The radiation of a rectangular power-bus structure at multiple cavity-mode resonances

The radiation from power-bus structures on high-speed printed circuit boards due to the switching noise current of digital integrated circuits is investigated. The study is based on an analytical cavity-resonator model for a rectangular parallel-plate structure. Based on the application of the field-equivalence principle, the radiated field is calculated from the electric edge-field distribution. For typical board dimensions, several cavity-mode resonances occur within the typical frequency range of interest, leading to relatively high maximum values for radiated emission. The evaluation of the radiation patterns reveals that all (0, nth) resonances have equal maximum amplitudes in the whole mode spectrum. This allows the setting up of an engineering equation for quantifying the noise-current-related maximum radiated field strength, including the dielectric and ohmic loss. Among all geometrical and material parameters, the dielectric thickness is one of the most effective ones to control radiated emission. The theoretical results are well confirmed by accurate measurements carried out in an anechoic room.     

High-performance MIM capacitor using ALD high-k HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectrics

For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectric using atomic layer deposition (ALD) technique. Our data indicates that the laminate MIM capacitor can provide high capacitance density of 12.8 fF//spl mu/m/sup 2/ from 10 kHz up to 20 GHz, very low leakage current of 3.2 /spl times/ 10/sup -8/ A/cm/sup 2/ at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic one of 1830 ppm/V/sup 2/, temperature coefficient of capacitance of 182 ppm//spl deg/C, and high breakdown field of /spl sim/6 MV/cm as well as promising reliability. As a result, the HfO/sub 2/-Al/sub 2/O/sub 3/ laminate is a very promising candidate for next generation MIM capacitor for radio frequency and mixed signal integrated circuit applications.     

Low-temperature poly-SiGe alloy growth of high gain/speed pin infrared photosensor with gold-induced lateral crystallization (Au-ILC)

The hydrogenated poly-silicon germanium (poly-SiGe:H) epitaxial film has been investigated using gold-induced lateral crystallization (Au-ILC) technology on a-SiGe:H layers at 10-h 350/spl deg/C annealing temperature and 60-sccm hydrogen (H/sub 2/) content. Using this optimal condition, the growth rate of the induced Au was as large as 15.9 /spl mu/m/h. With a low annealing temperature (/spl les/400/spl deg/C) and large growth rate, this novel technology will be noticeably useful for poly-SiGe:H pin IR-sensing fabrication on a conventional precoated indium tin oxide (ITO)-glass substrate. Under a 1-/spl mu/W IR-LED incident light (with peak wave length at 710 nm) and at a 5-V biased voltage, the poly-SiGe:H pin IR sensor developed by the Au-ILC technology, i.e., an Al (anode)/n poly-SiGe:H/i poly-SiGe:H/p poly-SiGe:H/ITO (cathode)/glass-substrate structure allowed for maximum optical gain and response speed. The optical gains and the response speeds were almost 600 and 130%, respectively, better than that of a traditional pin type. Meanwhile, the FWHM of a poly-SiGe:H pin sensor with Au-ILC technology was reduced from 280 to 150 nm. This reveals excellent IR-sensing selectivity. These IR-sensing trials demonstrated again that the proposed Au-ILC technology has very useful application in the field of low cost integrated circuits on optoelectronic applications.     

Near-ML multiuser detection with linear filters and reliability-based processing

The prohibitive - exponential in the number of users - computational complexity of the maximum-likelihood multiuser detector for direct-sequence code-division multiple-access communications has fueled an extensive research effort for the development of low-complexity multiuser detection alternatives. We show that we can efficiently and effectively approach the error rate performance of the optimum multiuser detector as follows. We utilize a multiuser zero-forcing or minimum mean-square error (MMSE) linear filter as a preprocessor and we establish that the output magnitudes, when properly scaled, provide a reliability measure for each user bit decision. Then, we prepare an ordered, reliability-based error search sequence of length linear in the number of users; it returns the most likely user bit vector among all visited options. Numerical and simulation studies for moderately loaded systems that permit exact implementation of the optimum detector indicate that the error rate performance of the optimum and the proposed detector are nearly indistinguishable over the whole predetection. signal-to-noise ratio range of practical interest. Similar studies for higher user loads (that prohibit comparisons with the optimum detector) demonstrate error rate performance gains of orders of magnitude in comparison with straight decorrelating or MMSE multiuser detection.     

Hydrogen annealing effect on DC and low-frequency noise characteristics in CMOS FinFETs

The hydrogen annealing process has been used to improve surface roughness of the Si-fin in CMOS FinFETs for the first time. Hydrogen annealing was performed after Si-fin etch and before gate oxidation. As a result, increased saturation current with a lowered threshold voltage and a decreased low-frequency noise level over the entire range of drain current have been attained. The low-frequency noise characteristics indicate that the oxide trap density is reduced by a factor of 3 due to annealing. These results suggest that hydrogen annealing is very effective for improving device performance and for attaining a high-quality surface of the etched Si-fin.     

Failure mode transition and energy dissipation in naturally occurring composites

The microstructural aspects of compressive inelastic deformation in balsa wood are investigated with emphasis on the failure mode transition and its effects on energy dissipation characteristics. The architectural features as well as the composite character of cell wall ultrastructure are discussed in a framework to understand the complex interrelationship between microstructure and macroscopic behavior in this extremely lightweight cellular biocomposite. Based on this discussion and experimental results, it is concluded that the biomimetic approach may prove to be a viable strategy in designing composite structures with high specific energy absorption capacity.     

用于单芯片系统的改进型WXGA LCoS成像器

本文讨论用于单芯片时序混色的菲利浦DD-720硅基液晶(LCoS)片。这种芯片主要用于HDTV背投影机和多媒体系统。与菲利浦以前的单片LCoS设计相比，由于该芯片具有电接口接点较少、封装简单和温度传感器内置等许多特点，使其应用于投影系统时成本降低。     

Fringing in tubular permanent-magnet machines: Part I. Magnetic field distribution, flux linkage, and thrust force

This paper extends an analysis developed for tubular permanent-magnet machines to account for the effect of fringing associated with the finite length of the ferromagnetic armature core. The magnetic field distribution, established by using an analytical technique formulated in the cylindrical coordinate system, provides an accurate means of evaluating the effect of the fringing flux on the thrust force and the back-electromotive force. Finite-element calculations confirm the analytically derived results. In Part II of the paper, the analysis is used to predict the cogging force that results from end effects and to facilitate minimization of the force.     

Effect of anisotropy of tin on thermomechanical behavior of solder joints

Properties of body centered tetragonal tin are highly anisotropic. As a consequence large stresses can develop at the tin grain boundaries due to coefficient of thermal expansion mismatch during temperature excursions. A modeling approach to evaluate the 3D stress states that develop at grain boundaries during thermomechanical fatigue in tin-based solder is presented. Development of significant amounts of stresses in the plane of the grain boundary can cause grain-boundary sliding and surface-relief effects, while those normal to the grain boundary can cause grain-boundary decohesion and cracking.