Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Routing Correlated Data with Fusion Cost in Wireless Sensor Networks

In this paper, we propose a routing algorithm called minimum fusion Steiner tree (MFST) for energy efficient data gathering with aggregation (fusion) in wireless sensor networks. Different from existing schemes, MFST not only optimizes over the data transmission cost, but also incorporates the cost for data fusion, which can be significant for emerging sensor networks with vectorial data and/or security requirements. By employing a randomized algorithm that allows fusion points to be chosen according to the nodes' data amounts, MFST achieves an approximation ratio of 5/4log(k + 1), where k denotes the number of source nodes, to the optimal solution for extremely general system setups, provided that fusion cost and data aggregation are nondecreasing against the total input data. Consequently, in contrast to algorithms that only excel in full or nonaggregation scenarios without considering fusion cost, MFST can thrive in a wide range of applications     

Novel method for simultaneous formation of wires and vias of a printed circuit board using nanoporous body

A new type of a flexible printed circuit board with landless vias is developed using a novel method called interconnection via nanoporous structure (INPS). This method can make wires and vias of the printed circuit board simultaneously by a single photo-exposure process. A new photo-induced selective plating method was used to impregnate a nanoporous substrate with copper, and a new photomask was designed, which constitutes of a completely vacant large hole for via and aggregation patterns of very fine holes for wire. Because of the simple process, the INPS board is characterized by landless vias and very fine circuit. Owing to the structure, it is also characterized by flexibility and detachable wires.     

Dielectric relaxation of vegetable-based polyurethane

Vegetable-based polyurethane (PU) was prepared in the thin film form by spin coating. This polymer is synthesised from castor oil, which can be extracted from the seeds of a native plant in Brazil called mamona. This polymer is biocompatible and is being used as material for artificial bone. The PU was characterised by dielectric spectroscopy in a wide range of frequency (10^–5 Hz to 10⁵ Hz) and by thermally stimulated discharge current (TSDC) measurements. The glass transition temperature (T _g = 39°C) was determined and using the initial rise method the activation energy was found to be 1.58 eV.     

Progressive damage modelling of SMC composite materials

The present work deals with the modelling of damage behaviour for sheet moulding compound (SMC) composite materials using a finite element analysis package. Specifically, a comparison is made between the results obtained experimentally for a three-point bending test, and those obtained from numerical simulation using a material model already implemented. The simulation has been performed for the material models available within the PAM-CRASH software. The simulation results are compared and validated with respect to experimentation.     

Nanoscale Crystallization in Amorphous Fe–P–Mn Alloys

Mössbauer effect measurements and physicochemical analysis demonstrate that annealing of amorphous Fe–P–Mn alloys leads to the formation of a nanocrystalline structure.     

TEM Studies of High Temperature Corrosion Behaviour of TiAl Intermetallics with Surface Modifications

The oxidation/sulphidation behaviour of a Ti‐46.7Al‐1.9W‐0.5Si alloy with a TiAl₃ diffusion coating was studied in an environment of H₂/H₂S/H₂O at 850^oC. The kinetic results demonstrate that the TiAl₃ coating significantly increased the high temperature corrosion resistance of Ti‐46.7Al‐1.9W‐0.5Si. The SEM, EDX, XRD and TEM analysis reveals that the formation of an Al₂O₃ scale on the surface of the TiAl₃‐coated sample was responsible for the enhancement of the corroison resistance. The Ti‐46.7Al‐1.9W‐0.5Si alloy was also modified by Nb ion implantation. The Nb ion implanted and as received sampels were subjected to cyclic oxidation in an open air at 800^oC. The Nb ion implantation not only increased the oxidation resistance but also substantially improved the adhesion of scale to the substrate.     

A real-time architecture for time-aware agents

This paper describes the specification and implementation of a new three-layer time-aware agent architecture. This architecture is designed for applications and environments where societies of humans and agents play equally active roles, but interact and operate in completely different time frames. The architecture consists of three layers: the April real-time run-time (ART) layer, the time aware layer (TAL), and the application agents layer (AAL). The ART layer forms the underlying real-time agent platform. An original online, real-time, dynamic priority-based scheduling algorithm is described for scheduling the computation time of agent processes, and it is shown that the algorithm's O(n) complexity and scalable performance are sufficient for application in real-time domains. The TAL layer forms an abstraction layer through which human and agent interactions are temporally unified, that is, handled in a common way irrespective of their temporal representation and scale. A novel O(n2) interaction scheduling algorithm is described for predicting and guaranteeing interactions' initiation and completion times. The time-aware predicting component of a workflow management system is also presented as an instance of the AAL layer. The described time-aware architecture addresses two key challenges in enabling agents to be effectively configured and applied in environments where humans and agents play equally active roles. It provides flexibility and adaptability in its real-time mechanisms while placing them under direct agent control, and it temporally unifies human and agent interactions.     

An effective compact analyzer of electron spin polarization

A compact electron polarimeter employing the classical Mott scheme has been developed and tested. The device has an efficiency of about 5.6×10⁻⁴, a maximum count rate of 5×10⁵ cps, dimensions 15 cm (diameter) × 25 cm (length), and a working voltage of 40 kV. The polarimeter can operate for a long time under arbitrary vacuum conditions without maintenance, exhibiting no changes in the main working characteristics, and obeys all requirements to the electron spin polarization studies on the modern level.