The simulation of some chemotactic bacteria patterns in liquid medium which arises in tumor growth with blow-up phenomena via a generalized smoothed particle hydrodynamics (GSPH) method

In the recent decades, the biological models have been noticed to find a suitable numerical procedure. Among the biological models, equations in tumor growth have many applications. In the current paper, we consider some equations in chemotaxis and haptotaxis models. The studied models have blow-up phenomena in their solutions. In addition, the proposed numerical technique is based on a meshless method that is well-known generalized smoothed particle hydrodynamics (SPH) method.

     

A tuned hybrid intelligent fruit fly optimization algorithm for fuzzy rule generation and classification

Fuzzy rule-based systems (FRBSs) are well-known soft computing methods commonly used to tackle classification problems characterized by uncertainties and imprecisions. We propose a hybrid intelligent fruit fly optimization algorithm (FOA) to generate and classify fuzzy rules and select the best rules in a fuzzy if–then rule system. We combine a FOA and a heuristic algorithm in a hybrid intelligent algorithm. The FOA is used to create, evaluate and update triangular fuzzy rule-based and orthogonal fuzzy rule-based systems. The heuristic algorithm is used to calculate the certainty grade of the rules. The parameters in the proposed hybrid algorithm are tuned using the Taguchi method. An experiment with 27 benchmark datasets and a tenfold cross-validation strategy is designed and carried out to compare the proposed hybrid algorithm with nine different FRBSs. The results show that the hybrid algorithm proposed in this study is significantly more accurate than the nine competing FRBSs.

     

On selection of forwarding nodes for long opportunistic routes

Opportunistic routing is a promising routing paradigm which increases the network throughput. It forces the sender’s neighbors, who successfully overheard the transmitted packet, to participate in the packet forwarding process as intermediate forwarding nodes. As a seminal opportunistic routing protocol, MORE combines network coding idea with opportunistic routing to eliminate the need for strict coordination among active forwarding nodes. In this paper, we show that MORE performance does not scale well with the route length, especially when the route length goes beyond two hops. Also, we found that MORE fails to establish a working opportunistic route in sparse networks. Clearly, the network throughput is directly influenced by both the quantity and quality of forwarding nodes, and their cooperation order. In this paper, we propose a new forwarder selection mechanism which considers the route length, link qualities, the distance from the source, and nodes density. It eliminates the occasional route disconnectivity happening in MORE and improves the quality of the established opportunistic routes. The simulation result indicates that our proposal always outperforms MORE when dealing with long opportunistic routes.

     

A novel super compact half‐mode substrate‐integrated waveguide filter using modified complementary split‐ring resonator

A novel super compact filter based on half‐mode substrate‐integrated waveguide (HMSIW) technology loaded by the modified complementary split‐ring resonator (MCSRR) is proposed. The working principle of the proposed filter is based on the evanescent‐mode propagation technique. According to this technique, by loading the complementary split‐ring resonator (CSRR) on the metal surface of the substrate‐integrated waveguide (SIW) structure, an additional passband below the SIW cutoff frequency can be obtained. In order to miniaturize the physical size of the conventional CSRR, a new method is introduced. In the proposed MCSRR unit‐cell, the meander slots are carved inside all of the interior space of the ring. Accordingly, the length of the slot is increased which leads to an increase in the inductor and capacitor of the proposed structure without occupying the extra space. Therefore, the electrical size of the proposed MCSRR unit‐cell is reduced. Consequently, the resonance frequency of the proposed MCSRR unit‐cell is decreased compared to the conventional CSRR with the same sizes. Namely, the lower resonance frequencies can be achieved by using this technique without increasing the size of the unit‐cell. In order to confirm the miniaturization technique, two HMSIW filters loaded by the proposed MCSRR unit‐cell are designed, fabricated, and experimental verifications are provided. The results show that a miniaturization about 67% is achieved.     

Compact metamaterial unit‐cell based on stepped‐impedance resonator technique and its application to miniaturize substrate integrated waveguide filter and diplexer

In this article, a new miniaturized metamaterial unit‐cell using stepped‐impedance resonator technique is proposed. The proposed unit‐cell is used to miniaturize the physical size of the conventional complementary split‐ring resonators (CSRRs). In the proposed unit‐cell which is called complementary G‐shaped resonator (CGR), the slot line in the conventional circular CSRR is replaced with the stepped‐impedance slot line. As well as, by carving two trapezoidal shapes inside the inner ring, the resonance frequency of the proposed CGR unit‐cell has been more decreased. Compared to the conventional circular CSRR structure, the electrical size of the proposed CGR is decreased and miniaturization is occurred. To investigate the performance of the proposed CGR unit‐cell in the size reduction, two substrate integrated waveguide filters and a diplexer are designed. To validate the proposed miniaturization technique, the designed filters and diplexer loaded by the CGR unit‐cell are fabricated and measured. The measured results are in a good agreement with the simulated ones. The results shows that, a miniaturization factor about 0.69 is achieved.     

Hybrid IG-FE method applied to cohesive fracture/contact in particle-filled elastomeric composites

International Journal of Mechanics and Materials in Design - In this paper, employing a new numerical framework, a 2D investigation is conducted on the effect of fiber-matrix contact/debonding on...     

Copper effects in mechanical,thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy

The Sn–3.5 wt%Ag alloy considered as a good alternative to Pb–Sn alloys. This study aims to investigate the effects of Cu or Sb additions by 3 or 5 wt% to melt-spun Sn–3.5%Ag alloy. Ternary melt-spun Sn–Ag–Cu and Sn–Ag–Sb alloys investigated using X-ray diffractions (XRD), Scanning electron microscope (SEM), Dynamic resonance technique (DRT), Instron machine, Vickers hardness tester and Differential scanning calorimetry (DSC). The results revealed that the microstructures of the β-Sn phase, Ag₃Sn and Cu₃Sn intermetallic compounds (IMCs) in the solder matrices were refined due to the effect of Cu additions and melt-spun process. Moreover, increasing Cu content promotes Ag₃Sn intermetallic compound (IMC) formation. Consequently, the addition of “3 wt%” of Cu reduced the creep rate ? from (3.79?×?10^?3) to (1.65?×?10^?3) and delayed the fracture point. The tensile results showed an improvement in Young’s modulus by 47% (30.3 GPa), ultimate tensile strength (UST) by 11.6% (23.9 MPa), and in toughness by 20.5% (952.32 J/m³) compared to the eutectic Sn–Ag alloy. Vickers hardness has improved by 3.3% (136.71 MPa) and thermal activation energy by 54% (90.40 KJ/mol) when compared with that of eutectic Sn–Ag alloy. Those improvements are related to the lack of lattice strain from 7.56?×?10^?4 without “3 wt%” of Cu to 5.26?×?10^?4 with “3 wt%” of Cu. Its melting temperature (T_m) increased by 3 °C due to Ag₃Sn IMC increased and Cu₃Sn formation, but the pasty rang (mushy zone) decreased by 4 °C with “3 wt%” of Cu. The small lattice strains resulted with “3 wt%” of Cu made the electrical resistivity of this alloy more stable at elevated temperatures. The mechanical, thermal and electrical improvements of Sn_93.5–Ag_3.5–Cu₃ alloy provide good physical performance for soldering process and electronic assembly.