Arm Poses Modeling for Pedestrians with Motion Prior

Arm pose of human, plays an import role for understanding human behaviours. It can directly carry information of people identity, action style, interaction manner, personal habit etc. However the high dynamics of arm parts, especially the movement of forearms and hands, makes that modeling arm parts with high accuracy is challenging. In order to overcome this problem in a specific application, such as modeling arm pose of pedestrians, this paper adopts multiple priors to decrease the uncertainty of arm parts. Firstly, the human structure information, i.e. the prior of human arm parts size, is adopted to remove the impossible arm configuration. Secondly, the prior of arm parts configuration of a specific action is used to constrain the co-occurrence relations of all arm components. Therefore, a Bayesian approach is presented for modeling arm pose to incorporate the multiple priors and the likelihoods from visual observation. This paper proposes an arm model in which its priors can be represented easily. It also describes the priors estimation from the CMU motion dataset by a kernel density estimation, and maximum a posteriori for modeling the parameters of arm parts. Since there are priors for walking style, this method can be directly used for arm pose modeling of pedestrians without pre-training. It is found perform effectively on a HKU campus testing dataset, and also been evaluated on different human sizes and lighting conditions.     

Scene categorization based on local–global feature fusion and multi-scale multi-spatial resolution encoding

With the bag-of-contextual-visual-word (BOCVW) models, we propose a scene categorization method based on local–global feature fusion and multi-scale multi-spatial resolution encoding. First, the performances of the BOCVW models belonging to different features are mutually reinforced by fusing other types of features within local regions. Then, the spatial configuration information is explored using a multi-scale multi-spatial resolution encoding approach. Furthermore, these encoded BOCVW models are globally fused using an improved maximum-margin optimization strategy, which considers the margin between input vectors of different categories and the diameter of the smallest ball containing feature vectors simultaneously. The proposed method has been evaluated on three scene categorization datasets consisting of scene categories 8, 15, and 67, respectively. And its effectiveness has been verified by these experimental results.     

Dielectric spectroscopy of fresh fruit and vegetable tissues from 10 to 1800 MHz.

Dielectric spectroscopy data from measurements on tissue samples of nine fresh fruits and vegetables were used to study their dielectric behavior over the frequency range from 10 MHz to 1.8 GHz at 5 to 65 degrees C. Dielectric constant and loss-factor data are presented graphically for apple, avocado, banana, cantaloupe, carrot, cucumber, grape, orange, and potato, showing dielectric constants ranging from values of several hundred at 10 MHz to less than 100 at 1.8 GHz and loss factors on the order of one thousand at 10 MHz to less than 20 at 1.8 GHz. The dielectric loss factor increased consistently with increasing temperature at frequencies below 1 GHz. The dielectric constant increased with temperature at lower frequencies, but it decreased with temperature at the higher frequencies. This reversal of the sign of the temperature coefficient occurred at some point in the frequency range between 20 and 120 MHz where the temperature dependence of the dielectric constant was zero. At frequencies below this point, ionic conduction dominates the dielectric behavior, but above that point dipolar relaxation appears to control the behavior. Multiple linear regression provided equations for calculation of the loss factor in the frequency range from 10 to 300 MHz at temperatures from 5 to 65 degrees C. The data provide new information useful in understanding dielectric heating behavior and evaluating dielectric properties of such agricultural products for quality sensing applications.     

手工式模拟设计获得自动化辅助

模拟仿真器与设计捕捉工具在EDA市场已有长久的历史,这个市场一直在为数字仿真器增加某些Spice。不过,当仿真结果要转换为正弦波和硅片时,模拟EDA工具就会远远落后于数字EDA工具的水平。这种情况正在开始改变,传统数字EDA供应商正在出现以纳米尺度数字工艺支持模拟功能晶圆制作的工具。另外,代工厂专用工具包也正在简化用模拟工艺实现模拟、RF大电压功能的过程。     

Non‐Geminate Recombination as the Primary Determinant of Open‐Circuit Voltage in Polythiophene:Fullerene Blend Solar Cells: an Analysis of the Influence of Device Processing Conditions

