Modeling and Interoperability Test Case Generation of a Real-Time QoS Monitoring Protocol

QoS monitoring is a kind of real-time systems which allows each level of the system to track the ongoing QoS levels achieved by the lower network layers. For these systems, real-time communication between corresponding transport protocol objects is essential for their correct behavior. When two or more entities are employed to perform a certain task as in the case of communication protocols, the capability to do so is called interoperability and considered as the essential aspect of correctness of communication systems. This paper describes a formal approach on modeling and interoperability test case generation of a real-time QoS monitoring protocol. For this, we specify the behavior of flow monitoring of transport layer QoS protocol, i.e., METS protocol, which is proposed to address QoS from an end-to-end's point of view, based on QoS architecture model which includes ATM network in lower layers. We use a real-time Input/Output Finite State Machine to model the behavior of real-time flow monitoring over time. From the modeled real-time I/OFSM, we generate interoperability test cases to check the correctness of METS protocol's flow monitoring behaviors for two end systems. A new approach to efficient interoperability testing is described and the method of interoperability test cases generation is shown with the example of METS protocol's flow monitoring. The current TTCN is not appropriate for testing real-time and multimedia systems. Because test events in TTCN are for message-based system and not for stream-based systems, the real-time in TTCN can only be approximated. This paper also proposes the notation of real-time Abstract Test Suite by means of real-time extension of TTCN. This approach gives the advantages that only a few syntactical changes are necessary, and TTCN and real-time TTCN are compatible. This formal approach on interoperability testing can be applied to the real-time protocols related to IMT-2000, B-ISDN and real-time systems.     

Tracking monotonically advancing boundaries in image sequences using graph cuts and recursive kernel shape priors

We introduce a probabilistic computer vision technique to track monotonically advancing boundaries of objects within image sequences. Our method incorporates a novel technique for including statistical prior shape information into graph-cut based segmentation, with the aid of a majorization-minimization algorithm. Extension of segmentation from single images to image sequences then follows naturally using sequential Bayesian estimation. Our methodology is applied to two unrelated sets of real biomedical imaging data, and a set of synthetic images. Our results are shown to be superior to manual segmentation.     

Analysis of adaptive bandwidth allocation in wireless networks with multilevel degradable quality of service

A wireless/mobile network supporting multilevel quality of service (QoS) is considered. In such a network, users or applications can tolerate a certain degree of QoS degradation. Bandwidth allocation to users can, therefore, be adjusted dynamically according to the underlying network condition so as to increase bandwidth utilization and service provider's revenue. However, arbitrary QoS degradation may be unsatisfactory or unacceptable to the users, hence resulting in their subsequent defection. Instead of only focusing on bandwidth utilization or blocking/dropping probability, two new user-perceived QoS metrics, degradation ratio and upgrade/degrade frequency, are proposed. A Markov model is then provided to derive these QoS metrics. Using this model, we evaluate the effects of adaptive bandwidth allocation on user-perceived QoS and show the existence of trade offs between system performance and user-perceived QoS. We also show how to exploit adaptive bandwidth allocation to increase system utilization (for the system administrator) with controlled QoS degradation (for the users). By considering various mobility patterns, the simulation results are shown to match our analytical results, demonstrating the applicability of our analytical model to more general cases.     

Effect of rapid thermal annealing on pentacene-based thin-film transistors

The bottom contact pentacene-based thin-film transistor is fabricated, and it is treated by rapid thermal annealing (RTA) with the annealed temperature up to 240 °C for 2 min in the vacuum of 1.3 × 10⁻² torr. The morphology and structure for the pentacene films of OTFTs were examined by scanning electron microscopy and X-ray diffraction technique. The thin-film phase and a very small fraction of single-crystal phase were found in the as-deposited pentacene films. While the annealing temperature increases to 60 °C, the pentacene molecular ordering was significantly improved though the grain size only slightly increased. The device annealed at temperature of 120 °C has optimal electrical properties, being consistent with the experimental results of XRD. The post-annealing treatment results in the enhancement of field-effect mobility in pentacene-based thin-film transistors. The field-effect mobility increases from 0.243 cm²/V s to 0.62 cm²/V s. Besides, the threshold voltage of device shifts from −7 V to −3.88 V and the on/off current ratio increases from 4.0 × 10³ to 8.7 × 10³.     

Negative giant surface potential of vacuum-evaporated tris(7-propyl-8-hydroxyquinolinolato) aluminum(III) [Al(7-Prq)3] film

Negative giant surface potential was realized in a vacuum-evaporated film of tris(7-propyl-8-hydroxyquinolinolato) aluminum(III) [Al(7-Prq)₃]. Electroabsorption response of the film presented an inverted polarity to that of tris(8-hydroxyquinolinolato) aluminum (Alq₃), suggesting opposite noncentrosymmetry of molecular orientation. Asymmetric dice model with molecular geometric effect has been proposed, and propyl substitution at 7 position of the ligands was indicated to affects the molecular posture on the surface to invert the polarity of noncentrosymmetry. Our results opened a new possibility of controlling molecular orientation in a film for device applications.     

