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31.
In this paper, dynamic model of a class of parallel systems, namely, the hexaslides, is proposed. The model developed is based on the concept the decoupled natural orthogonal complement (DeNOC) matrices, introduced elsewhere. The dynamic model of hexslides, though complex due to the existence of multi-loop kinematic chains, is required for actuator power estimation, computed-torque control, optimum tool trajectory generation, etc. The use of DeNOC offers many physical interpretations, recursive algorithms, and parallel computations. Using the proposed dynamic model, a parallel inverse dynamics algorithm has been presented to compute the actuator forces. This is useful to choose suitable motors for an application. An illustration is provided using an existing machine tool based on hexaslides, namely, the HexaM, while it is carrying out a circular contouring. Secondly, the effect of leg and slider inertias is also studied, which clearly suggests that neither of these can be neglected while finding the actuator forces. 相似文献
32.
New spectrophotometric methods for the assay of some antioxidants have been developed using potassium permanganate and metol (p-N-methyl amino phenol). Metol is oxidised at pH 3.0 with potassium permanganate and coupled with antioxidants to give λmax at 560 nm for propyl gallate and gallic acid and 510nm for butylated hydroxy anisole. The method is simple, sensitive, reproducible and accurate within ±1% and applicable to the assay of antioxidants (gallic acid, propyl gallate and butylated hydroxy anisole) in oils and fats. 相似文献
33.
34.
Hari B. Goyal M. O. Garg K. R. Rao R. D. Srivastava 《Journal of chemical technology and biotechnology (Oxford, Oxfordshire : 1986)》1985,35(2):49-56
The kinetics of the reaction of acetic acid and acetylene over zinc acetate-activated carbon catalyst was investigated over a wide range of process variables in a pilot reactor. Although various catalytic reaction mechanisms were postulated, the rate of reaction was most satisfactorily correlated by a mechanism of surface reaction between charged adsorbed acetic acid and acetylene, which assumes that the rate controlling step was the irreversible charged adsorption of acetylene and acetic acid. 相似文献
35.
Uma Maheswar Rao S. S. M. S. Abdul Majeed C. Venkataseshaiah R. Sarathi 《Bulletin of Materials Science》2002,25(6):473-475
In the present work, tracking phenomena has been studied with silicone rubber material under the a.c. and d.c. voltages following
IEC-587 standards. The surface condition of the tracked zone was analysed using wide angle X-ray diffraction (WAXD) and thermogravimetric
differential thermal analysis (TG-DTA) studies. The tracking time was different for a.c. and d.c. voltages. 相似文献
36.
This paper draws attention to the basic principles governing reflections in uniform Bragg reflectors (BR) when measured employing optical low coherence reflectometry (OLCR) technique. Using computations based on transfer matrix method (TMM), we first showed a strong spectral dependence of Bragg reflectograms on an OLCR probe spectrum. Later, this dependence is exploited to evaluate, for the first time, the coupling coefficient κ of a Bragg grating in a distributed Bragg reflector (DBR) laser on InP 相似文献
37.
38.
A. Edwards Mulpuri V. Rao B. Molnar A. E. Wickenden W. Holland P. H. Chi 《Journal of Electronic Materials》1997,26(3):334-339
Doping by ion implantation using Si, O, Mg, and Ca has been studied in single crystal semi-insulating and n-type GaN grown
on a-sapphire substrates. The n-and p-type dopants used in this study are Si and O; Mg and Ca, respectively. Room temperature
activation of Si and O donors has been achieved after 1150°C annealing for 120 s. The activation of Mg and Ca acceptors is
too low to measure at both room temperature and 300°C. Using higher doses to achieve a measurable p-type conduction increases
the amount of damage created by the implantation. Rutherford back scattering measurements on this material indicate that the
damage is still present even after the maximum possible heat treatment. Secondary ion mass spectrometry measurements have
indicated a redistribution in the measured profiles of Mg due to annealing. 相似文献
39.
K. T. Venkateswara Rao W. O. Soboyejo R. O. Ritchie 《Metallurgical and Materials Transactions A》1992,23(8):2249-2257
A study has been made of the role of ductile-phase toughening on the ambient temperature fracture toughness and fatigue-crack
propagation behavior of a molybdenum disilicide intermetallicmatrix composite reinforced with 20 vol pct niobium spheres.
Using disk-shaped compact DC(T) samples, only moderate improvements (∼24 pct) in fracture toughnessK
lcvalues were found for the composite compared to the unreinforced MoSi2 matrix material. Moreover, (cyclic) fatigue- crack propagation was seen at stress intensities as low as 75 to 90 pct ofK
Ic, with growth rates displaying a high dependency (∼14) on the applied stress-intensity range. The lack of significant toughening
due to the incorporation of ductile Nb particles is associated with an absence of crack/particle interactions. This is attributed
to the formation of a weak reaction-layer interface and elastic mismatch stresses at the crack tip between the Nb and MoSi2, both factors which favor interfacial debonding; moreover, the spherical morphology of Nb phase stabilizes cracking around
the particle. Results suggest that increasing the aspect ratio of the distributed Nb rein- forcement phase with attendant
interfacial debonding and eliminating possible Nb-phase em- brittlement due to interstitial impurity contamination are critical
factors for the successful development of tougher Nb/MoSi2 structural composites.
Formerly with McDonnell
Formerly with McDonnell 相似文献
40.
A trade-off analysis on the cost and system packaging metrics of an electronic product aimed at the commercial/retail industry has been carried out. By comparing the system cost and packaging metrics with those of comparable consumer products, we have determined that there is opportunity for significant cost, size, and weight reduction of the overall electronics packaging system. These include the use of fine pitch IC packages, smaller discrete components, denser PCB wiring technology, double sided IC package surface mount, surface mount connectors, and improved plastics for the product housing. The analysis concluded that PCB area reduction of 40%, using a single PCB instead of three boards, reduction in board cost of over 50% and product weight reduction of over 28% are possible using available technologies. 相似文献