The physical origin of the open‐circuit voltage in bulk heterojunction solar cells is still not well understood. While significant evidence exists to indicate that the open‐circuit voltage is limited by the molecular orbital energies of the heterojunction components, it is clear that this picture is not sufficient to explain the significant variations which often occur between cells fabricated from the same heterojunction components. We present here an analysis of the variation in open‐circuit voltage between 0.4–0.65 V observed for a range of P3HT/PCBM solar cells where device deposition conditions, electrode structure, active‐layer thickness and device polarity are varied. The analysis quantifies non‐geminate recombination losses of dissociated carriers in these cells, measured under device operating conditions. It is found that at open‐circuit, losses due to non‐geminate recombination are sufficiently large that other loss pathways may effectively be neglected. Variations in open‐circuit voltage between different devices are shown to arise from differences in the rate coefficient for non‐geminate recombination, and from differences in the charge densities in the photoactive layer of the device. The origin of these differences is discussed, particularly with regard to variations in film microstructure. By separately quantifying these differences in rate coefficient and charge density, and by application of a simple physical model based upon the assumption that open‐circuit is reached when the flux of charge photogeneration is matched by the flux of non‐geminate recombination, we are able to calculate correctly the open‐circuit voltage for all the cells studied to within an accuracy of ±5 mV.     

Effects of Photo‐oxidation on the Performance of Poly[2‐methoxy‐5‐(3′,7′‐dimethyloctyloxy)‐1,4‐phenylene vinylene]:[6,6]‐Phenyl C61‐Butyric Acid Methyl Ester Solar Cells

A study of the photo‐oxidation of films of poly[2‐methoxy‐5‐(3′,7′‐dimethyloctyloxy)‐1,4‐phenylene vinylene] (MDMO‐PPV) blended with [6,6]‐phenyl C₆₁‐butyric acid methyl ester (PCBM), and solar cells based thereon, is presented. Solar‐cell performance is degraded primarily through loss in short‐circuit current density, J_SC. The effect of the same photodegradation treatment on the optical‐absorption, charge‐recombination, and charge‐transport properties of the active layer is studied. It is concluded that the loss in J_SC is primarily due to a reduction in charge‐carrier mobility, owing to the creation of more deep traps in the polymer during photo‐oxidation. Recombination is slowed down by the degradation and cannot therefore explain the loss in photocurrent. Optical absorption is reduced by photo‐bleaching, but the size of this effect alone is insufficient to explain the loss in device photocurrent.     

以太网供电技术的发展

面向以太网供电（PoE）的IEEE802．3af标准将以太网网络连接引向了一个全新的方向,即以10／100／1000Mbps数据速率一并输送DC功率。伴随PoE而出现的一组独特的问题和崭新的思维方式是许多拥有以太网设备设计经验的工程师过去所并不熟悉的。目前,PoE一般用于VoIP电话、无线接入点和安全摄像机。而随着PoE技术的进步,改进标准的呼声渐起,旨在造就新兴的应用。     

Electric Field Integral Equations for Electromagnetic Scattering Problems With Electrically Small and Electrically Large Regions

Numerically stable electric field integral equations (EFIE) are presented for electromagnetic scattering problems that may include both electrically small geometrically complex and electrically large regions. A reduced integrand is achieved by implementing quasi-static assumptions in the electrically small regions, full-wave methods in the electrically large regions, and applying appropriate coupling relations between the regions. Use of the method provides computational efficiency as well as insight into the conditions under which the electromagnetic fields within electrically small regions of the problem can be assumed to be primarily capacitive or inductive in nature. The theoretical development of the method is highlighted in this communication and then applied to examples of electrically small, inductively-loaded, and capacitively-loaded monopole antennas. The accuracy of the results is verified with two independent methods.     

在超便携应用中模拟开关的关键设计参数

近年来，开关产品纷纷进入PC、服务器、笔记本电脑和底座应用等领域，令许多芯片供应商推出各式总线开关产品。总线开关能够在板卡或器件插拔期间方便地隔离总线电容，通过隔离对数据(高速缓存和内存)进行多路复用，分解操作或进行电压变换。典型的总线开关设计为一个单独的NMOS器件，其缺点是：随着源电压接近Vcc，栅极的源-漏区被夹断，会限制电流的驱动能力和输出电压。     

An innovative technique for packaging power electronic buildingblocks using metal posts interconnected parallel plate structures

Power electronics building blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At the Center for Power Electronics Systems, we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double what could be achieved with commercially packaged devices of the same rating