Thiol Redox and pKa Properties of Mycothiol,the Predominant Low‐Molecular‐Weight Thiol Cofactor in the Actinomycetes

The thiol pK_a and standard redox potential of mycothiol, the major low‐molecular‐weight thiol cofactor in the actinomycetes, are reported. The measured standard redox potential reveals substantial discrepancies in one or more of the other previously measured intracellular parameters that are relevant to mycothiol redox biochemistry.     

Vinyl carbazole (VC) functionalized mesoporous silica polymer nanocomposites (SBA/VC) for the antibacterial activity studies

Vinyl carbazole (VC) functionalized ordered mesoporous silica polymer nanocomposites (SBA/VC) were synthesized by in situ radical polymerization of monomers inside the mesoporous framework and characterized for the antibacterial activity studies against gram positive and gram negative bacteria. Powder X-ray diffraction and N₂ adsorption isotherms of SBA/VC nanocomposites showed the presence of mesoporous nature. The antimicrobial activity results showed increasing trend with the increase in the concentration of vinyl carbazole (VC) and the maximum antibacterial activity was achieved with SBA/VC₆₄ nanocomposites.     

Novel organic–inorganic composite material as a cation exchanger from a triterpenoidal system of dammar gum: synthesis,characterization and application

A pioneer study has been conducted to synthesize novel hydrogel starting from a non-cellulosic raw material, gum dammar-a triterpenoidal system, and then converting this hydrogel into an organic–inorganic composite zirconium-based ion exchanger. Gum dammar was cross-linked with polyacrylamide zirconium (IV) iodo-oxalate [Gd-cl-poly(AAm)-Zr (IV) iodo-oxalate] by incorporating inorganic precipitates into the polymeric mixture. The polymeric mixture was synthesized using gum dammar (Gd), acrylamide (AAm), N, N′-methylene-bis-acrylamide (MBA) and potassium persulphate (KPS). The reaction conditions for synthesis of hydrogel and ion exchanger such as time (120 min), temperature (70 °C), solvent (4 mL), concentration of monomer (12.97 × 10^?3 mol/L), initiator (1.48 × 10^?4 mol/L), cross-linker (4.22 × 10^?4 mol/L) and ratio of zirconium oxychloride (0.1 M), potassium iodate (0.1 M) and oxalic acid (0.1 M) in ratio 2:3:2 were optimized to obtain maximum ion exchange capacity (2.02 meq/g). The morphology and structure of hydrogel and ion exchanger were studied using FTIR, SEM, XRD and TGA/DTA/DTG. The SEM study was followed by energy dispersive spectroscopy for elemental analysis. The ion exchanger was quite stable in various acids and bases at low concentration but it completely dissolved in acids and bases at high concentrations. Distribution studies showed that the synthesized ion exchanger had high selectivity for Pb²⁺ ions. Thus, the polymeric-inorganic hybrid material showed integration of both inorganic and organic characteristics within the composite material.     

Electrolytic reduction of p-nitroaniline to p-phenylenediamine

The depolarization of p-nitroaniline at a stationary cathode under different conditions has been studied. Results obtained with a copper cathode, in presence of 0.1% copper sulphate and on amalgamated copper cathode are reported. The product isolated has been confirmed as p-phenylenediamine.     

Thermally stimulated discharge currents in poly(vinyl alcohol) thermoelectrets

The depolarization currents in poly(vinyl alcohol) thermoelectrets have been measured by thermally stimulated discharge (t.s.d.) current techniques. The polarization is found to be uniform. The activation energy and the relaxation time have been calculated under different polarizing conditions. The formation of heterocharge is explained by dipole alignment and migration of charge over microscopic distances with trapping.     

Graft copolymerzation of poly(vinyl chloride) with styrene. I. Synthesis and characterization

Graft copolymerization of poly(vinyl chloride) (PVC) partially dehydrochlorinated by heating in nitrobenzene was investigated using styrene as monomer and anhydrous AlCl₃ as cationic initiator in the temperature range of 0–35°C. Effect of monomer, catalyst, and PVC concentration on % graft-on was also evaluated. Introduction of labile sites in PVC by partial dehydrochlorination in nitrobenzene resulted in an increase in % graft-on. Intrinsic viscosity of PVC–g–polystyrene in THF initially increased with an increase in % graft-on. At higher % graft-on a decrease in [η] was observed.     

HEAT TRANSFER IN MULTIPHASE CONTACTORS

A procedure for the prediction of wall-bed heat transfer coefficient for bubble columns and gas-solid fluidized beds is developed on the basis of hydrodynamic behavior of these contactors. A comparison between the predicted and experimental values of heat transfer coefficient over a wide range of design and operating variables is presented. An attempt is made to analyze the occurrence of maxima in heat transfer coefficient with respect to gas velocity in the case of fluidized beds. A procedure for the calculation of the optimum superficial gas velocity is outlined.     

Advances in high-k dielectric gate materials for future ULSI devices

This article discusses recent developments in high dielectric constant gate insulator materials for future ultra-large-scale integration devices below 100 nm. Since conventional gate oxide poses problems as device features are scaled down, it becomes necessary to develop new gate dielectric materials with properties similar to SiO₂ and compatible with current complementary metal-oxide semiconductor technology. As the thickness of silicon dioxide approaches less than 1.5 nm, the leakage current becomes higher than 1 A/cm² and tunnel current increases significantly. Therefore, materials are needed to provide excellent electrical characteristics such as dielectric constant higher than 30, interface-state-density less than 1 × 10¹¹/cm²-eV, tunneling current less than 10 mA/cm², and negligible hysteresis. Many high dielectric constant materials have been reported that could potentially replace SiO₂. These include SiO_xN_y, Ta₂O₅, TiO₂, Y₂O₃, CeO₂, SrTiO₃, Al₂O₃, La₂O₃, and silicates of hafnium and zirconium. These materials exhibit the desired high dielectric constants for applications as gate dielectrics in sub-100 nm silicon technology. However, detailed studies need to be performed to evaluate the compatibility of these materials with the rest of the silicon integrated-circuit manufacturing processes. For more information, contact A. Kumar, Center for Microelectronics Research, University of South Florida, 4202 East Fowler Avenue, Tampa, Florida, 33620, (813) 974-3942; fax (813) 974-6310; e-mail akumar1@eng.usf.edu