Banding formation and eutectic lamellar growth in directional solidified Ni50Al20Fe30 alloy

Banding formation and eutectic lamellar growth in a directionally solidified Ni₅₀Al₂₀Fe₃₀ alloy were investigated. It was found that the banding area consists of two layers. The first layer is a γ layer, while the subsequent one is a γ layer. The composition of various phases around the banding area changes with the solidification process. The banding is formed by two steps process and caused by factors such as the fractions during the sample growth process. It was found that the band was found at relatively low growth rate. Therefore. this study indicates that increasing the growth rate is an effective method to eliminate the band formation. Eutectic lamellae nucleate and grow again after the banding formation. During the initial transition lamellar growth, the relationship between the square lamellar spacing, γ₂, and the distance from, the banding, d, can be described by the following equation: γ₂ = K [1-exp(A.d)] where K and A are constant.     

Examination of wire electrical discharge machining of Al2O3p/6061Al composites

Alumina particle reinforced 6061 aluminum matrix composites (Al₂O₃p/6061Al) have excellent physical and chemical properties than those of a traditional metal; however, their poor machinability lead to worse surface quality and serious cutting tool wear. In this study, wire electrical discharge machining (WEDM) is adopted in machining Al₂O₃p/6061Al composite. In the experiments, machining parameters of pulse-on time were changed to explore their effects on machining performance, including the cutting speed, the width of slit and surface roughness. Moreover, the wire electrode is easily broken during the machining Al₂O₃p/6061Al composite, so this work comprehensively investigates into the locations of the broken wire and the reason of wire breaking.The experimental results indicate that the cutting speed (material removal rate), the surface roughness and the width of the slit of cutting test material significantly depend on volume fraction of reinforcement (Al₂O₃ particles). Furthermore, bands on the machined surface for cutting 20 vol.% Al₂O₃p/6061Al composite are easily formed, basically due to some embedded reinforcing Al₂O₃ particles on the surface of 6061 aluminum matrix, interrupt the machining process. Test results reveal that in machining Al₂O₃p/6061Al composites a very low wire tension, a high flushing rate and a high wire speed are required to prevent wire breakage; an appropriate servo voltage, a short pulse-on time, and a short pulse-off time, which are normally associated with a high cutting speed, have little effect on the surface roughness.     

Oxidation of Si-based ceramics in the presence of alkali halide vapors

Nonoxide silicon-based ceramics owe their oxidation resistance to the formation of a thin silica film that separates the ceramic from oxidizing environments. This silica film can be fluxed by alkali oxides to form low-melting alkali silicate corrosion products that do not provide protection. Alkali chlorides and other halides have sufficiently high vapor pressures that silica fluxing can occur without the formation of a condensed halide salt. The rates of oxidation of Si, SiC, and Si₃N₄ are influenced by the composition of gas mixtures containing these species.     

Thermodynamic reassessment of the Cd−Zn system

The Cd−Zn system has been thermodynamically reassessed with the CALPHAD method by combining more recent experimental data, in particular the activities of zinc in the liquid phase. A good agreement is obtained between the calculated and experimental thermodynamic parameters as well asphase boundaries.     

Low-energy ion beam treatment of α-Al<Subscript>2</Subscript>O<Subscript>3</Subscript>(0001) and improvement of photoluminescence of ZnO thin films

A low energy N₂ ^? ion beam impinged on a α-Al₂O₃(0001) single crystal surface in the range of fluence 5×10¹⁵/cm²?1×10¹⁸/cm² at room temperature. After ion bombardment, chemical bonding on the modified sapphire surface was investigated by x-ray photoelectron spectroscopy. Below a fluence of 1×10¹⁵/cm², only a non-bonded N1s peak at the binding energy 398.7 eV was found, but further irradiation up to 2×10¹⁷/cm² induced Al?O?N bonding at around 403 eV. The occurrence of Al?N bonding was identified at ion fluence higher than 5×10¹⁷/cm² at 396.6 eV. II–VI ZnO thin films were grown on an untreated/ion-beam-induced sapphire surface by pulsed laser deposition (PLD) for the investigation of the modified-substrate effect on photoluminescence. The ZnO films grown on modified sapphire containing Al?O?N bonding only, and both Al?O?N and Al?N bonding showed a significant reduction of the peak related to deep-level defects in photoluminescence. These results are explained in terms of the formation of Al?N?O and Al?O?N layers and relaxation of the interfacial strain between Al₂O₃ and ZnO.     

