Method for predicting motion artifacts in matrix displays

Abstract— A method is proposed to measure and characterize motion artifacts in matrix displays. By using a fast, V(λ)‐corrected photodiode and a data‐acquisition system, accurate measurements of the temporal luminance behavior (step response) are recorded. The motion artifacts of LCDs and PDP displays are predicted from these measurements using the properties of the human‐visual system. The method is validated with perceptual evaluation experiments, for which a new evaluation protocol is established. In the end, new measures are proposed to quantify the motion‐rendering performance of these matrix displays.     

Innovation and HRM: Towards an Integrated Framework

This paper explores the connection between innovation (management) and human resource management. Much has been written about the both concepts separately, but there is no integrated conceptual framework available for the combination of the two. Our goal here is to develop such a framework. We do this in a number of steps, starting with a presentation of the existing approaches and models with respect to innovation (management) and HRM. This is followed by a search for the linkage between the two traditions, as a starting point for an integrated model and an in‐depth case study regarding the link between innovation and HRM, in order to further develop our model. We conclude with the presentation of our model and with suggestions for further research.     

C-HEAP: A Heterogeneous Multi-Processor Architecture Template and Scalable and Flexible Protocol for the Design of Embedded Signal Processing Systems

The key issue in the design of Systems-on-a-Chip (SoC) is to trade-off efficiency against flexibility, and time to market versus cost. Current deep submicron processing technologiesenable integration of multiple software programmable processors (e.g., CPUs,DSPs) and dedicated hardware components into a single cost-efficient IC. Ourtop-down design methodology with various abstraction levels helps designingthese ICs in a reasonable amount of time. This methodology starts with a high-levelexecutable specification, and converges towards a silicon implementation.A major task in the design process is to ensure that all components (hardwareand software) communicate with each other correctly. In this article, we tacklethis problem in the context of the signal processing domain in two ways: wepropose a modular, flexible, and scalable heterogeneous multi-processor architecturetemplate based on distributed shared memory, and we present an efficient andtransparent protocol for communication and (re)configuration. The protocolimplementations have been incorporated in libraries, which allows quick traversalof the various abstraction levels, so enabling incremental design. The designdecisions to be taken at each abstraction level are evaluated by means of(co-)simulation. Prototyping is used too, to verify the system's functionalcorrectness. The effectiveness of our approach is illustrated by a designcase of a multi-standard video and image codec.He currently works with Magma Design Automation. E-mail:     

用于打印机AC适配器的高效开关电源设计

由通用交流适配器供电的消费品和PC外设的数量正在迅速增长。该适配器是指能插入频率在47到63Hz间，提供电压有效值在90V至264V范围内的交流电插座上的适配器。这些AC适配器体积小巧且提供连续的超过50W的输出功率，从而使许多设备不再需要内置电源。在打印机等应用中，对峰值功率有较高的要求，它们在短时间的突发工作以外，要有相当长的一段时间     

Creativity (Ideas) Management in Industrial R&D Organizations: A Crea‐Political Process Model and an Empirical Illustration of Corus RD&T

Creativity management is a crucial topic to consider in the debate about the innovative research department. Against the background of discussions about individual creativity and organizational commitment, this article argues that the creative process in organizations is a matter of political strategies. The ideator literally has to sell his/her idea. The article therefore comes up with a crea‐political process model in which there is ample room for the thought that ideas emerge and survive within a social‐political context. In addition, the crea‐political process model is used to analyse the way in which the Corus Group Research Development and Technology (RD&T) department has implemented an electronic idea‐management system. The system, called eureka!, has been designed as a straightforward platform to capture, review, evaluate and select creative ideas. The findings challenge the literature on idea management in organizations to consider the political activities of ideators in the whole process of creativity.     

Directed assembly of functional light harvesting antenna complexes onto chemically patterned surfaces

We report the directed assembly of the photosynthetic membrane proteins LH1 and LH2 isolated from the purple bacterium Rhodobacter sphaeroides onto chemically patterned substrates. Nanoimprint lithography was used to pattern discrete regions of amino-?and fluoro-terminated or poly(ethylene glycol) self-assembled monolayers onto a glass substrate. Densely packed layers of assembled protein complexes were observed with atomic force microscopy. The protein complexes attached selectively to the amino-terminated regions by electrostatic interactions. Spectral images generated with a hybrid scanning probe and fluorescence microscope confirmed that the patterned proteins retained their native optical signatures.     

Systematic evaluation of land use regression models for NO₂

Land use regression (LUR) models have become popular to explain the spatial variation of air pollution concentrations. Independent evaluation is important. We developed LUR models for nitrogen dioxide (NO(2)) using measurements conducted at 144 sampling sites in The Netherlands. Sites were randomly divided into training data sets with a size of 24, 36, 48, 72, 96, 108, and 120 sites. LUR models were evaluated using (1) internal "leave-one-out-cross-validation (LOOCV)" within the training data sets and (2) external "hold-out" validation (HV) against independent test data sets. In addition, we calculated Mean Square Error based validation R(2)s. The mean adjusted model and LOOCV R(2) slightly decreased from 0.87 to 0.82 and 0.83 to 0.79, respectively, with an increasing number of training sites. In contrast, the mean HV R(2) was lowest (0.60) with the smallest training sets and increased to 0.74 with the largest training sets. Predicted concentrations were more accurate in sites with out of range values for prediction variables after changing these values to the minimum or maximum of the range observed in the corresponding training data set. LUR models for NO(2) perform less well, when evaluated against independent measurements, when they are based on relatively small training sets. In our specific application, models based on as few as 24 training sites, however, achieved acceptable hold out validation R(2)s of, on average, 0.60.     

Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost

One of the key challenges in 3D Stacked-ICs (3D-SIC) is to guarantee high product quality at minimal cost. Quality is mostly determined by the applied tests and cost trade-offs. Testing 3D-SICs is very challenging due to several additional test moments for the mid-bond stacks, i.e., partially created stacks. The key question that this paper answers is what is the best test flow to be used in order to optimize the overall cost while realizing the required quality? We first present a framework covering different test flows for 3D Die-to-Wafer (D2W) stacked ICs. Thereafter, we present a cost model that allows us to evaluate these test flows. The impact of different test flows on the overall 3D-SIC cost for several die yields and stack sizes are investigated; a breakdown of the cost into test, manufacturing and packaging cost is also provided. Our simulation results show that both the test cost and the overall cost in D2W stacking strongly depends on the selected test flow; test flows with pre-bond and mid-bond stacking tests (performed during the stacking process) show a higher test cost share, but significantly reduce the overall 3D-SIC cost.