用厚度阈值法改善深拉延冲压件坯料形状预测精度

将作者首次提出的厚度阈值法应用到基于逆有限元原理的坯料形状预测算法中,有效地改进了深拉延冲压件坯料形状预测的精度,并以某汽车油底壳拉延件为实际算例,分别用改进前和改进后的算法,对其坯料形状进行预测,预测结果与实际坯料形状的对比结果验证了本文方法的有效性。     

关于知识管理与IT企业文化改革的研究

围绕IT企业文化改革,在阐述IT企业知识文化革命的基础上,分析了知识管理对IT企业文化的影响,指出知识管理是IT企业文化改革的重要因素,倡导建立有利于知识管理的IT企业文化,强调合理地解决“才与财”的问题。     

Design of a novel chip on glass package solution for CMOS image sensor device

This paper presents a chip-on-glass (COG) package solution for CMOS image sensors based on highly precise and reliable bumping and flip-chip bonding techniques. The package is fabricated using three core techniques, namely the damage-free image sensor bumping technique, the wafer form glass substrate patterned technique, and the damage-free flip-chip bonding technique. Since the proposed package concept is new, the effects of the package geometry and material properties on the package reliability are uncertain in the initial design stage. A three-dimensional nonlinear finite element model of the proposed CMOS image sensor package is created. In the simulations, the applied thermal load is cooled from 200 °C to ambient temperature (25 °C) to model the thermal deformation and warpage of the package during the practical ACF assembly cooling process. The design parameters influencing the reliability of the package, i.e. the material properties of the ACF, the thickness of the image chip and the thickness of the optical glass are investigated. Two control levels are specified for the chip, glass, and ACF factors and a 2³ factorial design is created to determine the appropriate combination of material properties and geometric size. It is found that the glass thickness and the ACF properties significantly affect the thermal deformation of the package, while the chip and glass factors, and the interaction between them, significantly affect the warpage. Regression models are developed to perform a series of surface response simulations. Using the developed statistical tests and regression models, suitable material selection criteria and geometric sizes can be specified to satisfy various reliability considerations in the initial design stage.     

Quality-of-service provisioning and efficient resource utilization in CDMA cellular communications

One of the major challenges in supporting multimedia services over Internet protocol (IP)-based code-division multiple-access (CDMA) wireless networks is the quality-of-service (QoS) provisioning with efficient resource utilization. Compared with the circuit-switched voice service in the second-generation CDMA systems (i.e., IS-95), heterogeneous multimedia applications in future IP-based CDMA networks require more complex QoS provisioning and more sophisticated management of the scarce radio resources. This paper provides an overview of the CDMA-related QoS provisioning techniques in the avenues of packet scheduling, power allocation, and network coordination, summarizes state-of-the-art research results, and identifies further research issues.     

等离子喷涂ZrO2涂层孔隙定量分析

利用等离子喷涂技术制备了两种不同结构的梯度热障涂层.利用定量金相技术对两种涂层富陶瓷区域不同位置的孔隙率、孔隙大小和形态进行了定量分析.结果表明:两涂层富陶瓷区域孔隙率相近,其中界面处孔隙率较高,但在6%以下;孔隙大小服从相似的概率分布,其中直径在1～10um范围内的孔隙含量最多,在72%～80%之间,其次是1um以下的孔隙,在20%～25%之间,而10um以上的孔隙含量在0.2%～4%之间;孔隙形状同样服从相近的概率分布,而且等轴孔隙比重最大,在82%～87%之间,其次为不等轴孔隙,在13%～17%之间,缝隙状孔隙最少,在0.1%～0.4%之间.说明涂层结构对富陶瓷区域的孔隙没有影响.     

多线程技术在嵌入式数据采集系统中的应用

讨论了多线程技术在嵌入式数据采集系统中的应用，给出了PC机与嵌入式计算机系统的多线程串行通信的实现。     

蚁群算法用于VLSI布线的特性分析

本文重点在于研究在VLSI布线中采用蚁群算法的实用性和优越性。通过用MATLAB编程对蚁群算法和迷宫算法等算法的实现,得出蚁群算法在VLSI布线中的适用性不受布线结构的限制,而且在得出最优解方面有一定的优势。     

EAF-LF-CSP流程Ti微合金化钢炼钢工艺研究

基于珠钢EAF-LF-CSP流程,研究深脱O、深脱S、低N钢等生产技术,使[O]＜25×10-6、[N]＜70×10-6、[S]＜50×10-6,解决了Ti微合金收得率低、性能不稳定和连铸过程堵水口的问题,Ti铁的回收率稳定控制在67%左右,并在此基础开发出屈服强度为450～700MPa的高强钢.     

Nb-Ti微合金化汽车用钢QStE340～460TM的开发研究

基于对珠钢EAF-CSP流程Nb微合金化技术的系统研究,有效地解决了混晶问题,并利用Nb-Ti复合微合金化技术成功地开发了汽车用钢QStE340～460TM.分析结果表明,开发的含Nb-Ti钢带具有优异的韧性、冷成形性能和良好的焊接性能,完全满足汽车、半挂车用钢的要求.     

FW余热锅炉在金昌冶炼厂的设计及应用

金昌冶炼厂主工艺改造采用Ausmelt熔炼技术,其烟气冷却设备选用FW余热锅炉,本文阐述了金昌冶炼厂余热锅炉的结构、特点及运行效果,投运后,节能降耗。