Partitioning for pseudo-exhaustive testing is NP-complete

In the letter, two schemes of circuit partitioning for pseudo-exhaustive testing are described. The complexities of both are proved to be NP-complete.     

数字电视传输流的实时码率变换系统

数字视频压缩后通常是打包成传输流的形式进行传送，年个传输流有其固定的发送码率，在某些应用场合，比如信道调制前端，需要对输入传输流码率进行改变以适应该信道要求，描述了一种全硬件实现，双路输出，实时，节目可选择的码率变换系统的原理及具体实现。     

功率电子器件用AlN陶瓷基板的研制

阐述了AlN陶瓷的烧结原理 ,分析了烧结工艺参数对大面积AlN基板性能的影响 ,成功研制出了高热导率(190W /m·K)、大面积 (14 0mm× 90mm)、翘曲度为 2 0 μm/5 0mm的AlN陶瓷基板。     

汽车稳定杆组织与疲劳性能研究

对28Mn6钢制造的汽车稳定杆，分别采用整体感应加热－整体淬火、连续感应加热淬火两种不同热处理工艺，并进行了台架疲劳寿命试验，采用光学显微镜和扫描电镜，分析了经两种不同热处理工艺处理的稳定杆的金相组织及其早期疲劳断裂的断口形貌，提出，获得细小的高韧性索氏体组织是保证良好疲劳寿命的关键，稳定杆喷丸表面质量，游离铁素体也是影响疲劳性能的重要因素。     

MON--未来城域网的发展方向

阐述了城域光网络(MON)技术的出现背景、定义、技术方案和特点，以及与现有城域基础设施的比较，突出说明了其应用上的竞争优势。最后介绍了MON的现状和前景展望。     

ARAM·ARIES SPM-Lite便携式遥测地震数据采集系统简介

ARAM·ARIES SPM-Lite便携式遥测地震数据采集系统是加拿大GEO-X公司在2002年下半年推出的全新小型便携式地震数据采集系统。该仪器运用了当今最先进的计算机制造技术、网络化技术和微电子技术,除继承了ARAM-ARIES地震数据采集系统所有功能和技术外,它还简化了硬件结构,使体积更小,重量更轻,功能性更强。更加适应地矿、煤田、丛林和山区进行地震勘探。     

高温预析出对Al-Zn-Mg系铝合金时效硬化和应力腐蚀的影响

研究了高温固溶后降温处理工艺对中强可使预析出LC52和7039铝合金的组织、时效硬化和应力腐蚀的影响。金相观察发现,高温预析出可优先在晶界处产生,并提高随后时效状态下晶界析出相的不连续分布程度,温度降低到一定程度晶内和晶界产生大量析出。合金拉伸性能和应力腐蚀结果表明,预析出在保持强度和塑性的同时,可提高抗应力腐蚀性能。而预析出温度降低,合金强度呈下降趋势。     

N,N''-取代邻苯二胺的合成

通过2-取代苯并咪唑盐的还原开环反应制备了8个N,N′-不同取代的邻苯二胺,并经1HNMR、IR、MS及元素分析表征,其中5个未见文献报道.这是一条由邻苯二胺和羧酸经2.取代苯并咪唑制取该类化合物的简洁合成路线.     

Facile modifications of polyimide via chloromethylation: II. Synthesis and characterization of thermocurable transparent polyimide having methylene acrylate side groups

From chloromethylated polyimide, a useful starting material for modification of aromatic polyimides, a thermocurable transparent polyimide having acrylate side groups was prepared. In the presence of 1,8‐diazabicyclo[5,4,0]undec‐7‐ene, chloromethylated polyimide was esterified with acrylic acid to synthesize poly(imide methylene acrylate). The polymer was soluble in organic solvent, which makes it possible to prepare a planar film by spin coating. The polymer film became insoluble after thermal treatment at 230 °C for 30 min. Optical transparency of the film at 400 nm (for 1 µm thickness) was higher than 98 % and not affected by further heating at 230 °C for 250 min. Adhesion properties measured by the ASTM D3359‐B method ranged from 4B to 5B. Preliminary results of planarization testing showed a high degree of planarization (DOP) value (>0.53). These properties demonstrate that poly(imide methylene acrylate) could be utilized as a thermocurable transparent material in fabricating display devices such as TFT‐LCD. Copyright © 2004 Society of Chemical Industry