Inkjet Printing of Self‐Assembled 2D Titanium Carbide and Protein Electrodes for Stimuli‐Responsive Electromagnetic Shielding

2D titanium carbides (MXene) possess significant characteristics including high conductivity and electromagnetic interference shielding efficiency (EMI SE) that are important for applications in printed and flexible electronics. However, MXene‐based ink formulations are yet to be demonstrated for proper inkjet printing of MXene patterns. Here, tandem repeat synthetic proteins based on squid ring teeth (SRT) are employed as templates of molecular self‐assembly to engineer MXene inks that can be printed as stimuli‐responsive electrodes on various substrates including cellulose paper, glass, and flexible polyethylene terephthalate (PET). MXene electrodes printed on PET substrates are able to display electrical conductivity values as high as 1080 ± 175 S cm^?1, which significantly exceeds electrical conductivity values of state‐of‐the‐art inkjet‐printed electrodes composed of other 2D materials including graphene (250 S cm^?1) and reduced graphene oxide (340 S cm^?1). Furthermore, this high electrical conductivity is sustained under excessive bending deformation. These flexible electrodes also exhibit effective EMI SE values reaching 50 dB at films with thicknesses of 1.35 µm, which mainly originate from their high electrical conductivity and layered structure.     

A recursive design methodology for VLSI: Theory and example

A novel VLSI (Very Large Scale Integration) methodology based on the hierarchical design of computational and system blocks is presented. The underlying algorithms used are shown to optimise the area-time complexity (AT²) of the computational units and at the system design level. The technique is illustrated for a matrix-matrix multiplication by using an image processing window convolver. This paper describes the performance of the recursive design technique comparing it to a typical systolic array, and demonstrates how data word size and convolution size may be expanded by movement up the architectural hierarchy. A prototype CAD (Computer Aided Design) autolayout program is described which maps directly into the hierarchical design environment. Using such design aids, flexible and correct designs may be generated which offer very simple data flow and highly local interconnection, with high performance.     

An image morphing technique based on optimal mass preserving mapping.

Image morphing, or image interpolation in the time domain, deals with the metamorphosis of one image into another. In this paper, a new class of image morphing algorithms is proposed based on the theory of optimal mass transport. The L(2) mass moving energy functional is modified by adding an intensity penalizing term, in order to reduce the undesired double exposure effect. It is an intensity-based approach and, thus, is parameter free. The optimal warping function is computed using an iterative gradient descent approach. This proposed morphing method is also extended to doubly connected domains using a harmonic parameterization technique, along with finite-element methods.     

Process and temperature compensation in a 7-MHz CMOS clock oscillator

This paper reports on the design and characterization of a process, temperature and supply compensation technique for a 7-MHz clock oscillator in a 0.25-/spl mu/m, two-poly five-metal (2P5M) CMOS process. Measurements made across a temperature range of -40/spl deg/C to 125/spl deg/C and 94 samples collected over four fabrication runs indicate a worst case combined variation of /spl plusmn/2.6% (with process, temperature and supply). No trimming was performed on any of these samples. The oscillation frequencies of 95% of the samples were found to fall within /spl plusmn/0.5% of the mean frequency and the standard deviation was 9.3 kHz. The variation of frequency with power supply was /spl plusmn/0.31% for a supply voltage range of 2.4-2.75 V. The clock generator is based on a three-stage differential ring oscillator. The variation of the frequency of the oscillator with temperature and process has been discussed and an adaptive biasing scheme incorporating a unique combination of a process corner sensing scheme and a temperature compensating network is developed. The biasing circuit changes the control voltage of the differential ring oscillator to maintain a constant frequency. A comparator included at the output stage ensures rail-to-rail swing. The oscillator is intended to serve as a start-up clock for micro-controller applications.     

Cross-phase modulation in multispan WDM optical fiber systems

The spectral characteristics of cross-phase modulation (XPM) in multispan intensity-modulation direct-detection (IM-DD) optical systems are investigated, both experimentally and theoretically. XPM crosstalk levels and its spectral features are found to be strongly dependent on fiber dispersion and optical signal channel spacing. Interference between XPM-induced crosstalk effects created in different amplified fiber spans is also found to be important to determine the overall frequency response of XPM crosstalk effects. XPM crosstalk between channels with different data rates is evaluated. The crosstalk level between higher and lower bit rate channels is found to be similar to that between two lower bit rate channels. The effect of dispersion compensation on XPM crosstalk in multispan optical systems is discussed and per span dispersion compensation was found to be the most effective way to minimize the effect of XPM crosstalk     

Low phase noise millimeter-wave frequency sources using InP-basedHBT MMIC technology

