Overlay models in time-dependent non-linear material analysis

It is indicated how overlay models can be employed in time-dependent material studies. A basic component is employed which allows an instantaneous elastic response followed by viscous deformation, the onset of which is governed by the yield limit of a parallel friction slider. By combining several of these components in the form of overlays it is shown how several standard material behaviours can be reproduced. In particular the case of visco-elastic-plastic deformation is considered in detail. Numerical examples are provided.     

Coronary artery dissection - a complication of cardiac catheterization without sequelae: case report and review of the literature

This report describes an acute right coronary artery dissection occurring during diagnostic cardiac catheterization. Following catheter manipulation in the vicinity of the aortic valve, the patient complained of mild chest discomfort and had transient electrocardiographic evidence of acute inferior wall myocardial infarction with runs of 2:1 atrioventricular block. Within 5 min, the EKG reverted to precatheterization appearance, and the patient was asymptomatic. Coronary angiography revealed a dissection of the proximal vessel without obstruction. The patient had no clinical sequelae while monitored in the intensive care unit. The patient underwent elective aortic and mitral valve replacement. The area of the dissection was directly visualized, and no abnormality was noted. We review the literature of spontaneous and iatrogenic coronary artery dissections with regard to pathology, diagnosis, and prognosis, and make recommendations for therapy.     

A hybrid wafer-dicing process for GaAs MMIC production

A dicing process for GaAs MMIC (monolithic microwave integrated circuit) wafers using spin-on wax for wafer mounting and a hybrid process of wet chemical etching/mechanical sawing for chip dicing is described. This process minimizes ragged chip edges and reduces generation of microcracks in addition to the elimination of the plated gold burrs on the backside of the diced MMIC chips. This process gives a uniformity of -3 μm across a 2-in wafer following the completion of the whole backside process. This GaAs chip dicing technique is amenable to production because it exhibits both a very high chip yield (>90%) and nearly flawless edges     

Bench-scale evaluations and mechanistic studies of intumescent/fire-protective coatings for polyvinyl chloride nitrile rubber

The object of this study was to identify, for future large-scale testing, and adequate fire-protective coating for the substrate, polyvinyl chloride (PVC) nitrile rubber (MIL-P-15280 Rev H). Fifteen fire protective coatings which included ten intumescent, two ablatives, two fire retardants and one photon diffusive coatings were evaluated using bench-scale thermal insults. To discern the possible mechanism(s) whereby the coatings offer fire protection, the effect of radiant heat versus the flame source employed was investigated and thermogravimetric analysis (TGA) of the neat coatings was performed. In selected cases, the effect of coating thickness and repeatability of the results were evaluated. The differences in coating effectiveness, and the varied repeatability in three of the four cases examined, focus on the inherent complexity of intumescence, as well as on the importance of scaled-up testing of coatings that appeared promising. Thermogravimetric analyses of the coatings indicate that two selected TGA measurements/parameters, when used in conjunction, appear useful in characterizing mechanistic differences between the less effective and more effective coatings. Based on the rigorous criterion adopted, one candidate (a water-based intumescent coating at 100 mil (2.54 mm) thickness) appears promising for the substrate, PVC nitrile rubber. Its effectiveness is attributable to it exhibiting good insulative and re-radiative properties and an apparent low susceptibility to crack formation.