DSP系统需要特殊的电源管理技术

在便携式的应用中,电源的效率决定着工作时间。举个例子,当你在飞越海洋的客机上使用便携式DVD播放器时,电池的使用时间将会变得十分的重要。电源的效率是由硬件的设计,器件的选择,以及基于软件的功率管理技术来共同决定的。     

Three-Stage Thin-Film Superlattice Thermoelectric Multistage Microcoolers with a Δ<Emphasis Type="Italic">T</Emphasis><Subscript>max</Subscript> of 102 K

Thin-film Bi₂Te₃- and Sb₂Te₃-based superlattice (SL) thermoelectric (TE) devices are an enabling technology for high-power and low-temperature applications, which include low-noise amplifier cooling, electronics hot-spot cooling, radio frequency (RF) amplifier thermal management, and direct sensor cooling. Bulk TE devices, which can pump heat loads on the order of 10 W/cm², are not suitable in these applications due to their large size and low heat pumping capacity. Recently, we have demonstrated an external maximum temperature difference, ΔT _max, as high as 58 K in an SL thin-film p–n couple. This state-of-the-art couple exhibited a cold-side minimum temperature, T _cmin, of −30.9°C. We regularly attain ΔT _max values in excess of 53 K, in spite of the many significant electrical and thermal parasitics that are unique to thin-film devices. These measurements do not use any complex thermal management at the heat sink to remove the heat flux from the TE device’s hot side. We describe here multistage SL cooling technologies currently being developed at RTI that can provide useful microcooling cold-side temperatures of 200 K. This effort includes a three-stage module employing independently powered stages which produced a ΔT _max of 101.6 K with a T _cmin of −75°C, as well as a novel two-wire three-stage SL cascade which demonstrated a T _cmin of −46°C and a ΔT _max of nearly 74 K. These RTI modules are only 2.5 mm thick, significantly thinner than a similar commercial three-stage module (5.3 mm thick) that produces a ΔT _max of 96 K. In addition, TE coolers fabricated from these thin-film SL materials perform significantly better than the extrapolated performance of similar thickness bulk alloy materials.     

2008年全球芯片与设备市场放缓

消费者已感受到经济增长放缓的压力,全球半导体与电子设备供应商也是如此。据iSuppli公司,这些厂商在2008年面临需求增长放慢的局面。 在全球电子设备市场中,六大领域中的五个预计2008年增长率将低于2007年,这五个领域是：电脑、工业设备、汽车设备、有线通讯和无线通讯。     

Annealing-Induced Morphological Changes in Nanocrystalline Quantum Dots and Their Impact on Charge Transport Properties

The effects of thermal annealing on the morphological and photoconductive properties of cadmium selenide quantum dots coated with zinc sulfide are studied. The results of transmission electron microscopy with in situ annealing show a number of events taking place simultaneously, including aggregation of dots, changes in the size and shape distribution, and reduction in interdot separation. Transient absorption results indicate that there is a small redshift of the spectrum. There is a shortening of the absorption decay lifetimes due to annealing. Higher photocurrents are measured in the annealed compared with unannealed dots at room temperature.     

An exploratory study for investigating the critical success factors for cloud migration in the Saudi Arabian higher education context

Saudi universities have at their disposal a huge number of low cost IT resources to aid in teaching, research and learning. By migrating to cloud services, Saudi universities will be moving data and programs from local servers to the internet, thereby providing users with the ability to access and share information at any time from multiple devices. The migration to cloud-based IT resources is not yet widespread in Saudi universities due to several challenges including security, legal policies and implementation. At present, there is lack of research and guidance for Saudi universities on how to overcome these challenges and how contextual factors can influence the successful migration to the educational clouds.This research presents a framework for the successful migration to cloud technology in the Saudi Arabian universities. In this research, a set of key critical success factors (CSFs) were identified by synthesizing components from studies concerned with the migration of cloud for higher education and factors identified from the successful implementation of WBL (Web Based Learning) and ERP (Enterprise Resource Planning) on higher education in Saudi Arabia. Based on this knowledge, the proposed framework was evaluated via expert review and a survey by IT specialists from the Saudi universities. The initial CSFs were updated based on the expert reviews and the results were analysed. Based on the findings at this stage, additional CSFs were added to the framework as suggested by the experts. Subsequently, in order to confirm the reviewed CSFs, additional investigation via a structured online questionnaire was conducted and the outcome was analysed via one-sample t-test with the data integrity analysed via Cronbach’s alpha. The outcome indicated the majority of CSFs to be statistically significant except the Physical Location CSF. Potential future study and contributions are discussed.     

Multilevel metal interconnection utilizing CVD tungsten and liftoff processing

Interconnections between semiconductor devices in integrated circuits continue to present difficult problems in the tradeoffs between RC time constants, production worthiness, reliability, structural complexity, and compactibility for any single technology. A process and structure has been demonstrated for integrated circuit interconnections which uses a conformai tungsten layer deposited by chemical vapor deposition to provide step coverage into via holes of variable height. The film is then patterned with a via interconnect pattern designed for liftoff processing, layers of chromium copper and chromium are then depositedinsitu on the wafers by way of evaporation. The undesired material is lifted off in a solvent process and the resulting metal pattern is used as the mask for the reactive ion etching of CVD tungsten. This combination of materials and process allows for high conductivity reliable interconnections with negligable step coverage problems. Processing and test information will be presented in the paper.     

An empirical study of factors influencing cloud adoption among private sector organisations

In many developing countries such as Saudi Arabia the adoption of cloud computing is still at an early stage. This research aims to investigate the influencing factors in the decision to adopt cloud computing in the private sector. An integrated model is proposed incorporating critical factors derived from a literature review, along with other factors (such as physical location) that have not been examined in previous studies as main factors in the organisation’s decision to adopt cloud services. Data were collected from 300 IT staff in different organisations in the private sector in Saudi Arabia, in order to test the cloud adoption model and explore factors that were positively or negatively associated with cloud adoption. The most influential determinants of cloud adoption were found to be quality of service and trust. However, security and privacy concerns still prevent cloud adoption in this country. This study also showed that the effect of these variables differed according to organisation size and in adopter and non-adopter companies. Overall, these research findings provide valuable guidelines to cloud providers, managers, and government policy makers on ways of encouraging the spread of cloud computing in Middle Eastern countries and increasing its implementation, particularly in Saudi Arabia.     

高k材料／金属栅电极迈向大规模量产

到了45纳米技术节点,高介电常数绝缘材料和金属栅电极将被用于射造逻辑电路器件。而采用高金属功函数和能隙工程电荷陷阱的闪存也能从这些项技术中获益。     

UOR闪存在机顶盒产品中的应用

2008北京奥运会是现代奥运史上首次选用高清设备进行高清转播的奥运会。这也意味着中国电视机顶盒市场的繁荣会随着北京奥运进入倒计时。