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31.
When used as floor joists, the new mono-symmetric LiteSteel beam (LSB) sections require web openings to provide access for inspections and various services. The LSBs consist of two rectangular hollow flanges connected by a slender web, and are subjected to lateral distortional buckling effects in the intermediate span range. Their member capacity design formulae developed to date are based on their elastic lateral buckling moments, and only limited research has been undertaken to predict the elastic lateral buckling moments of LSBs with web openings. This paper addresses this research gap by reporting the development of web opening modelling techniques based on an equivalent reduced web thickness concept and a numerical method for predicting the elastic buckling moments of LSBs with circular web openings. The proposed numerical method was based on a formulation of the total potential energy of LSBs with circular web openings. The accuracy of the proposed method's use with the aforementioned modelling techniques was verified through comparison of its results with those of finite strip and finite element analyses of various LSBs. 相似文献
32.
Moon Gi Cho Kyung Wook Paik Hyuck Mo Lee Seong Woon Booh Tae-Gyu Kim 《Journal of Electronic Materials》2006,35(1):35-40
The interfacial reaction between 42Sn-58Bi solder (in wt.% unless specified otherwise) and electroless Ni-P/immersion Au was
investigated before and after thermal aging, with a focus on the formation and growth of an intermetallic compound layer,
consumption of under bump metallurgy (UBM), and bump shear strength. The immersion Au layer with thicknesses of 0 μm (bare
Ni), 0.1 μm, and 1 μm was plated on a 5-μm-thick layer of electroless Ni-P (with 14–15 at.% P). The 42Sn-58Bi solder balls
were then fabricated on three different UBM structures by using screen printing and pre-reflow. A Ni3Sn4 layer formed at the joint interface after the pre-reflow for all three UBM structures. On aging at 125°C, a quaternary phase,
identified as Sn77Ni15Bi6Au2, was observed above the Ni3Sn4 layer in the UBM structures that contain Au. The thick Sn77Ni15Bi6Au2 layer degraded the integrity of the solder joint, and the shear strength of the solder bump was about 40% less than the nonaged
joints. 相似文献
33.
Administration (p.o.) of SKP-450, 2-[2"-(1",3"-dioxolane)]-2-methyl-4-(2'-oxo-1'-pyrrolidinyl)-6-nitro-2H- 1-benzopyran, a novel antihypertensive agent, to hypercholesterolemic Syrian hamsters led to a significant reduction in plasma lipids in a dose-dependent manner, i.e., a 10.8% to 29% reduction in low-density lipoprotein cholesterol at doses of 0.3 to 10 mg/kg of SKP-450. SKP-450 was found to specifically inhibit the hepatic microsomal lanosterol 14alpha-methyl demethylase (14alpha-DM) in a competitive manner (Ki:2.65 microM). Furthermore, a dose-dependent decrease in the 14alpha-DM activity by SKP-450 parallelled the cholesterol synthetic rate in vitro in both the rat hepatic S10 fractions (supernatants at 10,000 g; IC50:20 microM) and Chinese hamster ovary cells (IC50:23 microM). However, this phenomenon was not seen in AR45 cells, which are deficient in 14alpha-DM, suggesting that 14alpha-DM is the major target for the inhibitory action of SKP-450 in regard to cholesterol biosynthesis. 相似文献
34.
Data are presented on the externally received personal dose equivalent for radiation workers who used the Korea Radioisotope Association's personal monitoring and dose record keeping service since 1984, and provide initial statistics on Korean workers who have been exposed to ionising radiation in different occupations. The total number of workers registered during the period of 1984 to 1999 was 64,518. The number increased steadily and the accumulated dose also increased. The proportion of radiation workers by occupation was 38.4% for nuclear power plants, 20.3% for industrial organisations and 12.4% for non-destructive industry. The annual collective dose of radiation workers was 31.72 man.Sv in 1999. The mean annual dose by sex was 1.49 mSv for males and 0.56 mSv for females and the mean annual dose for a worker was 1.41 mSv with the highest mean dose being received by non-destructive industry (3.53 mSv). Very few workers (0.8%) received more than 20 mSv (2 rem) and only one more than 50 mSv, the legal limit for an annual dose increase. There has been a steady decline in the mean dose since 1984, showing a significant decrease in dose with time (p<0.001). The data showed that radiation protection in Korea was improving, though annual doses were still higher than other countries. 相似文献
35.
