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101.
102.
103.
Sanghoon Cheon Yong‐Hae Kim Seung‐Youl Kang Myung Lae Lee Taehyoung Zyung 《ETRI Journal》2012,34(4):527-535
A general equivalent circuit model is developed for a wireless energy transfer system composed of multiple coils via coupled magnetic resonances. To verify the developed model, four types of wireless energy transfer systems are fabricated, measured, and compared with simulation results. To model a system composed of n‐coils, node equations are built in the form of an n‐by‐n matrix, and the equivalent circuit model is established using an electric design automation tool. Using the model, we can simulate systems with multiple coils, power sources, and loads. Moreover, coupling constants are extracted as a function of the distance between two coils, and we can predict the characteristics of a system having coils at an arbitrary location. We fabricate four types of systems with relay coils, two operating frequencies, two power sources, and the function of characteristic impedance conversion. We measure the characteristics of all systems and compare them with the simulation results. The flexibility of the developed model enables us to design and optimize a complicated system consisting of many coils. 相似文献
104.
Min‐Soo Kang Bong‐Su Kim Kwang Seon Kim Woo‐Jin Byun Hyung Chul Park 《ETRI Journal》2012,34(5):649-654
This paper presents a novel 16‐quadrature‐amplitude‐modulation (QAM) E‐band communication system. The system can deliver 10 Gbps through eight channels with a bandwidth of 5 GHz (71‐76 GHz/81‐86 GHz). Each channel occupies 390 MHz and delivers 1.25 Gbps using a 16‐QAM. Thus, this system can achieve a bandwidth efficiency of 3.2 bit/s/Hz. To implement the system, a driver amplifier and an RF up‐/down‐conversion mixer are implemented using a 0.1 µm gallium arsenide pseudomorphic high‐electron‐mobility transistor (GaAs pHEMT) process. A single‐IF architecture is chosen for the RF receiver. In the digital modem, 24 square root raised cosine filters and four (255, 239) Reed‐Solomon forward error correction codecs are used in parallel. The modem can compensate for a carrier‐frequency offset of up to 50 ppm and a symbol rate offset of up to 1 ppm. Experiment results show that the system can achieve a bit error rate of 10?5 at a signal‐to‐noise ratio of about 21.5 dB. 相似文献
105.
运用改进的全矢量有效折射率法(IFVEIM),课题组自行设计了一种在900 nm附近具有低平坦色散高非线性特性的光子晶体光纤.并且在改进工艺的基础上,采用中心抽真空挤压法对其进行了制备.虽然所制得光纤的结构参数与理论设计值存在一定的偏差,但其在所研究波段内色散值仅为0.5 ps/km/nm,非线性系数值则达到了35(W*km)-1,这在当前规则结构的纯硅光子晶体光纤中已经很高.最后,我们对其进行了非线性实验测试,其在400~1 400 nm的波段范围内展现出了宽平坦的超连续谱. 相似文献
106.
Li-Wei Kang Ching-Yu Tseng Chao-Long Jheng Ming-Fang Weng Chao-Yung Hsu 《电子科技学刊:英文版》2017,15(2):141-146
Straightforward image resizing operators without considering image contents (e.g., uniform scaling) cannot usually produce satisfactory results, while content-aware image retargeting aims to arbitrarily change image size while preserving visually prominent features. In this paper, a cluster-based saliency-guided seam carving algorithm for content-aware image retargeting is proposed. To cope with the main drawback of the original seam carving algorithm relying on only gradient-based image importance map, we integrate a gradient-based map and a cluster-based saliency map to generate a more reliable importance map, resulting in better single image retargeting results. Experimental results have demonstrated the efficacy of the proposed algorithm. 相似文献
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109.
An Investigation of Microstructure and Microhardness
of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate 总被引:1,自引:0,他引:1
Sun-Kyoung Seo Sung K. Kang Da-Yuan Shih Hyuck Mo Lee 《Journal of Electronic Materials》2009,38(2):257-265
The microstructure and microhardness of Sn-xAg and Sn-xCu solders were investigated as functions of alloy composition and cooling rate. The Ag compositions examined varied from
0.5 wt.% to 3.5 wt.%, while Cu varied from 0.5 wt.% to 2.0 wt.%. Three cooling rates were employed during solidification:
0.02°C/s (furnace cooling), about 10°C/s (air cooling), and 100°C/s or higher (rapid solidification). Sn grain size and orientation
were observed by cross-polarization light microscopy and electron-backscattering diffraction (EBSD) techniques. The microhardness
was measured to correlate the mechanical properties with alloy compositions and cooling rates. From this study, it was found
that both alloy composition and cooling rate can significantly affect the Sn grain size and hardness in Sn-rich solders. The
critical factors that affect the microstructure–property relationships of Sn-rich solders are discussed, including grain size,
crystal orientation, dendrite cells, twin boundaries, and intermetallic compounds (IMC). 相似文献
110.