Novel Maskless Bumping for 3D Integration

A novel, maskless, low‐volume bumping material, called solder bump maker, which is composed of a resin and low‐melting‐point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out‐gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 µm and 150 µm.     

Mass Spectrometry-Based Disulfide Mapping of Lysyl Oxidase-like 2

Lysyl oxidase-like 2 (LOXL2) catalyzes the oxidative deamination of peptidyl lysines and hydroxylysines to promote extracellular matrix remodeling. Aberrant activity of LOXL2 has been associated with organ fibrosis and tumor metastasis. The lysine tyrosylquinone (LTQ) cofactor is derived from Lys653 and Tyr689 in the amine oxidase domain via post-translational modification. Based on the similarity in hydrodynamic radius and radius of gyration, we recently proposed that the overall structures of the mature LOXL2 (containing LTQ) and the precursor LOXL2 (no LTQ) are very similar. In this study, we conducted a mass spectrometry-based disulfide mapping analysis of recombinant LOXL2 in three forms: a full-length LOXL2 (fl-LOXL2) containing a nearly stoichiometric amount of LTQ, Δ1-2SRCR-LOXL2 (SRCR1 and SRCR2 are truncated) in the precursor form, and Δ1-3SRCR-LOXL2 (SRCR1, SRCR2, SRCR3 are truncated) in a mixture of the precursor and the mature forms. We detected a set of five disulfide bonds that is conserved in both the precursor and the mature recombinant LOXL2s. In addition, we detected a set of four alternative disulfide bonds in low abundance that is not associated with the mature LOXL2. These results suggest that the major set of five disulfide bonds is retained post-LTQ formation.     

Universal Filtering Via Hidden Markov Modeling

The problem of discrete universal filtering, in which the components of a discrete signal emitted by an unknown source and corrupted by a known discrete memoryless channel (DMC) are to be causally estimated, is considered. A family of filters are derived, and are shown to be universally asymptotically optimal in the sense of achieving the optimum filtering performance when the clean signal is stationary, ergodic, and satisfies an additional mild positivity condition. Our schemes are comprised of approximating the noisy signal using a hidden Markov process (HMP) via maximum-likelihood (ML) estimation, followed by the use of the forward recursions for HMP state estimation. It is shown that as the data length increases, and as the number of states in the HMP approximation increases, our family of filters attains the performance of the optimal distribution-dependent filter. An extension to the case of channels with memory is also established.     

Characterization of MEMS Devices for the Study of?Superfluid Helium Films

Measurements on the mechanical properties of MEMS resonators were performed to characterize such devices at room temperature and low temperatures. Using state-of-the-art silicon integrated circuit technology, we have designed, fabricated, and manufactured resonators consisting of a pair of parallel plates with a well-defined gap whose size can be controlled with a high accuracy down to the sub-micron range. A full study of resonance properties at various pressures was performed at room temperature. We will discuss the details of design, fabrication, and operation. These studies open up a window of opportunities to look for novel phenomena in quantum fluids such as in superfluid ³He films.     

Fracture behavior of Cu-cored solder joints

Copper-cored solder can be regarded as the next-generation solder for microelectronic semiconductors exposed to harsh operating conditions owing to its excellent sustainability under extreme thermal conditions, e.g., in microelectronic semiconductors used in transportation systems. Cu-cored solder joints with two different coating layers, Sn–3.0Ag and Sn–1.0In, were compared with the baseline Sn–3.0Ag–0.5Cu solder. The fracture strength and failure mode were examined using the high-speed ball-pull and normal-speed shear tests. The Cu-cored solder joint with the Sn–1.0In plating layer exhibited the highest ball-pull and shear strengths. In addition, it showed a much lower percentage of interface fracture between the Cu-core and plating layer than the interface fracture percentage in the Sn–3.0Ag plating layer due to the improved wettability between the Cu-core and Sn–1.0In plating layer.     

Magnetic Polishing of Titanium-Nickel Alloy Stents: Surface Characterization and Catheter Deployment Test

We report here for the first time the use of magnetic polishing to improve the surface finish of titanium-nickel (TiNi) stents for better performance. We investigated the effects of polishing time and rotational speed on the average surface roughness, surface chemical contents, and push-out load of stents. The magnetically polished stents show a decrease of 2.3 to 17.9?pct in surface roughness and a lower push-out load for stent deployment from the catheter.     

Fabrication of Al matrix composite reinforced with submicrometer-sized Al<Subscript>2</Subscript>O<Subscript>3</Subscript> particles formed by combustion reaction between HEMM Al and V<Subscript>2</Subscript>O<Subscript>5</Subscript> composite particles during sintering

To fabricate an Al-V matrix composite reinforced with submicron-sized Al₂O₃ and Al_xV_y (Al₃V, Al₁₀V) phases, high energy mechanical milling (HEMM) and sintering were employed. By increasing the milling time, the size of mechanically milled powder was significantly reduced. In this study, the average powder size of 59 μm for Al, and 178 μm for V₂O₅ decreased with the formation of a new product, Al-Al₂O₃-Al_xV_y, with a size range from 1.3 μm to 2.6 μm formed by the in-situ combustion reaction during sintering of HEM milled Al and V₂O₅ composite powders. The in-situ reaction between Al and V₂O₅ during the HEMM and sintering transformed the Al₂O₃ and Al_xV_y (Al₃V, Al₁₀V) phases. Most of the reduced V reacted with excess the Al to form Al_xV_y (Al₃V, Al₁₀V) with very little V dissolved into Al matrix. By increasing the milling time and weight percentage of V₂O₅, the hardness of the Al-Al₂O₃-Al_xV_y composite sintered at 1173 K increased. The composite fabricated with the HEMM Al-20wt.%V₂O₅ composite powder and sintering at 1173 K for 2 h had the highest hardness.