A back-projection autofocus algorithm based on flight trajectory optimization for synthetic aperture radar imaging

In this paper, a new autofocus algorithm is presented for back-projection (BP) image formation of synthetic aperture radar (SAR) imaging. The approach is based on maximizing a cost function obtained by prominent points in different sub-apertures of constructed SAR image by varying the flight trajectory parameters. While image-quality-based autofocus approach together with BP algorithm can be computationally intensive, we use approximations that allow optimal corrections to be derived. The approach is applicable for focusing different signal processing algorithms by obtaining modified flight trajectory parameters. Different examples demonstrate the effectiveness of the new autofocus approach applied to the frequency modulated continuous wave mode SAR dataset.     

Cloud service provisioning in two types of DCN with awareness of delay and link failure probability

Cloud service based on data center network (DCN) has become an attractive choice for various applications. Traditionally, multiple DCs are distributed at different nodes across a given optical network, and users access DCs through predefined routes (this architecture is named as Multiple Independent DCN, MI-DCN). However, as there exist transmission delay and failure probability on each link, such a network may not be a good choice for the service providers from the perspective of service reliability and cost. Therefore, we propose the idea of regrouping all the racks and distributing each rack group on a special node, where there exists a gateway (this architecture is named as Integrated Distributed DCN, ID-DCN). As each group can provide service independently, by properly grouping and routing, the whole network can work more efficiently with lower cost and higher reliability. In this paper, we study the service provision in the above two types of DCN. With the given failure probability and transmission delay on each link, we aim to minimize the total service cost and design the access routes for the demands originated from each node. To integrate the system cost, we introduce two cost scaling factors for delay and failure probability, which can be flexibly adjusted to control their relative importance (i.e., the weights). Based on mathematical approximation, a novel method is proposed to compute the failure probabilities of individual service paths. This translates our objective function into a linear expression. Then, we formulate two integer linear programs (ILP) to compare the solutions of the two scenarios. Via extensive numerical experiments, the performance of the two schemes is properly verified.     

Automatic computation of histogram threshold for lip segmentation using feedback of shape information

Threshold-based segmentation methods provide a simple and efficient way to implement lip segmentation. However, automatic computation of robust thresholds presents a major challenge. This research proposes an adaptive method for selecting the histogram threshold, based on feedback of shape information. The proposed method reduces unnecessary overhead by first comparing the initial segmentation to a reference lip shape model to decide if optimisation is required. In cases where optimisation is required, the algorithm adjusts the threshold until the segmentation is sufficiently similar to a reference shape model. The algorithm is tested on the AR Face Database by comparing the segmentation accuracy before and after optimisation. The proposed method increases the number of segmentations classified as ‘good’ (overlap above 90 %) by 7.1 % absolute, and significantly improves the segmentation in challenging cases containing facial hair.     

An Effective Power-Aware At-Speed Test Methodology for IP Qualification and Characterization

Advanced nanometer technologies have led to a drastic increase in operational frequencies resulting in the performance of circuits becoming increasingly vulnerable to timing variations. The increasing process spread in advanced nanometer nodes poses considerable challenges in predicting post-fabrication silicon performance from timing models. Thus, there is a great need to qualify basic building structures on silicon in terms of critical parameters before they could be integrated within a complex System-on-Chip (SoC). The work of this paper presents a configurable circuit and an associated power-aware at-speed test methodology for the purpose of qualifying basic standard cells and complex IP structures to detect the presence of timing faults. Our design has been embedded within test-chips used for the development of the 28 nm Fully Depleted Silicon On Insulator (FD-SOI) technology node. The relevant silicon results and analysis validate the proposed power-aware test methodology for qualification and characterization of IPs and provide deeper insights for process improvements.     

Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads

The intermetallic compounds formed during the reflow and aging of Sn-20In-2.8Ag ball-grid-array (BGA) packages are investigated. After reflow, a large number of cubic-shaped AuIn₂ intermetallics accompanied by Ag₂In precipitates appear in the solder matrix, while a Ni(Sn_0.72Ni_0.28)₂ intermetallic layer is formed at the solder/pad interface. With further aging at 100°C, many voids can be observed in the solder matrix and at the solder/pad interface. The continuous distribution of voids at the interface of specimens after prolonged aging at 100°C causes their bonding strength to decrease from 5.03 N (as reflowed) to about 3.50 N. Aging at 150°C induces many column-shaped (Cu_0.74Ni_0.26)₆(Sn_0.92In_0.08)₅ intermetallic compounds to grow rapidly and expand from the solder/pad interface into the solder matrix. The high microhardness of these intermetallic columns causes the bonding strength of the Sn-20In-2.8Ag BGA solder joints to increase to 5.68 N after aging at 150°C for 500 h.     

Dynamic Waveband Switching in WDM Mesh Networks Based on a Generic Auxiliary Graph Model

Waveband switching (WBS) is a promising technique to reduce the switching and transmission costs in the optical domain of a wavelength-division multiplexing (WDM) network. This paper considers the problem of provisioning dynamic traffic using WBS in a WDM mesh network. The network of interest is a homogeneous WBS network, where each node has the functionality of WBS. The problem is called the dynamic WBS problem, which involves searching waveband-routes or wavelength-routes for the dynamically arriving traffic requests. The objective is to minimize the total switching and transmission costs in the optical domain. To solve the dynamic WBS problem, an auxiliary graph model capturing the network state is proposed. Based on the auxiliary graph, two heuristic on-line WBS algorithms with different waveband grouping policies are proposed, namely the wavelength-first WBS algorithm based on the auxiliary graph (WFAUG) and the waveband-first WBS algorithm based on the auxiliary graph (BFAUG). Simulation results indicate that WBS is an attractive technique which reduces the overall switching and transmission costs by up to 30% in the network. The results also show that the WFAUG algorithm outperforms the BFAUG algorithm in terms of port savings and cost savings.     

Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications

There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. In this paper, several anisotropic conductive adhesive (ACA) pastes were formulated, which consist of diglycidyl ether of bisphenol F or diglycidyl ether of bisphenol A as polymer matrix, imidazoles as curing agents, and different sizes of silver (Ag) powders or gold (Au)-coated polymer spheres as conductive particles. The effects of ACA resin and different curing agents, as well as different conductive particles, on flexible substrate of the flip-chip joint were studied. The results show that the size and type of different conductive particles have very limited influence on an ACA flip-chip joint. The ACA resin as well as the curing agent can affect the reliability of the joint. The same results can be applied for the failure analysis of ACA flip-chip technology.     

应用BCB材料进行硅-玻璃气密性封装的实验与理论研究

应用苯并环丁烯(BCB)材料对硅片和玻璃片进行了250℃下的圆片级低温键合实验，同时进行了300℃下的硅片与玻璃片阳极键合实验，并对其气密性和剪切力特性进行了对比研究. 测试结果表明：在250℃的低温键合条件下，经过500kPa He气保压2h, BCB封装后样品的气密性达到(5.5±0.5)E-4Pacc/s He；剪切力在9.0~13.4MPa之间，达到了封装工艺要求；封装成品率达到100%. 这表明应用BCB材料键合是一种有效的圆片级低温气密性封装方法. 还根据渗流模型理论，讨论了简易模型下气密性（即渗流率）和器件腔体边缘到划片边缘的间距的关系.     

The Impacts of an Electronic Marketplace with Multiple Independent Retailers for Smart Grocery Ordering Systems

This study investigates the impacts of an electronic marketplace with multiple independent retailers for a smart grocery ordering system. Apart from replenishing products from suppliers, the system can also purchase/sell products from/to the electronic marketplace through ‘spot shops’. Both static and dynamic pricing models for the electronic marketplace are developed. An extensive numerical experiment is conducted and the results show that under both static and dynamic pricing, (i) the inventory cost of the aggregated supply chain is significantly reduced; (ii) each participant also enjoys significant cost savings from employing the electronic marketplace. Furthermore, the cost savings increase as the lead times from suppliers increase and/or the variability of their demands increases. The participants’ cost savings also increase as more participants employ the electronic marketplace.