FireFly: a cross-layer platform for real-time embedded wireless networks

We propose a cross-layer approach with tightly-coupled time synchronization for real-time support and predictable lifetime in battery-operated sensor networks. Our design spans a sensor hardware platform with hardware-based global time synchronization, a TDMA link layer protocol with collision-free multi-hop support and node scheduling algorithms for maximum concurrency and streaming. Our dual-radio sensor platform, FireFly, features an IEEE 802.15.4 transceiver and supports global time synchronization indoors by using an AM radio carrier-current method and an atomic clock receiver for outdoors. A TDMA-based link protocol, RT-Link, leverages the hardware for fixed and mobile nodes with a near-optimal and predictable node lifetime of over 2 years. It outperforms comparable sensor network link protocols such as B-MAC and S-MAC in terms of end-to-end latency and throughput and node lifetime across all duty cycle ratios. Operating over RT-Link is MAX, a scheduling framework which offers optimal transmission concurrency and bandwidth management for networks with regular structure. Through analysis and experiments we show that global time sync is a robust, economical and scalable alternative to in-band software-based techniques. To illustrate the capabilities and flexibility of our platform, we describe our experiences with two-way voice streaming over multiple hops. We have deployed a 42-node network with sub-100 μs synchronization accuracy in the NIOSH experimental coal mine for people-tracking and voice communication.

Compiler-assisted energy optimization for clustered VLIW processors

Clustered architecture processors are preferred for embedded systems because centralized register file architectures scale poorly in terms of clock rate, chip area, and power consumption. Although clustering helps by improving the clock speed, reducing the energy consumption of the logic, and making the design simpler, it introduces extra overheads by way of inter-cluster communication. This communication happens over long global wires having high load capacitance which leads to delay in execution and significantly high energy consumption. Inter-cluster communication also introduces many short idle cycles, thereby significantly increasing the overall leakage energy consumption in the functional units. The trend towards miniaturization of devices (and associated reduction in threshold voltage) makes energy consumption in interconnects and functional units even worse, and limits the usability of clustered architectures in smaller technologies. However, technological advancements now permit the design of interconnects and functional units with varying performance and power modes. In this paper, we propose scheduling algorithms that aggregate the scheduling slack of instructions and communication slack of data values to exploit the low-power modes of functional units and interconnects. Finally, we present a synergistic combination of these algorithms that simultaneously saves energy in functional units and interconnects to improves the usability of clustered architectures by achieving better overall energy–performance trade-offs. Even with conservative estimates of the contribution of the functional units and interconnects to the overall processor energy consumption, the proposed combined scheme obtains on average 8% and 10% improvement in overall energy–delay product with 3.5% and 2% performance degradation for a 2-clustered and a 4-clustered machine, respectively. We present a detailed experimental evaluation of the proposed schemes. Our test bed uses the Trimaran compiler infrastructure.     

Laser micro-welding of aluminum and copper with and without tin foil alloy

In this paper continuous laser welding of two dissimilar materials, aluminum and copper, was investigated. The aluminum and the copper utilized were Al3003-H14 and Cu110-H00, respectively. Two different sets of samples were laser welded; one in which a filler material, tin foil alloy (S-bond 220), was sandwiched between the aluminum and the copper and another set in which the aluminum and copper were directly welded without any filler. The foil alloy was utilized to enhance the compatibility of the two metals; aluminum and copper, reducing the brittleness of the intermetallic compound that may form and, subsequently, enhance the mechanical properties. The welding was carried out using an IPG 500 SM fiber laser. The length of the laser joint produced was 20 mm and the width was about 200 μm. The strength of the joint was evaluated by conducting the lap shear stress test. Samples in which filler foil was used exhibited a better performance in the lap shear stress test (an average of 780 N) than the samples without tin foil (an average of 650 N). The improvement in the lap shear test could be attributed to the positive effects of the filler on enhancing the compatibility of the intermetallic compound formed via diffusion. The fracture surface of both types of joints (with and without filler) was characterized using scanning electron microscope equipped with energy-dispersive X-ray (EDAX). To understand the failure initiation and propagation of the samples under tension, a finite element (FE) model was developed for the samples created with no filler material. The failure mechanism predicted from the FE model matches reasonably well with the experimental observations from EDAX analysis.     

