Biosynthesis and assembly of alcohol oxidase, a peroxisomal matrix protein in methylotrophic yeasts: a review

Alcohol oxidase (AO) catalyses the first step of methanol metabolism in yeasts. In vivo the enzyme is compartmentalized in special cell compartments, called peroxisomes. The enzyme along with the organelles are induced during growth of methylotrophic yeasts on methanol as the sole carbon source. Like all other peroxisomal matrix proteins, AO is encoded by a nuclear gene. Expression of the protein is regulated by a repression/derepression mechanism, but also by induction. Inactive monomeric precursor protein is synthesized in the cytosol and subsequently imported post-translationally into peroxisomes without further processing. Assembly into the active homo-octameric enzyme and binding of the prosthetic group flavin adenine dinucleotide occurs inside the organelle. When enhanced concentration of octameric alcohol oxidase are present in the organelles, the enzyme may form a crystalloid. Oligomerization is not dependent on translocation of AO precursors into their target organelle since octameric, active AO is detected in the cytosol and nucleus of peroxisome-deficient mutants of Hansenula polymorpha: at high expression rates large cytosolic AO crystalloids are formed, which occasionally are also encountered inside the nucleus of such mutants. This paper summarizes recent findings and views on the mechanisms involved in synthesis, import, assembly and crystallization of this important peroxisomal enzyme.     

Multistage Zeolite Drying for Energy-Efficient Drying

This work discusses the potential of three multistage zeolite drying systems (counter-, co-, and cross-current) with a varying number of stages. The evaluation showed that for 2-4 stages with heat recovery the efficiency of the systems ranges between 80 and 90%. Additionally, by introducing a compressor, the latent heat in the exhaust air from the regenerator is recovered and used to heat the inlet air for an additional drying stage. As a result, for the counter-current drying system and compressor pressure 1.5-2 bar, a maximum energy efficiency of 120% is achieved, which results in halving the energy consumption compared to conventional drying systems.     

A Radiation Imaging Detector Made by Postprocessing a Standard CMOS Chip

An unpackaged microchip is used as the sensing element in a miniaturized gaseous proportional chamber. This letter reports on the fabrication and performance of a complete radiation imaging detector based on this principle. Our fabrication schemes are based on wafer-scale and chip-scale postprocessing. Compared to hybrid-assembled gaseous detectors, our microsystem shows superior alignment precision and energy resolution, and offers the capability to unambiguously reconstruct 3D radiation tracks on the spot.     

Photonic Demodulator With Sensitivity Control

A current assisted photonic demodulator for use as a pixel in a 3-D time-of-flight imager shows nearly 100% static demodulator contrast and is operable beyond 30 MHz. An integrated tunable sensitivity control is also presented for increasing the distance measurement range and avoiding unwanted saturation during integration periods. This is achieved by application of a voltage on a dedicated drain tap showing a quenching of sensor sensitivity to below 1%     

Towards Testing Product Line Architectures

A product line architecture is a single specification capturing the overall architecture of a series of closely related products. Its structure consists of a set of mandatory elements and a set of variation points. Whereas mandatory elements are part of the architecture of every product in the product line architecture, variation points precisely define the dimensions along which the architectures of individual products differ from each other.The increased use of product line architectures in today's software development projects poses several challenges for existing testing techniques. In this paper we discuss those challenges and discuss what we believe are opportunities for addressing them.     

GaAs pHEMT-based technology for microwave applications in a volume MMIC production environment on 150-mm wafers

The establishment of a 150-mm (6-in) gallium arsenide (GaAs) facility is described together with the development of very high yielding and cost-effective semiconductor device technologies and a manufacturing capacity of over 40000 wafers/annum. The background to the demand for very high volumes of RF products for this market is discussed, together with the prospects for future growth. The paper describes recent process development by the utilization of a data-driven yield management system to support the delivery of high-quality RF products to customers. Finally, "end of line" DC and RF testing of finished 150-mm GaAs pHEMT foundry wafers is described, enabling scalar measurements of power, noise, and intermodulation products as well as vector measurements of S-parameters and noise parameters at frequencies of up to 40 GHz.