Six-layer lamination of a new dry film negative-tone photoresist for fabricating complex 3D microfluidic devices

We present a new epoxy-based negative-tone dry film photoresist (DFR) for fabricating multilayer microfluidic devices using a lamination process combined with a standard photolithography technology. As proof-of-concept, a complex 3D-hydrodynamic focusing device was produced via a six-layer lamination process of 33 µm-thick DFR layers. The bonding strength of the new DFR was tested on silicon, glass, and titanium substrates, respectively. A maximum bonding strength of 37 MPa was obtained for the dry film photoresist laminated on glass. No leakage was found, and burst tests proved excellent robustness and sealing reliability of the microchannels.     

Experimental studies for verification of thermal effects in cutting

Investigations on metal-cutting machining processes that were conducted since the second half of the twentieth century have considerably contributed to disclosing the principles underlying the cutting process. Although numerous studies have been carried out on this subject, a generally valid model of the cutting process and the interactions in the separating processes does not exist yet. Such a model could guarantee the disclosure of the principles of thermodynamic interactions between the cutting process and the involved machine structure. This contribution is twofold and presents an experimental setup used to determine cutting forces and temperatures in orthogonal cutting processes. The results are then used as a reference for simulations made with the Discrete Element Method (DEM). The DEM is due to its meshless nature well suited to capture large deformations and rupture of material which is included very naturally. It is examined to which extent the measured results can be captured with the DEM model.     

Image Capture Devices Based on Charge Storage at Semiconductor-Ferroelectric Interfaces

This work shows that semiconductor-ferroelectric (SC-FE) charge storage devices are promising candidates for image capture and irradiance measurements. Incident radiation generates electron-hole pairs in the semiconductor layer, but as distinct from semiconductor pn-junctions, photocarriers are trapped at the SC-FE interface and decrease the depolarization field of the FE layer and the band bending at the interface that does not need any power supply. Since the decrease in band bending is proportional to the incident irradiance, the readout can be carried out after a certain measurement time. The paper discusses the possibilities for both a capacitive and a resistive readout. The spectral responsitivity of such SC-FE junction devices may be well designed by choosing a suitable semiconductor layer with high radiation absorption in the desired spectral range.     

The Autosar XML Schema and Its Relevance for Autosar Tools

The Autosar standard represents an emerging approach to unifying virtually all aspects of the development workflow of automotive embedded software. The standard features an XML schema used as a basis for interchanging documents containing Autosar model content. Although the schema is primarily for document exchange, it could also be the basis for creating a metamodel. However, a tool metamodel should probably be designed differently.     

Simulation of Fluid Flow and Oscillation of the Argon Oxygen Decarburization (AOD) Process

The oscillation of argon oxygen decarburization (AOD) converters is flow related and depends on the process parameters (e.g., vessel geometry, melt fill height, process gas type and blowing rate, vessel tilting angle, as well as geometry, number, and arrangement of the side-wall nozzles). For a 120-ton AOD converter with seven submerged side-wall nozzles, plant tests, physical simulations on a 1:4 scale water model, and computational fluid dynamics simulations have been done. The investigations show that the penetration depth of an inert gas jet into the melt does not exceed approximately 0.4 m. The plumes are located close to the nozzle-side converter wall and induce a large-scale primary vortex as well as intensive surface movements; both are responsible for the oscillation. Several process mechanisms were investigated. The oscillation is highest in the last stage of the dynamic blow and is still high during the reduction stage. As the amount of inert gas increases, the vibration level also increases. Inert gas has a greater influence on the oscillation than oxygen. Tilting the converter around 8 deg clearly leads to more intensive oscillations. Increasing the blowing rate increases the forces and torques acting on the vessel, whereas the oscillation frequency remains nearly constant. A varying fill level does not influence the vibration level the same way as the blowing rate. The operational test shows, for example, that the maximum torque does not depend on the heat size when the latter varies between –8 pct and +21 pct of the nominal heat size. The water model test shows decreasing forces and torques with a rising fill level.     

Numerical simulations of the internal flow pattern of a vortex pump compared to the Hamel-Oseen vortex

We did a numerical study of the internal flow field of a vortex pump. Five operating points were considered and validated through a measured characteristic curve. The internal flow pattern of a vortex pump was analyzed and compared to the Hamel-Oseen vortex model. The calculated flow field was assessed with respect to the circumferential velocity, the vorticity and the axial velocity. Whereas the trajectories of the circumferential velocity were largely in line with the Hamel-Oseen vortex model, the opposite was true for vorticity. Only the vorticity at strong part load was in line with the predictions of the Hamel-Oseen vortex model. We therefore compared the circumferential velocity and vorticity for strong part load operation to the analytical predictions of the Hamel-Oseen vortex model. The simulated values were below the analytical values. The study therefore suggests that a vortex similar to the Hamel-Oseen vortex is only present at the strong part load operation.     

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