A three-axis SOI accelerometer sensing with both in-plane and vertical comb electrodes

A three-axis capacitive accelerometer based on silicon-on-insulator is designed and fabricated. In the accelerometer, totally eight groups of capacitors are compactly arranged around an octagonal proof mass. The four groups of capacitors along orthogonal direction with in-plane comb electrodes detect XY acceleration, while the other four groups of capacitors along diagonal direction with vertical comb electrodes detect Z acceleration. Measurements of in-plane and vertical motion by the respective in-plane and vertical comb electrodes enable direct detection for all the three axes with differential capacitive sensing scheme. For the fabricated accelerometer in the size of 4 × 4 mm², the capacitance sensitivities of in-plane and out-of-plane accelerometers are 145.3 and 9.1 fF/g, respectively.     

An interactive method for extracting grammar from programs

The grammar of the language in which some given code is written is essential for developing automated tools for maintenance, reengineering, and program analysis. Frequently grammar is available for a language but not for its variants that are implemented by various vendors and in which the given code may be written. In this work we address the problem of obtaining the grammar from source code, which can then be used for generating tools for the programs. We propose an incremental method for obtaining grammar for a particular language variant, from a set of programs written in the language variant and an approximate grammar (presumably of the standard language) with some user interaction. We also present the design of a tool for implementing this approach and our experience in working with grammars of C, C++ and COBOL. Copyright © 2004 John Wiley & Sons, Ltd.     

Enhancement of bending strain tolerance and current carrying property of MgB2 based multifilamentary wires

The effect of bending strain on current carrying capacity of MgB₂ multifilamentary wires was studied with 4, 8 and 16 multifilamentary wires. The critical current density (J_C) of straight wires and bent wires with 5, 10, and 15 cm diameter was measured. Both annealed & bent and bent & annealed wires were used for measurement. The J_C of annealed & bent wires were found to decrease with decrease in bent diameter and the rate of degradation of J_C decreased with increasing number of filaments, while bent & annealed wires almost retained its J_C at all diameters studied.     

Cytochrome P450 inhibitory potential of selected Indian spices — possible food drug interaction

Spices constitute an important group of food which is virtually indispensable in the culinary art. In a view, these spices feared to pose a probability to affect the disposition of conventional pharmaceuticals through inhibition of human cytochrome P450 (CYPs) enzymes. In the present study an approach has been made to evaluate the possible CYP inhibition potential with some Indian spices (Capsicum annuum, Murraya koenigii, Zingiber officinale) and their major bioactive compounds, in combination with pooled microsome; as well as commercially available recombinant human CYP3A4, CYP2D6, CYP2C9 and CYP1A2. Quantification of the bioactive compound was determined through RP-HPLC, in order to standardize the plant material. CYP–carbon monoxide (CYP–CO) complex assay result indicated that all the plants and their bioactive compounds have an interaction potential with CYPs. Fluoregenic assay results indicated that the spice extracts have higher inhibition potential comparing to their single bioactive molecule. The higher enzyme inhibition potential by the extracts may be related to the synergistic effects due to the presence of other constituents in the extract. Capsaicin and C. annuum showed the lowest IC₅₀ value and 6-gingerol and Z. officinale extract showed the highest IC₅₀ value among the entire sample tested. The entire sample showed significantly less (P < 0.001, P < 0.01) interaction potential than known inhibitors. These findings indicate that selected spices are unlikely to cause clinically relevant drug interactions involving the inhibition of major CYP isozymes.     

Effect of Starting As-cast Structure on the Microstructure–Texture Evolution During Subsequent Processing and Finally Ridging Behavior of Ferritic Stainless Steel

Metallurgical and Materials Transactions A - Effect of the initial as-cast structure on the microstructure–texture evolution during thermomechanical processing of 409L grade ferritic...