Double S-Shaped Polarization – Voltage Curve and Negative Capacitance from Al2O3-Hf0.5Zr0.5O2-Al2O3 Triple-Layer Structure

The negative capacitance (NC) effect, recently discovered in a fluorite-based ferroelectric thin film, has attracted great attention as a rescue to overcome the scaling limitations of the conventional memory and logic devices of highly integrated circuits. The NC effect manifesting an S-shaped polarization–voltage (P–V) curve is initially interpreted by a 1-dimensional Landau Ginzburg Devonshire (LGD) model. However, a series of recent studies have found that this effect can also be explained by the inhomogeneous stray field energy (ISE) model. In this study, by extending the ISE model in the ferroelectric (FE)-dielectric (DE) layered structure, an analytical model that considers the influence of the interfacial screening charge distribution is presented. This model showed that the NC effect in the FE-DE heterostructure can be manifested in various forms other than a single S-shaped P–V curve. In particular, a double S-shaped P–V curve is expected from the fully compensated anti-parallel domain structure, confirmed experimentally in the actual Al₂O₃/(Hf_0.5Zr_0.5)O₂/Al₂O₃ triple-layer structure. Furthermore, to reveal the origin of the double S-shaped P–V curve, a multidomain LGD model is presented. It is confirmed that this phenomenon is attributed to the evolution of inhomogeneous stray field energy.     

A Wide Locking Range Differential Colpitts Injection Locked Frequency Divider

This letter proposes a new wideband Colpitts injection locked frequency divider (ILFD) and describes the operation principle of the ILFD. The circuit consists of a differential CMOS LC-tank oscillator and a direct injection topology. The divide-by-two ILFD can provide wide locking range, and the measurement results show that at the supply voltage of 2.4 V, the tuning range of the free running ILFD is from 4.46 to 5.6 GHz, about 1.14 GHz, and the locking range of the ILFD is from 8.03 to 11.63 GHz, about 3.6 GHz, at the injection signal power of 0 dBm. The ILFD dissipates 19.92 mW at a supply voltage of 2.4 V and was fabricated in 1P6M 0.18 mum CMOS process. At the tuning voltage of 1.2 V, the measured phase noise of the free running ILFD is -110.8 dBc/Hz at 1 MHz offset frequency from 4.94 GHz and the phase noise of the locked ILFD is -135.4 dBc/Hz, while the input signal power is -4 dBm.     

Small molecule interlayer for solution processed phosphorescent organic light emitting device

Using a 4,4′,4′′-tris(N-carbazolyl)-triphenylamine (TCTA) small molecule interlayer, we have fabricated efficient green phosphorescent organic light emitting devices by solution process. Significantly a low driving voltage of 3.0 V to reach a luminance of 1000 cd/m² is reported in this device. The maximum current and power efficiency values of 27.2 cd/A and 17.8 lm/W with TCTA interlayer (thickness 30 nm) and 33.7 cd/A and 19.6 lm/W with 40 nm thick interlayer are demonstrated, respectively. Results reveal a way to fabricate the phosphorescent organic light emitting device using TCTA small molecule interlayer by solution process, promising for efficient and simple manufacturing.     

CARD资源发现架构在无线传感网络中的性能研究

(西北工业大学计算机学院,陕西西安,710072)【摘要】CARD架构适用于大规模、高查询率、每次查询的数据传输量较小的Ad-hoc网络,它的核心目标是降低网络资源发现能耗,延长网络生命周期。文章首先介绍了CARD架构的结构;然后,建立了该架构的数学模型,该模型以无线传感器网络为目标场景,并推导出CARD架构的能耗和查询成功率与各个参数之间的函数关系;最后,根据该模型对CARD架构的能耗和查询成功率进行了理论分析,为CARD架构的参数选择提供了可靠的依据,并为对架构的进一步优化打下了坚实基础。     

Simultaneous Static Testing of A/D and D/A Converters Using a Built‐in Structure

Static testing of analog‐to‐digital (A/D) and digital‐to‐analog (D/A) converters becomes more difficult when they are embedded in a system on chip. Built‐in self‐test (BIST) reduces the need for external support for testing. This paper proposes a new static BIST structure for testing both A/D and D/A converters. By sharing test circuitry, the proposed BIST reduces the hardware overhead. Furthermore, test time can also be reduced using the simultaneous test strategy of the proposed BIST. The proposed method can be applied in various A/D and D/A converter resolutions and analog signal swing ranges. Simulation results are presented to validate the proposed method by showing how linearity errors are detected in different situations.     

Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications

A highly reliable conductive adhesive obtained by transient liquid‐phase sintering (TLPS) technologies is studied for use in high‐power device packaging. TLPS involves the low‐temperature reaction of a low‐melting metal or alloy with a high‐melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag‐coated Cu, a Sn96.5‐Ag3.0‐Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 °C, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.     

New two-inductor boost converter with auxiliary transformer

A new, two-inductor, two-switch boost converter topology and its variations suitable for applications with a large difference between the input and output voltage are described. The output voltage regulation of the proposed converters is achieved in a wide load and input-voltage range with constant-frequency control by employing an auxiliary transformer that couples the current paths of the two boost inductors.     

Transmission of block turbo coded digital audio over FM-SCA

In this paper, an efficient coded scheme for transmitting digital audio over the existing FM channel, by multiplexing it with the baseband FM signal, is described. Transmission of multiplexed signals in the FM baseband called FM-SCA (subsidiary communications authorization) has been previously used for low quality analog content and some low rate digital content. The investigated scheme opens up the possibility of achieving CD quality audio over FM-SCA by enabling high bitrate transmission using MPEG-I layer 3 and MPEG-AAC audio coding for the digital audio. These schemes provide CD quality audio at or below 128 kbps, MPEG-AAC being able to do so at rates as low as 96 kbps. Block turbo codes (BTC), which offer near Shannon's limit performance with relatively low hardware complexity requirements, provide the error protection. Block turbo codes have been shown to be particularly effective for high coding rates. The system uses OFDM in conjunction with 8PSK/16PSK to modulate the digital bitstream and fit it in the 44 kHz (54 to 98 kHz) band available in the FM baseband. Simulation results show an optimal system configuration for digital audio transmission in FM-SCA.     

A dry-patterned Cu(Mg) alloy film as a gate electrode in a thin-film transistor liquid crystal display

The annealing of a Cu(4.5at.%Mg)/SiO₂/Si structure in ambient O₂ at 10 mtorr and 300–500°C allows for the out-diffusion of the Mg to the Cu surface, forming a thin MgO (15 nm) layer on the surface. The surface MgO layer was patterned and successfully served as a hard mask for the subsequent dry etching of the underlying Mg-depleted Cu films using an O₂ plasma and hexafluoroacetylacetone (H(hfac)) chemistry. The resultant MgO/Cu structure, with a taper slope of about 30°, shows the feasibility of dry etching of Cu(Mg) alloy films using a surface MgO mask scheme. A dry-etched Cu(4.5at.%Mg) gate a-Si:H thin-film transistor (TFT) has a field-effect mobility of 0.86 cm²/Vs, a subthreshold swing of 1.08 V/dec, and a threshold voltage of 5.7 V. A novel process for the dry etching of Cu(Mg) alloy films that eliminates the use of a hard mask, such as Ti, and results in a reduction in the process steps is reported for the first time in this work.