A公司C产品研发项目范围管理研究

通过分析A公司在研发项目范围管理中所存在问题,提出研发项目范围管理的方法及其在C产品的应用实例,通过运用研发项目范围管理的工具和方法,改善产品开发流程,从而缩短新产品开发周期,提高响应市场的速度,并提高企业研发项目的管理能力。     

Fine-grained cooperative access control scheme with hidden policies

The traditional ciphertext policy attribute-based encryption (CP-ABE) has two problems:one is that the access policy must be embedded in the ciphertext and sent, which leads to the disclosure of user爷 s privacy information, the other is that it does not support collaborative decryption, which cannot meet the actual demand of conditional collaborative decryption among multiple users. In order to deal with the above two problems at the same time, a fine-grained cooperative access control scheme with hidden policies (FCAC-HP) is proposed based on the existing CP-ABE schemes combined with blockchain technology. In FCAC-HP scheme, users are grouped by group identifier so that only users within the same group can cooperate. In the data encryption stage, the access policy is encrypted and then embedded in the ciphertext to protect the privacy information of the access policy. In the data access stage, the anonymous attribute matching technology is introduced so that only matched users can decrypt ciphertext data to improve the efficiency of the system. In this process, a smart contract is used to execute the verification algorithm to ensure the credibility of the results. In terms of security, FCAC-HP scheme is based on the prime subgroup discriminative assumption and is proved to be indistinguishable under chosen plaintext attack (CPA) by dual system encryption technology. Experimental verification and analysis show that FCAC-HP scheme improves computational efficiency while implementing complex functions.     

碳酸盐岩岩溶储层多井评价方法及地质应用

多井评价是建立在单井精细解释对比分析基础上的预测储层及含油气性平面分布规律的技术方法,而常规测井资料无法区分碳酸盐岩岩溶储层,因而利用多井评价结果确定岩溶发育程度在平面上的分布规律就显得十分重要。为此,在岩心标定成像测井的基础上,对四川盆地高石梯—磨溪地区15口井的成像测井岩溶发育特征进行分析,建立了中二叠统茅口组岩溶发育各分带的标准成像图版,利用交会图及直方图分析各分带的常规测井响应特征,在此基础上形成了电成像测井刻度常规测井识别岩溶发育带的新方法。研究结果表明:①高石梯—磨溪地区茅口组岩溶带自上而下可划分为风化壳残积带、垂直渗流岩溶带、水平潜流岩溶带以及受岩溶作用较弱的基岩;②风化壳残积带在成像测井图像显示为"暗—亮—暗"条带状模式,垂直渗流岩溶带为垂直线状与暗色斑状组合模式,水平潜流岩溶带为水平线状—层状与斑状组合模式,基岩整体显示为亮色块状模式偶见线状或斑状特征;③有效储层主要发育在垂直渗流带和水平潜流带的顶部;④该区茅口组岩溶发育主要受裂缝发育控制,而裂缝发育又与断层关系密切。结论认为,该新方法对碳酸盐岩岩溶储层的多井评价具有普遍适用性,为四川盆地中二叠统风险探井的部署提供了技术支撑。     

Spreading and Curing Behaviors of a Thermosetting Droplet-Silicone on a Heated Surface

Thermosetting materials are widely used as encapsulation in the electrical packaging to protect the core electronic components from external force, moisture, dust, and other factors. However, the spreading and curing behaviors of such kind of fluid on a heated surface have been rarely explored. In this study, we experimentally and numerically investigated the spreading and curing behaviors of the silicone(OE6550 A/B, which is widely used in the light-emitting diode packaging) droplet with diameter of ～2.2 mm on a heated surface with temperature ranging from 25 ℃ to 250 ℃. For the experiments, we established a setup with high-speed camera and heating unit to capture the fast spreading process of the silicone droplet on the heated surface. For the numerical simulation, we built a viscosity model of the silicone by using the Kiuna's model and combined the viscosity model with the Volume of Fluid(VOF) model by the User Defined Function(UDF) method. The results show that the surface temperature significantly affected the spreading behaviors of the silicone droplet since it determines the temperature and viscosity distribution inside the droplet. For surface temperature varied from 25 ℃ to 250 ℃, the final contact radius changed from ～2.95 mm to ～1.78 mm and the total spreading time changed from ～511 s to ～0.15 s. By further analyzing the viscosity evolution of the droplet, we found that the decreasing of the total spreading time was caused by the decrease of the viscosity under high surface temperature at initial spreading stage, while the reduction of the final contact radius was caused by the curing of the precursor film. This study supplies a strategy to tuning the spreading and curing behavior of silicone by imposing high surface temperature, which is of great importance to the electronic packaging.