Thermal stability in the Al-Al3Ti system

Directionally solidified samples of an Al-2 wt% Ti alloy were annealed at temperatures between 435° C and 660° C to investigate the thermal stability of phases formed during an incomplete peritectic transformation. The proportion of Al₃Ti present in the assolidified alloy is less than equilibrium up to about 480° C, and more than equilibrium at higher temperatures. Hence, Al₃Ti particles will be stable up to about 500° C and will tend to dissolve at higher temperatures. Diffusion due to non-equilibrium composition of the phase continues at all temperatures but is sluggish up to about 600° C. The diffusion coefficient of Ti in Al at 635° C is estimated to be 2×10^–11 cm² sec^–1.     

On the small crack fracture mechanics

The limit of validity of linear fracture mechanics is specified by the minimum allowable crack length through an ASTM convention. Extension into the non-linear region ought to imply an extension towards smaller allowable cracks. In order to elucidate the question “How short is the smallest crack that fits the methods of fracture mechanics, and how do shorter cracks than that behave?” a pilot investigation is carried out. The process region is modelled as a Barenblatt line region and plastic flow off-side the process region is neglected. Results show that instability occurs before the process region is fully developed (as at large cracks) if the crack is short. This implies large deviations from the large crack fracture mechanics if the crack is very small. Even cracks of infinitesimal length are included in the study.     

External Memory Planar Point Location with Logarithmic Updates

Point location is an extremely well-studied problem both in internal memory models and recently also in the external memory model. In this paper, we present an I/O-efficient dynamic data structure for point location in general planar subdivisions. Our structure uses linear space to store a subdivision with N segments. Insertions and deletions of segments can be performed in amortized O(log? _B N) I/Os and queries can be answered in $O(\log_{B}^{2} N)$ I/Os in the worst-case. The previous best known linear space dynamic structure also answers queries in $O(\log_{B}^{2} N)$ I/Os, but only supports insertions in amortized $O(\log_{B}^{2} N)$ I/Os. Our structure is also considerably simpler than previous structures.     

容错的网络声明式程序

介绍了基于递归规则的网络声明式语言Netlog的语法和分布式不动点语义,定义了强良好的程序,并证明了强良好的程序的计算结果对有限的消息丢失不敏感.     

Prosocial Emotions and Helping: The Moderating Role of Group Membership.

In this article, the authors introduce and test a group-level perspective on the role of empathy and interpersonal attraction in helping. In line with our predictions, Study 1, a longitudinal field study of 166 AIDS volunteers, confirmed that empathy was a stronger predictor of helping when the recipient of assistance was an in-group member than when that person was an out-group member. Also as hypothesized, attraction was a stronger predictor of helping when the recipient was an out-group member than when that person was an in-group member. Study 2 replicated and further extended these results in a laboratory experiment on spontaneous helping of a person with hepatitis. Strengthening the validity of the findings, in both studies the effects of empathy and attraction held up even when the authors statistically controlled for potential alternative predictors of helping. The theoretical and practical implications of these findings for helping in intergroup contexts are discussed. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

Evolution of internal stress and microstructure in Ti50Cu50 alloy films: influence of substrate temperature and composition

The growth stress of Ti₅₀Cu₅₀ alloy films on alumina substrates was measured in situ under ultrahigh vacuum conditions with a cantilever beam technique as a function of substrate temperature and variation of copper concentration. The growth stress of films deposited at low temperature is interpreted to indicate the growth of amorphous respectively nanocrystalline films. At substrate temperatures above 300 °C, a novel tensile stress contribution is interpreted to be due to the formation of a preferentially oriented film of metastable copper vacancy superstructured γ-TiCu. Finally, at substrate temperatures above 365 °C, a polycrystalline γ-TiCu film is formed.Annealing of low-temperature alloy films gives rise to irreversible tensile stress changes indicating restructuring of the films. The stress change measured when annealing a superstructured γ-TiCu film is compressive and is assigned to the transformation of the metastable superstructure to polycrystalline γ-TiCu. The magnitude of this compressive stress contribution is strongly dependent on the copper concentration, i.e., copper vacancy concentration.     

Grid-Controlled Lightpaths for High Performance Grid Applications

Grid applications call for high performance networking support. One attractive solution is to deploy Grids over optical networks. However, resource management in optical domains is traditionally very rigid and cannot successfully meet the requirements of Grid applications, such as flexible provisioning and configuration. In this paper, we present a customizable resource management solution for optical networks where users can create lightpaths on demand and manage their own network resources. Thanks to a Grid-centric system architecture, lightpath resources can be shared among users and easily integrated with data and computation Grids.