Wear-resistant magnetic head using amorphous alloy material

An audio recording/playback head using an amorphous (Fe-Co-Ru-Cr) ₇₅(Si-B)₂₅ alloy was developed. Compared with a commercial Sendust head, three excellent features were observed. The wear of the amorphous alloy head when used with γ-Fe₂O ₃ is two-thirds that of the Sendust head. The output level at high-frequency (14 kHz) is 5 dB higher than that of the Sendust head. The bias current for the amorphous alloy head is half that of the Sendust head     

Quantum and Classical Correlations of Spatial and Spin Degrees of Freedom in Quantum Rings

A one-dimensional mesoscopic ring with one input and two output leads acts as a spintronic beam splitter. The spatial degree of freedom, i.e., the presence of two different possible output channels, gets intertwined with the spin direction as a consequence of quantum interference and spin-orbit interaction. We investigate this kind of spatial-spin correlation, and show that the output density operator contains no quantum entanglement in the important special case when the device polarizes a perfectly random input spin state. However, the correlations are in general not purely classical, we also present specific input states with maximal spatial-spin entanglement after the ring.     

Occupational airway diseases in the metalworking industry Part 1: Respiratory infections, pneumonia, chronic bronchitis and emphysema

Occupational airway diseases are now receiving attention in industry, although study is hampered by a lack of readily-available data. The interpretation of the data that is available, and also of the root problems themselves, is itself a difficult problem. This paper has been written as a literature review which it is hoped that other researchers can take either as a starting point or as a refresher.     

Evaluating and monitoring nucleation and growth in copper foil

The electrodeposition of copper foil for use in electronic materials applications is a complex and demanding process. The specific aspects of producing and controlling the structure-property-performance requirements of the foil are important because of the stringent demands placed on their use in printed circuit boards and similar products. In this paper, a brief review of the electrodeposition process for raw copper foil is presented. Since electrolyte additives play such a significant role in the copper-depositionprocess, the effects of two essential additives, chloride ion and an organic (e.g., glue or gelatine), on the foil are described. Also, the influence of other operating parameters on the initial nucleation, growth, and subsequent electrocrystallization are discussed. Selected characterization methods, such as polarization and scanning electron micrography techniques, are described as a means of monitoring the process, but universally accepted methods of evaluating and controlling the additives and foil quality during electrolysis are still being sought.     

Studies on the sample weight for ochratoxin A determination in raw coffee

Ochratoxin A is a mycotoxin that may cause damage to the kidneys and the immune system in man. Foods are examined for this contaminant by the laboratories responsible for official food control. At present, there are no specific provisions for the sampling and examination of ochratoxin A in foods. Therefore, recourse is made to the provisions for aflatoxins. They prescribe the processing of samples with a weight of up to 30 kg. The examination of raw coffee for ochratoxin A in conjunction with the German Food Monitoring Programme of 2000 was undertaken with various sample weights (5, 10 and 30 kg) in order to identify the influence of the sample weight on the result. Overall, the sample weight did not have an effect on the detection and level of the ochratoxin A content in the samples of raw coffee examined.     

Floating-island TFT leakage caused by process step reduction

The leakage mechanism for a top-gate thin-film transistor (TFT) produced using the fewest process steps in the industry is analyzed in order to achieve a high-contrast liquid crystal display (LCD). Using a T-shaped TFT structure, the OFF and ON channel lengths are defined independently, so that the leakage can be reduced with no ON current decrease     

Growth Stresses in the Oxide Scales on TiAl Alloys at 800 and 900°C

In the oxidation of TiAl alloys, the role of scale-growth stresses formed during oxidation has, thus far, been unknown. In the present paper the oxide-growth stresses were investigated by the deflection-test method in monofacial oxidation (DTMO) accompanied by acoustic-emission measurements. On unmodified surfaces the growth stresses are compressive and reach levels of around –100 MPa. At the same time, significant acoustic emission occurs indicating that even under isothermal conditions, stresses are relieved by a scale-cracking mechanism. For oxide scales on TiAl surfaces, which had been ion implanted with chlorine before oxidation, a very thin protective alumina layer is formed which, however, develops growth stresses in the range of several GPa, accompanied by intensive acoustic emission. In all stress–time curves, a dynamic situation is observed. This consists of phases of stress relief by scale microcracking and phases of stresses increase due to crack healing and further oxide growth. As a result, the level of stress as a function of oxidation time, is characterized by an oscillating course.