Caustic stress corrosion cracking of alloys 600 and 690 with NaOH concentrations

In order to evaluate the stress corrosion cracking resistance for commercial alloys (C600MA, C600TT, C690TT) and Korean-made alloys (K600MA, K690TT), C-ring tests were performed in a caustic environment of 4, 10, 20, 30, and 50% NaOH solution at 315°C, for 480 h with an applied potential of 125 mV vs. OCP. Different stress corrosion cracking phenomena were observed according to the NaOH concentration. The rate of caustic IGSCC attack did not appear to increase monotonically with caustic concentrations, but peaked at a concentration between 4 and 50% caustic, or approximately 30% NaOH. Intergranular stress corrosion cracking was found for C600MA in 10, 20, and 30% NaOH solutions, while no cracking was observed in the 4 and 50% NaOH solutions. In 30% NaOH solution, transgrnular stress corrosion cracking was detected in C690TT, which may be related with the large amount of plastic strain (150% yield) and the applied potential (125 mV vs. OCP). The overall data clearly indicate that C600MA has the worst SCC resistance while K690TT offers the best resistance. There is also fairly good correlation between the caustic SCC susceptibility and some metallurgical parameters, particularly the grain size and the yield strength at room temperature. Specifically, materials having larger grain size and lower yield strength exhibited higher caustic SCC resistance.     

How purchase intention consummates purchase behaviour: the stochastic nature of product valuation in electronic commerce

This study challenges the conventional assumption that online customers with high purchase intention routinely move to the purchase stage. To this end, the process of how online customers form purchase intention and behaviour is examined. On the basis of product value distribution (PVD), we propose that the hypothetically expected product value (i.e. PVD average) determines purchase intention, whereas the actual probability of attaining the expected product value (i.e. PVD variance) moderates purchase behaviour. This proposal indicates that the expected product value has significance only when repeated purchase is assumed given that most consumers do not repeatedly purchase the same product in reality. Thus, the actual probability of attaining the expected product value more critically affects customer behaviour than does its expected value. The effectiveness of the research model is verified by conducting a survey on 300 online mall shoppers in Korea. The results confirm model effectiveness.     

Ongoing verification of a multiphysics community code: FLASH

When developing a complex, multi‐authored code, daily testing on multiple platforms and under a variety of conditions is essential. It is therefore necessary to have a regression test suite that is easily administered and configured, as well as a way to easily view and interpret the test suite results. We describe the methodology for verification of FLASH, a highly capable multiphysics scientific application code with a wide user base. The methodology uses a combination of unit and regression tests and an in‐house testing software that is optimized for operation under limited resources. Although our practical implementations do not always comply with theoretical regression‐testing research, our methodology provides a comprehensive verification of a large scientific code under resource constraints.Copyright © 2013 John Wiley & Sons, Ltd.     

Debugging mixed‐environment programs with Blink

Programmers build large‐scale systems with multiple languages to leverage legacy code and languages best suited to their problems. For instance, the same program may use Java for ease of programming and C to interface with the operating system. These programs pose significant debugging challenges, because programmers need to understand and control code across languages, which often execute in different environments. Unfortunately, traditional multilingual debuggers require a single execution environment. This paper presents a novel composition approach to building portable mixed‐environment debuggers, in which an intermediate agent interposes on language transitions, controlling and reusing single‐environment debuggers. We implement debugger composition in Blink, a debugger for Java, C, and the Jeannie programming language. We show that Blink is (i) simple: it requires modest amounts of new code; (ii) portable: it supports multiple Java virtual machines, C compilers, operating systems, and component debuggers; and (iii) powerful: composition eases debugging, while supporting new mixed‐language expression evaluation and Java native interface bug diagnostics. To demonstrate the generality of interposition, we build prototypes and demonstrate debugger language transitions with C for five of six other languages (Caml, Common Lisp, C#, Perl 5, Python, and Ruby) without modifications to their debuggers. Using real‐world case studies, we show that diagnosing language interface errors require prior single‐environment debuggers to restart execution multiple times, whereas Blink directly diagnoses them with one execution. Copyright © 2014 John Wiley & Sons, Ltd.