Performance comparisons between PCA-EA-LBG and PCA-LBG-EA approaches in VQ codebook generation for image compression

The aim of this study is to generate vector quantisation (VQ) codebooks by integrating principle component analysis (PCA) algorithm, Linde-Buzo-Gray (LBG) algorithm, and evolutionary algorithms (EAs). The EAs include genetic algorithm (GA), particle swarm optimisation (PSO), honey bee mating optimisation (HBMO), and firefly algorithm (FF). The study is to provide performance comparisons between PCA-EA-LBG and PCA-LBG-EA approaches. The PCA-EA-LBG approaches contain PCA-GA-LBG, PCA-PSO-LBG, PCA-HBMO-LBG, and PCA-FF-LBG, while the PCA-LBG-EA approaches contain PCA-LBG, PCA-LBG-GA, PCA-LBG-PSO, PCA-LBG-HBMO, and PCA-LBG-FF. All training vectors of test images are grouped according to PCA. The PCA-EA-LBG used the vectors grouped by PCA as initial individuals, and the best solution gained by the EAs was given for LBG to discover a codebook. The PCA-LBG approach is to use the PCA to select vectors as initial individuals for LBG to find a codebook. The PCA-LBG-EA used the final result of PCA-LBG as an initial individual for EAs to find a codebook. The search schemes in PCA-EA-LBG first used global search and then applied local search skill, while in PCA-LBG-EA first used local search and then employed global search skill. The results verify that the PCA-EA-LBG indeed gain superior results compared to the PCA-LBG-EA, because the PCA-EA-LBG explores a global area to find a solution, and then exploits a better one from the local area of the solution. Furthermore the proposed PCA-EA-LBG approaches in designing VQ codebooks outperform existing approaches shown in the literature.     

Integrating guanxi into technology acceptance: An empirical investigation of WeChat

Social influence is an important research topic in the technology acceptance literature, in particular for social media. Prior empirical studies have for the most part employed social influence theory to investigate user intentions to continue with social media, while culture driven theories have been neglected. Rather than using social influence theory, we introduced guanxi theory to explore how guanxi social mechanisms (or processes) influence Chinese users’ continuance intentions in WeChat. Specifically, we developed a model that examines the role of guanxi as manifested by renqing, mianzi and ganqing in perceived usefulness, perceived enjoyment and continuance intention in WeChat. A survey research method was adopted to test the proposed hypotheses. This study found that ganqing has a positive impact on perceived usefulness and continuance intention. Mianzi exerts a negative effect on continuance intention but exhibits a positive effect on perceived usefulness. Renqing was found to have no significant impact on perceived usefulness and continuance intention. Our study advances the Technology Acceptance Model (TAM) by introducing guanxi-based constructs in a Chinese mobile social-messaging application context. Our study also offers alternative insights on guanxi-based social influence processes in the Chinese technology acceptance literature.     

stc89c51单片机的厨房煤气泄露检测报警系统设计与实现

本篇论文是对煤气泄露的测量和报警进行的分析,气体传感器是作为系统的一个具体研究对象,该系统的重要核心为单片机据此组合成为一个具有结果显示、数据通信、数据采集、等多个不同功能的系统.对排气扇切断阀门、报警灯以及蜂鸣器进行有效控制,对煤气发生泄露的事故进行实时地监测以及有效控制监测系统状态.     

Downlink channel covariance matrix (DCCM) estimation and itsapplications in wireless DS-CDMA systems

The downlink channel covariance matrix (DCCM) is of vital importance in determining downlink beamforming weights for base station (BS) antenna array systems. For the frequency-division-duplex (FDD) mode, DCCM is difficult to obtain due to a lack of direct measurement of downlink channel responses. In this paper, a novel technique is proposed for estimating DCCM using uplink channel responses only, which does not need direction-of-arrival (DOA) estimation and its association. The downlink beamforming scheme is then proposed for wireless DS-CDMA systems, using the obtained DCCM information together with the so-called virtual uplink beamforming and power control technique. Computer simulations show that using the BS antenna array together with this new beamforming technique can provide larger system capacity than traditional DOA-based approaches, which just direct the main beam toward the desired user     

Effect of solder creep on the reliability of large area die attachment

High temperature solders have been widely used for power device die attachment. One typical solder is Pb92.5In5Ag2.5, which is a ternary eutectic alloy with a eutectic temperature of 310°C. Such a Pb-based solder has a low Young's modulus, a low yield strength, and a high strain prior to failure. So it can be used to attach large size silicon die to mismatched substrates. In this paper, stresses and strains have been studied on a large size power MOSFET attachment using the Pb92.5In5Ag2.5 solders. A commercial finite element analysis software is employed as the simulation tool. Three types of substrates, pure copper, copper–tungsten composite, and pure molybdenum are used in the study, where molybdenum has the closest coefficient of thermal expansion to silicon. In addition to the plastic deformation simulation of the solder, a creep model of the solder was incorporated due to the low melting temperature of the solder alloy. Firstly, stresses and strains are calculated during the cooling cycle after attachment. It is found that the creep strain is the dominant plastic strain at low cooling rate (10°C/min). Also, the maximum Von Mises stress in the Si chip is decreased from 174 to 62.7 MPa after adding creep strain. As expected, the maximum creep strain happens to the die-to-copper substrate attach. Simulation on temperature cycling is done from −55°C to +150°C. The peak Von Mises stress occurs at the low temperature extreme and holds steadily during the soaking period, indicating insignificant contribution from creep. The Von Mises stress at the high temperature extreme is much lower and decreases with holding time. Significant plastic deformation of the solder layer is observed in cooling cycles. For silicon to copper substrate attach, its plastic deformation increases with each cycle. For all three substrates used, considerable solder creep is observed at heating cycles. The creep strain is much larger than the rate-independent plastic strain in the solder alloy for all three types of substrates. It is concluded that solder creep is the dominant factor affecting long term reliability of power semiconductor die attachment.