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Various silicon surface cleaning processes for rapid thermal in-situ polysilicon/ oxide/silicon stacked gate structures have been evaluated. Metal-oxide-semiconductor capacitors were fabricated to assess the effects of cleaning on the quality of gate oxide structures produced by both rapid thermal oxidation (RTO) and rapid thermal chemical vapor deposition (RTCVD). Excellent electrical properties have been achieved for both RTO and RTCVD gate oxides formed on silicon wafers using either an ultraviole/zone (UV/O3) treatment or a modified RCA clean. On the contrary, poor electrical properties have been observed for RTO and RTCVD gate oxides formed on silicon wafers using a high temperature bake in Ar, H2, or high vacuum ambient. It has also been found that the electrical properties of the RTCVD gate oxides exhibit less dependence upon cleaning conditions than those of RTO gate oxides. This work demonstrates that initial surface condition prior to gate oxide formation plays an important role in determining the quality of RTO and RTCVD gate oxides.  相似文献   
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Titanium and cobalt germanides have been formed on Si (100) substrates using rapid thermal processing. Germanium was deposited by rapid thermal chemical vapor deposition prior to metal evaporation. Solid phase reactions were then performed using rapid thermal annealing in either Ar or N2 ambients. Germanide formation has been found to occur in a manner similar to the formation of corresponding silicides. The sheet resistance was found to be dependent on annealing ambient (Ar or N2) for titanium germanide formation, but not for cobalt germanide formation. The resistivities of titanium and cobalt germanides were found to be 20 μΩ-cm and 35.3μΩ-cm, corresponding to TiGe2 and Co2Ge, respectively. During solid phase reactions of Ti with Ge, we have found that the Ti6Ge5 phase forms prior to TiGe2. The TiGe2 phase was found to form approximately at 800° C. Cobalt germanide formation was found to occur at relatively low temperatures (425° C); however, the stability of the material is poor at elevated temperatures.  相似文献   
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Modern communication systems offer high speed and reliable data transmission services. The quality of these services is achieved by combining coded multi-level modulation techniques and modern digital signal processing (Viterbi-decoding) in the receiver. In this paper we first present an introduction to Trellis Coded Modulation (TCM) and then some new results on unversal techniques adapted for the AWGN-channel as well as for the fading channel. It is shown that TCM is well suited for communication channels with time variant characteristics (e.g. mobile communication channels), especially when our new codes are applied.  相似文献   
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This paper deals with the global basis of evaluation in different cases of electrical interference due to Austrian standards. Conditions are explained to harmonize standards in case of inductive interference, electrostatic influence and resistive interference in connection to probability factors. Relevant notions as zone of exposure, area of protection and restricted area are explained to create optimal strategies of planning.  相似文献   
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