Miae Woo Sang-Tae Kim Jong-Ho Paik Hyoung-Kyu Song Young-Hwan You 《Broadcasting, IEEE Transactions on》2007,53(3):678-684
A combination of orthogonal frequency division multiplexing (OFDM) with frequency-division multiple access (FDMA) called orthogonal frequency-division multiple access (OFDMA) is regarded as a promising solution for improving the performance of interactive wireless broadcasting systems. This paper presents our investigation into reducing the multiple access interference (MAI) introduced by symbol timing misalignment in an OFDMA uplink system. To combat the MAI, we provide a new OFDMA symbol frame employing a simple symbol repetition coupled with a cyclic time shift for typical OFDMA uplink scenarios. Theoretical analysis and computer simulations are used to assess the performance of the proposed OFDMA uplink system. It is found that this scheme can decrease the probability of destroying the orthogonality among the users and provide the MAI-free reception. 相似文献
36.
Myung Jin Yim Chang-Kyu Chung Kyung Wook Paik 《Electronics Packaging Manufacturing, IEEE Transactions on》2007,30(4):306-312
This paper describes how the material properties of conductive particles in anisotropic conductive films (ACFs) affect the electrical conductivity and the reliability of ACF interconnections for chip-on-glass (COG) applications. For the conductive particles, Au/Ni-coated polymer particles with a 5-diameter were used. Two different types of conductive particles were characterized with respect to their mechanical and electrical properties, such as ball hardness, recovery behavior, and electrical resistance. In addition, two ACFs were fabricated in the form of a double-layered structure, in which the thickness of the ACF and a nonconductive film (NCF) layer were optimized to have as many conductive particles as possible on the bump after COG bonding. The electrical contact resistance of an ACF interconnection in a COG structure depends mainly on the electrical properties of conductive particles in the ACF. The electrical reliability of an ACF interconnection in a COG structure also depends more on the electrical properties than the mechanical properties of conductive particles under a high-temperature and humid condition. Conductive particles with a lower electrical resistance, higher mechanical hardness, and lower recovery rate show better reliability than conductive particles with a higher electrical resistance, lower mechanical hardness, and higher recovery rate. Cross-sectional scanning electron microscopic (SEM) pictures of a COG interconnection show the deformation of two different conductive particles after the reliability tests. The ACF interconnections in the edge or corner of a driver IC show less reliable joints due to high absorption of moisture. 相似文献
37.
38.
C Wu H Kobayashi B Sun TM Yoo CH Paik OA Gansow JA Carrasquillo I Pastan MW Brechbiel 《Canadian Metallurgical Quarterly》1997,5(10):1925-1934
Distinct differences in in vivo stability of the two diastereomeric C-Functionalized CyDTPA chelating agents, (CHX-A DTPA and CHX-B DTPA, both racemates), as recently reported prompted further investigation as to why differences in configuration produced striking effects on the in vivo stability of their yttrium complexes. To this end, the four individual component stereoisomers of CHX-A and CHX-B were synthesized and ability to bind yttrium was investigated both in vitro and in vivo. 相似文献
39.
40.
Woonghwan Ryu Myung-Jin Yim Seungyoung Ahn Junho Lee Woopoung Kim Kyung-Wook Paik Joungho Kim 《Components and Packaging Technologies, IEEE Transactions on》2000,23(3):542-545
This paper firstly reports on the high-frequency SPICE model of the ACF flip-chip interconnections up to 13 GHz. The extraction process is based on an optimization procedure, called a genetic algorithm, which is known as a robust optimization tool. The proposed equivalent circuit model of the ACF interconnection can readily be used in SPICE circuit simulations for signal integrity analysis of high-frequency packages. Two different ACF interconnections were studied using the Au-coated polymer ball and Ni-filled ball. The extracted models of the two ACFs were found strongly dependent on not only size and rigidity of the conducting balls, but also on their magnetic permeability 相似文献