HV‐SoP Technology for Maskless Fine‐Pitch Bumping Process

Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip‐chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine‐pitch solder bumping has been widely studied. In this study, high‐volume solder‐on‐pad (HV‐SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are 28.3 μm, 31.7 μm, and 26.3 μm, respectively. It is expected that the HV‐SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine‐pitch flip‐chip bonding.     

Mobile Small Cells for Further Enhanced 5G Heterogeneous Networks

A heterogeneous network (HetNet) is a network topology composed by deploying multiple HetNets under the coverage of macro cells (MCs). It can improve network throughput, extend cell coverage, and offload network traffic; for example, the network traffic of a 5G mobile communications network. A HetNet involves a mix of radio technologies and various cell types working together seamlessly. In a HetNet, coordination between MCs and small cells (SCs) has a positive impact on the performance of the networks contained within, and consequently on the overall user experience. Therefore, to improve user‐perceived service quality, HetNets require high‐efficiency network protocols and enhanced radio technologies. In this paper, we introduce a 5G HetNet comprised of MCs and both fixed and mobile SCs (mSCs). The featured mSCs can be mounted on a car, bus, or train and have different characteristics to fixed SCs (fSCs). In this paper, we address the technical challenges related to mSCs. In addition, we analyze the network performance under two HetNet scenarios — MCs and fSCs, and MCs and mSCs.     

Gaze Detection by Wearable Eye‐Tracking and NIR LED‐Based Head‐Tracking Device Based on SVR

In this paper, a gaze estimation method is proposed for use with a large‐sized display at a distance. Our research has the following four novelties: this is the first study on gaze‐tracking for large‐sized displays and large Z (viewing) distances; our gaze‐tracking accuracy is not affected by head movements since the proposed method tracks the head by using a near infrared camera and an infrared light‐emitting diode; the threshold for local binarization of the pupil area is adaptively determined by using a p‐tile method based on circular edge detection irrespective of the eyelid or eyelash shadows; and accurate gaze position is calculated by using two support vector regressions without complicated calibrations for the camera, display, and user's eyes, in which the gaze positions and head movements are used as feature values. The root mean square error of gaze detection is calculated as 0.79° for a 30‐inch screen.     

Characterization of Fluxing and Hybrid Underfills with Micro‐encapsulated Catalyst for Long Pot Life

For the fine‐pitch application of flip‐chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro‐encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro‐encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine‐pitch flip‐chip bonding processes and be highly reliable.     

A review of silicon-based wafer bonding processes,an approach to realize the monolithic integration of Si-CMOS and Ⅲ-Ⅴ-on-Si wafers

The heterogeneous integration of Ⅲ-Ⅴ devices with Si-CMOS on a common Si platform has shown great promise in the new generations of electrical and optical systems for novel applications,such as HEMT or LED with integrated control cir-cuitry.For heterogeneous integration,direct wafer bonding(DWB)techniques can overcome the materials and thermal mis-match issues by directly bonding dissimilar materials systems and device structures together.In addition,DWB can perform at wafer-level,which eases the requirements for integration alignment and increases the scalability for volume production.In this paper,a brief review of the different bonding technologies is discussed.After that,three main DWB techniques of single-,double-and multi-bonding are presented with the demonstrations of various heterogeneous integration applications.Mean-while,the integration challenges,such as micro-defects,surface roughness and bonding yield are discussed in detail.     

Wireless-adaptive fair scheduling for multimedia stream

As packet cellular networks are expected to support multimedia services, the authors incorporate the multimedia QoS requirements into the design of a new scheduling algorithm. The proposed wireless-adaptive fair scheduling tries to allocate time slots for each user with fair share by considering the varying channel condition while reflecting the stream requirements and achieving high throughput.     

Novel Maskless Bumping for 3D Integration

A novel, maskless, low‐volume bumping material, called solder bump maker, which is composed of a resin and low‐melting‐point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out‐gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 µm and 150 µm.     

