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1.
应用静态吸附、动态吸附、程序升温脱附和程序升温还原等实验方法,考察了噻吩在Ni基非晶态合金上的吸附和脱附行为。常温下,噻吩分子首先吸附在清洁的Ni表面,并立刻被活化,发生氢解反应,C-S键断裂,释放出烃类部分,S留在Ni原子上。噻吩可以在Ni基非晶态合金表面发生强度不同的化学吸附。弱化学吸附的噻吩可以脱附;强化学吸附的噻吩不会脱附,而在高温下发生氢解反应。 相似文献
2.
IP网络实施QoS的策略分析 总被引:2,自引:0,他引:2
介绍了衡量IP QoS的技术指标和业务等级的划分,提出了IP网络中QoS的实施建议。 相似文献
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Low temperature wafer direct bonding 总被引:11,自引:0,他引:11
Qin-Yi Tong Cha G. Gafiteanu R. Gosele U. 《Journal of microelectromechanical systems》1994,3(1):29-35
A pronounced increase of interface energy of room temperature bonded hydrophilic Si/Si, Si/SiO2, and SiO2/SiO 2 wafers after storage in air at room temperature, 150°C for 10-400 h has been observed. The increased number of OH groups due to a reaction between water and the strained oxide and/or silicon at the interface at temperatures below 110°C and the formation of stronger siloxane bonds above 110°C appear to be the main mechanisms responsible for the increase in the interface energy. After prolonged storage, interface bubbles are detectable by an infrared camera at the Si/Si bonding seam. Desorbed hydrocarbons as well as hydrogen generated by a reaction of water with silicon appear to be the major contents in the bubbles. Design guidelines for low temperature wafer direct bonding technology are proposed 相似文献
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6.
环境保护地理信息系统的设计 总被引:8,自引:0,他引:8
本文主要介绍基于计算机网络的通用型环境保护地理信息系统的功能和实现方法。 相似文献
7.
The bonding of β'-Al2O3 and pyrex glass to Al matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope (SEM), energy dispersive X-ray fluorescence spectrometer (EDX). It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding. 相似文献
8.
Shaofeng Wang Jianwei Xu Yuejin Tong Lin Wang Chaobin He 《Polymer International》2005,54(9):1268-1274
A novel cholesterol‐imprinted polymer (CMIP‐H) was prepared by a hybrid method of covalent imprinting and non‐covalent imprinting. This approach involves the copolymerization of a template‐containing monomer, cholesteryl 2‐hydroxyethyl methacrylate carbonate, and a cross‐linker, followed by hydrolysis to afford a flexible guest‐binding site accompanied with the easy and efficient removal of a ‘sacrificial spacer’. The effect of solvent on the binding capacity of CMIP‐H towards cholesterol was studied, indicating that a good binding capacity towards cholesterol could be achieved in a less‐polar solvent. The binding experiments of CMIP‐H towards a series of structural analogues of cholesterol, including cholesterol acetate, progesterone and stigmasterol, were carried out in hexane. The results showed that CMIP‐H almost did not bind cholesterol acetate at all because the hydrogen‐bonding site is blocked. It exhibited a similar binding towards both cholesterol and stigmasterol, but much higher binding towards progesterone. Copyright © 2005 Society of Chemical Industry 相似文献
9.
已建成的兰州重离子加速器的真空室是一个大型整体结构的超高真空容器,直径约10m,高4.5m,重65000kg,内表面积211m~2,容积100m~3,工作真空度为5×10~(-5)Pa。采用有限单元法在计算机上用SAP-5C程序对真空室受力分析进行了计算。真空室结构材料选用瑞典Uddeholm钢厂生产的316 L 超低碳不锈钢。承制此大型容器的是航天工业部风华机器厂。由于结构庞大,首先将真空室分成八大块和几小块在工厂制造,然后运至现场焊制成一整体容器并进行机械加工。所有密封焊缝均用着色渗透液,X-射线探伤和氦质谱探漏仪进行检查和探漏。 相似文献
10.
Dongchang Sun Liyong Tong 《International journal for numerical methods in engineering》2004,60(11):1911-1932
A novel finite element model is presented for static and dynamic analysis of composite plates integrated with a laminated piezoelectric layer, a host laminated composite plate and an adhesive layer between them. A new adhesive element is developed which includes both peel and shear effects in the adhesive layer based on first‐order shear deformation plate theory. The thin adhesive layer between the piezoelectric layer and the host plate is modelled by assuming that it carries constant shear and peel strains throughout its thickness. In addition, a weighted static shape control scheme for finding the optimal voltage distribution for static shape control is given. By selecting different weighting matrices, a variety of items such as displacements, slopes, curvatures, strains and even generalized forces, can be included in finding the optimal actuating voltage for static shape control. The present model is validated by comparing with those results available in the literature. The numerical results show that the weighted linear least method can give a satisfactory voltage distribution to best match the desired shape. Copyright © 2004 John Wiley & Sons, Ltd. 相似文献