福建电网运行绝缘子质量分析试验

介绍了福建电网2004年运行绝缘子质量分析试验采用的试验标准以及瓷绝缘子、复合绝缘子的质量分析试验;根据试验结果对绝缘子的运行维护提出建议。     

Mothers' Affect in the Homework Context: The Importance of Staying Positive.

This research investigated mothers' affect in the context of children's homework. Mothers (N=109) of children 8 to 12 years old were interviewed daily about their affect while interacting with children, their assistance with children's homework, and children's behavior while completing homework. At this time and 6 months later, children's motivational and emotional functioning was assessed. Although mothers' negative affect was lower than their positive affect, it was elevated on days their assistance with homework was high. This was accounted for by mothers' perceptions of children as helpless on days they provided heightened assistance. Mothers' positive affect in the homework context buffered children's motivational and emotional functioning against mothers' negative affect as well as children's helplessness. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

Air oxidation behavior of nitrogen ion implanted zircaloy-4 at 500 °C

Journal of Materials Science -     

锆合金的碘致应力腐蚀开裂研究(英文)

研究了不同热处理状态的Zr-2和Zr-4合金在不同浓度的碘介质及实验温度下的应力腐蚀开裂(SCC)行为。并对不同织构取向的试样在350℃下进行了蠕变实验,蠕变实验的载荷值选择与SCC实验相对应的一系列典型载荷。用扫描电子显微镜观察了断口特征,用透射电子显微镜和光学显微镜检查了材料的显微组织,用X-光衍射仪测定了锆合金的织构,分析讨论了材料状态、实验温度、碘浓度以及蠕变对锆合金碘致应力腐蚀行为的影响。     

焚烧炉烟气中铅、锌、苯并(a)芘的测定

建立了用电感耦合等离子体光谱法(ICP-AES)和高效液相色谱法(HPLC)分别测定焚烧炉烟气中铅(Pb)、锌(Zn)和苯并(a)芘(BaP)的分析方法。研究了烟尘及玻璃纤维滤筒的预处理，测定Pb、Zn、BaP时基体的干扰与消除，并给出Pb、Zn的干扰校正系数。实验测得Pb、Zn和BaP的回收率超过84％，相对标准偏差Pb为3．51％，Zn为7．28%，BaP为4．30％。实验结果表明，该分析方法可以满足焚烧炉运行中的监测需要．     

一种耦合表面络合吸附作用的地下水溶质迁移模型初探

地下水中溶液化学作用对溶质迁移的影响日渐引起人们的关注，特别是发生于固-液表面的吸附作用，对溶质迁移的影响具有非常重要的作用。关于吸附机理的解释很多，其中表面络合吸附是近年来解释吸附作用比较成功的假说之一。本文建立了一个基于表面络合吸附作用的地球化学模式，并将其与传统的对流-弥散模型相耦合，建立了一个能够考虑表面络合吸附影响的溶质迁移模型。通过与已发表的某著名算例的结果进行的对比分析，与前人结果吻合较好，表明本文所建立的模型获得了初步成功。     

Zr-4合金板α相高温区轧制的织构演化

用(0002)正极图和织构取向因子等方法,研究了a相高温区沿原板材的轧向和横向轧制63%的Zr-4合金板的织构。实验结果表明:Zr-4合金板材在a相高温区轧制后的织构与原料板材的织构有关,这是由它的形变机制决定的。Zr-4合金板在a相高温区轧制时,{10`11}<`2113>和{11`21}<`2113> 锥面滑移是主要的形变系统,所以轧制后形成基极取向集中于轧面法向的织构。沿原始板材的轧向进行轧制时,部分晶粒中的{`1010}<`12`10>柱面滑移开动,使轧制后的ft大于fl;沿原始板材的横向进行轧制时,{11`21}<`1`126>孪生的作用使基极沿轧面法向上的取向增强。     

退火对直流磁控溅射铬膜附着性的影响

为了利用铬膜改善锆的抗腐蚀性，研究了退火对Zr-2基体上制备的直流磁控溅射铬膜附着性的影响，使用扫描电镜（SEM）观察了界面形貌及锆，铬的界面的分布，用X－射线衍射仪（XRD）分析了膜层的组成，用划痕法测定了铬膜的附着，结果表明，锆／铬界面结合良好，边界可见；与现有文献比较，获得的铬膜附着性好――均超过20N；溅射后退火使Zr-Cr界面更像扩散界面，但X－射线衍射结果未发现有界面反应产物；退火提高铬膜与Zr-2基体的附着性约50％，扩散际着附着性增加的主要因素。     

双BGO晶体能谱测井

Ｃ／Ｏ测井可以利用ＢＧＯ晶体探测效率高的特点，在其探测器部分放置两个探测器，称为双探测Ｃ／Ｏ测井仪，长短源距两个探头所测谱数据进行补偿，有效地去除了井眼条件的影响，提高了测量精度和油水差值，更加有产地分油水层，并有望能在低孔隙度的地层中使用Ｃ／Ｏ测井仪器。     

A novel integrated silicon capacitive microphone-floating electrode“electret” microphone (FEEM)

A novel principle “electret” microphone, i.e., floating electrode electret microphone, is proposed and implemented in this study. Single-chip fabrication and corrugation technique are used in the design and fabrication of the microphone. The floating electrode is encapsulated by highly insulated materials to ensure that there is no electric-leakage passage between the floating electrode and the electrodes of the microphone. Net-free electronic charges (not “bonded” charges as in traditional electret) in the floating electrode can excite the electric field, which is similar to that of the traditional electret. The floating electrode can be easily charged by use of the “hot” electron technique, available using the avalanche breakdown of the p⁺-n junction. Therefore, the electret microphone is rechargeable, which can greatly increase the lifetime of the device. The preamplifier has been on-chip integrated in a junction-field-effect transistor (JFET) source-follower type with resistors by use of ion implantation. Electret charges are banded in a deep potential trap, thus, this microphone can operate at a high temperature (as high as 300°C) and has high stability and reliability. Experiments show that the prototype has a 3-mV/Pa sensitivity and a larger than 21-kHz frequency bandwidth in a 1 mm ×1-mm diaphragm area. Microphone performance can be further improved by optimized process and design. The fabrication is completely integrated-circuit (IC) compatible, hence, the microphone shows promise in integrated acoustic systems