Noninvasive Transdermal Vaccination Using Hyaluronan Nanocarriers and Laser Adjuvant

Vaccines are commonly administered by injection using needles. Although transdermal microneedles are less invasive promising alternatives, needle‐free topical vaccination without involving physical damage to the natural skin barrier is still sought after as it can further reduce needle‐induced anxiety and is simple to administer. However, this long‐standing goal has been elusive since the intact skin is impermeable to most macromolecules. Here, we show an efficient, noninvasive transdermal vaccination by employing two key innovations: the use of hyaluronan (HA) as vaccine carriers and non‐ablative laser adjuvants. Conjugates of a model vaccine ovalbumin (OVA) and HA—HA–OVA conjugates—induced more effective maturation of dendritic cells in vitro, compared to OVA. Following topical administration in the skin, HA–OVA conjugates penetrated into the epidermis and dermis in murine and porcine skins, as revealed by intravital microscopy and fluorescence assay. Topical administration of HA‐OVA conjugates significantly elevated both humoral and mucosal antibodies, with peak levels at four weeks. An OVA challenge at week eight elicited strong immune‐recall responses. With pretreatment of the skin using non‐ablative fractional laser beams as adjuvant, strong immunization was achieved with much reduced doses of HA–OVA (1 mg kg^–1 OVA). Our results demonstrate the potential of the noninvasive patch‐type transdermal vaccination platform.     

Remote‐Controllable Molecular Knob in the Mesomorphic Helical Superstructures

A programed light‐responsive chiral liquid crystal (LC) containing four photochromic azobenzene moieties covalently connected to a central bicyclic chiral core (abbreviated as AZ₄ICD) is newly designed, precisely synthesized, and efficiently applied as a remote‐controllable molecular knob for the optically tunable thin film. First of all, phase evolutions and ordered structures of AZ₄ICD are systematically investigated by a combination of thermal, microscopic, scattering, and simulation techniques. Wide‐angle X‐ray diffractions of oriented AZ₄ICD samples indicate that the AZ₄ICD molecule itself basically forms layer structures: one is a low‐ordered chiral smectic A LC phase (SmA*) with 5.61 nm layer periodicity at high temperatures, and two highly ordered smectic crystal (SmCr₁ and SmCr₂) phases are subsequently formed at lower temperatures with the anticlinically tilted molecular packing structures. The helical superstructures of chiral nematic LC phase (N*) can be spontaneously constructed by doping AZ₄ICD chiral agents into the achiral nematic molecules. Due to the bent conformational geometry of AZ₄ICD, the thermal window of blue LC phase (BP) is expanded by stabilizing the double twisted cylindrical building blocks. Remote‐controllable phase transformations in the mesomorphic helical superstructures are demonstrated by tuning the wavelength of light.     

High‐Performance Sodium‐Ion Hybrid Supercapacitor Based on Nb2O5@Carbon Core–Shell Nanoparticles and Reduced Graphene Oxide Nanocomposites

Sodium‐ion hybrid supercapacitors (Na‐HSCs) have potential for mid‐ to large‐scale energy storage applications because of their high energy/power densities, long cycle life, and the low cost of sodium. However, one of the obstacles to developing Na‐HSCs is the imbalance of kinetics from different charge storage mechanisms between the sluggish faradaic anode and the rapid non‐faradaic capacitive cathode. Thus, to develop high‐power Na‐HSC anode materials, this paper presents the facile synthesis of nanocomposites comprising Nb₂O₅@Carbon core–shell nanoparticles (Nb₂O₅@C NPs) and reduced graphene oxide (rGO), and an analysis of their electrochemical performance with respect to various weight ratios of Nb₂O₅@C NPs to rGO (e.g., Nb₂O₅@C, Nb₂O₅@C/rGO‐70, ‐50, and ‐30). In a Na half‐cell configuration, the Nb₂O₅@C/rGO‐50 shows highly reversible capacity of ≈285 mA h g^?1 at 0.025 A g^?1 in the potential range of 0.01–3.0 V (vs Na/Na⁺). In addition, the Na‐HSC using the Nb₂O₅@C/rGO‐50 anode and activated carbon (MSP‐20) cathode delivers high energy/power densities (≈76 W h kg^?1 and ≈20 800 W kg^?1) with a stable cycle life in the potential range of 1.0–4.3 V. The energy and power densities of the Na‐HSC developed in this study are higher than those of similar Li‐ and Na‐HSCs previously reported.