 相似文献
167.
This paper addresses the problem of bandwidth allocation under the weighted maximum rate constrained link sharing policy and proves a key theory in the condition of allocation termination. We propose several algorithms with various worst-case and average-case time complexities, and evaluate their computation elapse times. 相似文献
168.
Sheng-Jye Hwang Yi-San Chang 《Components and Packaging Technologies, IEEE Transactions on》2006,29(1):112-117
The isothermal and isobaric volume shrinkage is measured by a single-plunger-type dilatometer for epoxy molding compound (EMC). This device has been found suitable for measuring volume change of thermosetting materials such as commercial EMC under isothermal and isobaric conditions. Moreover, the degree of cure (conversion) was determined by a differential scanning calorimetry (DSC). Combining volume change and conversion, a mathematic pressure-volume-temperature-cure (P-V-T-C) model is proposed to describe the relationship between volume shrinkage, pressure, temperature and conversion. The P-V-T-C equation can be simply expressed as VS(P,T,C)=F/sub 1/(P,T)/spl middot/C/sup F2(P,T)/. This equation can well describe historical profiles of volume shrinkage under specified isothermal and isobaric states. From the predicted results, volume shrinkage under different pressure levels in any specified temperature can be approximated as and it obeys the principle of linearity. With the help of this model, together with three-dimensional mold filling simulation, engineers will be able to predict warpage and residual stresses for a package after molding. 相似文献
169.
用傅里叶变换红外扫描光致发光方法研究了Hg1-xCdxTe体单晶样品,该方法可直接得到HgCdTe晶片组分的二维平面分布,并可得到辐射复合在复合机制中所占比重的平面分布,以及晶体中非平衡载流子寿命的分布 相似文献
170.