Economic perspectives of SMSNRs in the energy market of Japan

The marginal values of the investment cost were analyzed for each of five types of SMSNRs to penetrate into the energy system optimized by minimizing the total system cost. The results showed the upper values of the investment cost as 1.4, 1.35, and 1.45 times that of a large-scale LWR for a medium-sized LWR, a small-sized LWR, and a LWR for cogeneration, respectively. The economic conditions for SMSNRs to be adopted by electric utilities were analyzed through comparison of the financial performance of a Japan's typical electric utility in the two cases of selecting a large-scale LWR and a small-sized LWR. The results indicated that the upper limit of the construction cost is 1.4 times that of a large-scale LWR.     

La courbe de percée de l'adsorption en lit fixe pour une isotherme favorable

Theoretical solutions were found for the breakthrough curve taking into account the axial dispersion in the fixed bed and two transfer mechanisms for the resistance to adsorption. A numerical solution was obtained for a Langmuir isotherm and an analytical solution for a favourable isotherm represented by two straight lines. With the help of an electronic computer we compared the breakthrough curves for these two types of adsorption isotherms. For a favourable isotherm it was found that the theoretical equation of the breakthrough curve can be represented with sufficient accuracy by a simple expression proposed by ourselves. Various experiments were carried out in order to compare the theoretical predictions obtained with the experimental results of the breakthrough curve. The agreement between the two results was found to be excellent.     

Solid insulated switchgear and investigation of its mechanical and electrical reliability

SF₆ gas is widely employed in medium‐voltage switchgear because of its high insulation reliability and down‐sizing ability. However, SF₆ gas was placed on the list of greenhouse gases under the Kyoto Protocol in 1997. Since then, research on low‐SF₆ or SF₆‐free insulation has been carried out actively. Therefore, we focused on solid materials with higher dielectric strength than SF₆, and we have now developed solid insulated switchgear (SIS) that uses molding of all main circuits. A new epoxy casting material is used which contains a large amount of spherical silica and a small amount of rubber particles. This new material has high mechanical strength, high thermal resistance, high toughness, and also high dielectric strength because of direct molding of the vacuum bottle, as well as reduced size and high reliability. This paper describes the technology of the new epoxy casting material which makes possible SIS. In addition, mechanical and electrical reliability tests of SIS using a new epoxy resin were performed, and the effectiveness of the developed material and the mechanical and electrical reliability of the SIS were verified. © 2010 Wiley Periodicals, Inc. Electr Eng Jpn, 174(4): 28–36, 2011; Published online in Wiley Online Library ( wileyonlinelibrary.com ). DOI 10.1002/eej.21057     

Characterization of substrate off-angle effects for high-quality homoepitaxial CVD diamond films

We have studied the substrate off-angle effects for the crystalline quality of the homoepitaxial diamond films mainly by using steady-state cathodoluminescence (CL) and time-resolved photoluminescence (PL) measurements. By means of the microwave plasma chemical vapor deposition method under high-power microwave power with high methane concentrations, the homoepitaxial diamond films were grown on the high-pressure/high-temperature-synthesized (HPHT) Ib (001) substrates inclined along either <110> or <100> direction by different off-angles ranging from 2° to 5°. In spite of high growth rates, we have succeeded in improving crystalline quality by employing the HPHT substrates with considerably large off-angles. Both steady-state CL and time-resolved PL measurements clearly indicate that larger off-angles lead to better crystalline quality of the homoepitaxial film, suggesting that further improvements in crystalline quality can be expected when using substrates having even larger off-angles.     

Crank‐shaped and Y‐shaped through‐hole interconnections filled with Au‐Sn solder

Crank‐shaped and Y‐shaped through‐hole interconnections (THI) filled with Au‐Sn solder are demonstrated in this study. They are expected to realize a higher‐density wafer‐level package (WLP) for electrical devices including the fields of MEMS (Micro Electro‐Mechanical Systems) and MOEMS (Micro Optical Electro‐Mechanical Systems) compared with conventional WLP using THI consisting of straight through‐holes. In this paper, formation techniques for crank‐shaped and Y‐shaped THI are described. In order to make crank‐shaped and Y‐shaped through‐holes in a substrate, both femtosecond laser irradiation and wet chemical etching are used. Crank‐shaped through‐holes with an 80‐μm opening and 400 μm deep have also been achieved. Gold (Au)‐tin (Sn) solder was filled into the holes using the molten metal suction method (MMSM). Airtightness of the THI was examined using the helium leakage test, and the estimated leakage rate was less than 1.0 × 10^?9 Pa·m³/s, which is sufficient for use in WLP applications. © 2012 Wiley Periodicals, Inc. Electr Eng Jpn, 179(1): 54–62, 2012; Published online in Wiley Online Library ( wileyonlinelibrary.com) . DOI 10.1002/eej.21134     

Coal liquefaction using iron complexes as catalysts

Hydroliquefaction of Japanese Miike and Taiheiyo coals was carried out using various iron complexes as catalysts in tetralin at 375–445 °C. Iron pentacarbonyl (Fe(CO)₅) showed the highest catalytic activity, increasing coal conversion by about 10% at 425 °C under an initial hydrogen pressure of 5 MPa. Amounts of hydrogen transferred to coal increased from 1.4–2.3 wt% of daf coal in the absence of the catalyst to 2.5–4.2 wt% of daf coal in the presence of Fe(CO)₅ at 425 °C.