A family of millimeter-wave sources based on InP heterojunction bipolar transistor (HBT) monolithic microwave/millimeter-wave integrated circuit (MMIC) technology has been developed. These sources include 40-GHz, 46-GHz, 62-GHz MMIC fundamental mode oscillators, and a 95-GHz frequency source module using a 23.8-GHz InP HBT MMIC dielectric resonator oscillator (DRO) in conjunction with a GaAs-based high electron mobility transistor (HEMT) MMIC frequency quadrupler and W-band output amplifiers. Good phase noise performance was achieved due to the low 1/f noise of the InP-based HBT devices. To our knowledge, this is the first demonstration of millimeter-wave sources using InP-based HBT MMIC's     

A comparison of two micromachined inductors (bar- and meander-type)for fully integrated boost DC/DC power converters

Two micromachined integrated inductors (bar- and meander-type) are realized on a silicon wafer by using modified, IC-compatible, multilevel metallization techniques. Efforts are made to minimize both the coil resistance and the magnetic reluctance by using thick electroplated conductors, cores, and vias. In the bar-type inductor, a 25-μm thick nickel-iron permalloy magnetic core bar is wrapped with 30-μm thick multilevel copper conductor lines. For an inductor size of 4 mm×1.0 mm×110 μm thickness having 33 turns of multilevel coils, the achieved specific inductance is approximately 30 nH/mm² at 1 MHz. In the meander-type inductor, the roles of conductor wire and magnetic core are switched, i.e., a magnetic core is wrapped around a conductor wire. This inductor size is 4 mm×1.0 mm×130 μm and consists of 30 turns of a 35-μm thick nickel-iron permalloy magnetic core around a 10-μm thick sputtered aluminum conductor lines. A specific inductance of 35 nH/mm² is achieved at a frequency of 1 MHz. Using these two inductors, switched DC/DC boost converters are demonstrated in a hybrid fashion. The obtained maximum output voltage is approximately double an input voltage of 3 V at switching frequencies of 300 kHz and a duty cycle of 50% for both inductors, demonstrating the usefulness of these integrated planar inductors     

Simulations of electric field domain suppression in a superlattice oscillator device using a distributed circuit model

We present a method for simulating static domain formation in distributed negative differential resistance devices using a distributed circuit array model coupled with quantum transport simulations. This simulation method is applied to the case of a superlattice Bloch oscillator to ascertain the efficacy of electric field domain wall suppression by micro shunt side walls. Two independent simulation mechanisms using the same basic distributed circuit model are employed to separate simulation artifacts from true physical trends. Simulations are presented, suggesting that the presence of the micro shunt can suppress domain formation above a critical device bias voltage. The simulated dependence of this critical voltage on macroscopic device parameters is presented.     

增加折叠电流保护的电路

对许多需要数安培供电电流的应用而言，三端输出可调线性稳压器有易用．低成本和完全片上过载保护等特点，如美国国家半导体公司的LM317。增加数个元器件可以使三端稳压器具备一种高速度的短路限流能力，从而提高可靠性。限流器可将最大输出电流限制在一个安全的恒定水平IMAX上，避免稳压器的损坏。当出现一个故障状况时，传输晶体管上的功耗近似于VIN×IMAX。要让设计的稳压器能承受过载，就需要谨慎地选择元器件的额定值（经常是留了过大的余地），除非可以在故障发生时降低或折叠（foldback）输出电流。     

Asymptotic Bias and Variance of Conventional Bispectrum Estimates for 2-D Signals

In this paper, we derive the asymptotic bias and variance of conventional bispectrum estimates of 2-D signals. Two methods have been selected for the estimation: the first one – the indirect method – is the Fourier Transform of the weighted third order moment, while the second one – the direct method – is the expectation of the Fourier component product. Most of the developments are known for 1-D signals and the first contribution of this paper is the rigorous extension of the results to 2-D signals. The calculation of the bias of the direct method is a totally original contribution. Nevertheless, we did all calculations (bias and variance) for both method in order to be able to compare the results. The second contribution of this paper consists of the comparison of the theoretical bispectrum estimate bias and variance with the measured bias and variance for two 2-D signals. The first studied signal is the output of a non-minimal phase linear system driven by a non-symmetric noise. The second signal is the output of a non-linear system with Gaussian input data. In order to assess the results, we performed the comparison for both methods with different sets of parameters. We show that the maximum bias coefficient is the one of the 1-D case multiplied by the dimensionality of the signal for both methods. We also show that the estimate variance coefficient is the 1-D case coefficient with a power equal to the signal dimensionality.Received October 21, 2002; Revised December 2003; Accepted March 25, 2004; First Online Version published in December 2004