Ultra-wideband (from DC to 110 GHz) CPW to CPS transition

A new ultra-wideband, low-loss and small-size coplanar waveguide (CPW) to coplanar strip (CPS) transition which can be used from DC to 110 GHz is presented. The proposed transition connects CPW with CPS by the reformed air-bridge. Two ground planes of CPW are tied at their ends by a line and the centre of the line is connected to the ground strip of CPS by another line. Owing to the symmetry of the proposed structure, the currents of two ground planes of CPW are combined with the same phase and transferred to the ground strip of CPS. With height of 3 μm, the signal line of CPW passes over two connecting lines and is connected to the signal strip of CPS. For the back-to-back transition structure, insertion loss <1 dB and return loss >15 dB are obtained from 0.5 to 110 GHz     

Quartz microbalance study of4He and H2 on sodium

A quartz microbalance technique has been used to study the growth of⁴He and H₂ adsorbed on sodium. In contrast to cesium, adsorption of⁴He and H₂ do occur on a sodium surface.     

Energy release rates of crack kinking by boundary condition sensitivity analysis

The energy release rate, which is the total derivative of the energy with respect to crack length, is recognized as corresponding to the shape sensitivity analysis with the crack length change represented by the tangential component of design velocity. In this paper the sensitivity formula recently developed for a changing boundary condition has been further extended to cover crack kinking under mixed mode loading. Due to difficulty in defining the velocity field at the corner, the energy release rate at the onset of crack kinking is obtained by extrapolating the energy release rates for finite length kinked cracks. A rectangular plate with a single edge slant crack under uniform tension is taken as a numerical example. The multi-region technique in the numerical implementation of the boundary integral equation is adopted to consider the asymmetry of the problem. Excellent accuracy is observed as compared with reference analytic solutions.     

The prospects of non-volatile phase-change RAM

Phase-change read-and-write memory (PRAM) is a promising memory that can solve the problems of conventional memory—scalability, read/write speed, and reliability. We will review the opportunities and technical challenges of PRAM. The most important challenge of PRAM is the reduction of the writing current. Various approaches to reduce the writing current will be reviewed and the prospects of PRAM are discussed.     

Thermomechanical fatigue—damage mechanisms and mechanism-based life prediction methods

An existing extensive database on the isothermal and thermomechanical fatigue behaviour of high-temperature titanium alloy EVII 834 and dispersoid-strengthened aluminum alloy X8019 in SiC particle-reinforced as well as unreinv conditions was used to evaluate both the adaptability of fracture mechanics approaches to TMF and the resulting predictive capabilities of determining material life by crack propagation consideration. Selection of the correct microstructural concepts was emphasised and these concepts were, then adjusted by using data from independent experiments in order to avoid any sort of fitting. It is shown that the cyclic /-integral (δJ_eff concept) is suitable to predict the cyclic lifetime for conditions where the total crack propagation rate is approximately identical to pure fatigue crack growth velocity. In the case that crack propagation is strongly affected by creep, the creep-fatigue damage parameter δ_CF introduced by Riedel can be successfully applied. If environmental effects are very pronounced, the accelerating influence of corrosion on fatigue crack propagation can no longer implicitly be taken into account in the fatigue crack growth law. Instead, a linear combination of the crack growth rate contributions from plain fatigue (determined in vacuum) and from environmental attack is assumed and found to yield a satisfactory prediction, if the relevant corrosion process is taken into account.     

A One‐Kilobit PQR‐CMOS Smart Pixel Array

The photonic quantum ring (PQR) laser is a three dimensional whispering gallery (WG) mode laser and has anomalous quantum wire properties, such as microampere to nanoampere range threshold currents and √T‐dependent thermal red shifts. We observed uniform bottom emissions from a 1‐kb smart pixel chip of a 32×32 InGaAs PQR laser array flip‐chip bonded to a 0.35 µm CMOS‐based PQR laser driver. The PQR‐CMOS smart pixel array, now operating at 30 MHz, will be improved to the GHz frequency range through device and circuit optimization.     

Monolithic SiGe Up‐/Down‐Conversion Mixers with Active Baluns

The purpose of this paper is to describe the implementation of monolithically matching circuits, interface circuits, and RF core circuits to the same substrate. We designed and fabricated on‐chip 1 to 6 GHz up‐conversion and 1 to 8 GHz down‐conversion mixers using a 0.8 µm SiGe hetero‐junction bipolar transistor (HBT) process technology. To fabricate a SiGe HBT, we used a reduced pressure chemical vapor deposition (RPCVD) system to grow a base epitaxial layer, and we adopted local oxidation of silicon (LOCOS) isolation to separate the device terminals. An up‐conversion mixer was implemented on‐chip using an intermediate frequency (IF) matching circuit, local oscillator (LO)/radio frequency (RF) wideband matching circuits, LO/IF input balun circuits, and an RF output balun circuit. The measured results of the fabricated up‐conversion mixer show a positive power conversion gain from 1 to 6 GHz and a bandwidth of about 4.5 GHz. Also, the down‐conversion mixer was implemented on‐chip using LO/RF wideband matching circuits, LO/RF input balun circuits, and an IF output balun circuit. The measured results of the fabricated down‐conversion mixer show a positive power conversion gain from 1 to 8 GHz and a bandwidth of about 4.5 GHz.     

Neue Entwicklungen beim Hohlkatoden‐Gasflusssputtern. New Developments in Hollow Cathode Gas Flow Sputtering

The gas flow sputter technique was invented a few years ago particularly for the inexpensive fabrication of sophisticated ceramic layers. Meanwhile, it has matured and become increasingly powerful. Today it is on the verge of being applied in industrial fabrication processes. The present article gives an overview over the method, its characteristics and the numerous applications.