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991.
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The basic ideas underlying an Estelle-C compiler, which accepts an Estelle protocol specification and produces a protocol implementation in C, are presented. The implementation of the ISO (International Organization for Standardization) class-2 transparent protocol, using the semiautomatic approach, is discussed. A manual implementation of the protocol is performed and compared to the semiautomatic implementation. The semiautomatic approach to protocol implementation offers several advantages over the conventional manual one, including correctness and modularity in protocol implementation code, conformance to the specification, and reduction in implementation time. Finally, ongoing development of a new Estelle-C compiler is presented  相似文献   
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995.
The effects of a thermal residual stress field on fatigue crack growth in a silicon carbide particle-reinforced aluminum alloy have been measured. Stress fields were introduced into plates of material by means of a quench from a solution heat-treatment temperature. Measurements using neutron diffraction have shown that this introduces an approximately parabolic stress field into the plates, varying from compressive at the surfaces to tensile in the center. Long fatigue cracks were grown in specimens cut from as-quenched plates and in specimens which were given a stress-relieving overaging heat treatment prior to testing. Crack closure levels for these cracks were determined as a function of the position of the crack tip in the residual stress field, and these are shown to differ between as-quenched and stress-relieved samples. By monitoring the compliance of the specimens during fatigue cycling, the degree to which the residual stresses close the crack has been evaluated. formerly Research Student, Department of Materials Science and Metallurgy, University of Cambridge formerly Lecturer, Department of Materials Science and Metallurgy, University of Cambridge This article is based on a presentation made in the symposium entitled “Creep and Fatigue in Metal Matrix Composites” at the 1994 TMS/ASM Spring meeting, held February 28–March 3, 1994, in San Francisco, California, under the auspices of the Joint TMS-SMD/ASM-MSD Composite Materials Committee.  相似文献   
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997.
At strain rates greater than about 10 the deformation of polymers is an adiabatic process which can lead to the generation of very high localized temperatures. These may be well in excess of the temperatures required for thermal decomposition of the polymer to occur. It is speculated that gaseous products arising from such decomposition may act as the source of microcavities and craze initiators. Experiments are described in which the thermal decomposition reaction parameters of polyetherketone, polyetheretherketone, and polysulphone are measured using differential scanning calorimetry and thermogravimetric analysis, and the decomposition products analysed by mass spectrometry. The results indicate that the proposed mechanism could act as a source of micropores with total pore volumes amounting to several per cent of the material volume.  相似文献   
998.
Translated from Khimiya i Tekhnologiya Topliv i Masel, No. 10, pp. 21–22, October, 1992.  相似文献   
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