Process-based cost modeling of photonics manufacture: the cost competitiveness of monolithic integration of a 1550-nm DFB laser and an electroabsorptive modulator on an InP platform

The monolithic integration of components holds promise to increase network functionality and reduce packaging expense. Integration also drives down yield due to manufacturing complexity and the compounding of failures across devices. Consensus is lacking on the economically preferred extent of integration. Previous studies on the cost feasibility of integration have used high-level estimation methods. This study instead focuses on accurate-to-industry detail, basing a process-based cost model of device manufacture on data collected from 20 firms across the optoelectronics supply chain. The model presented allows for the definition of process organization, including testing, as well as processing conditions, operational characteristics, and level of automation at each step. This study focuses on the cost implications of integration of a 1550-nm DFB laser with an electroabsorptive modulator on an InP platform. Results show the monolithically integrated design to be more cost competitive over discrete component options regardless of production scale. Dominant cost drivers are packaging, testing, and assembly. Leveraging the technical detail underlying model projections, component alignment, bonding, and metal-organic chemical vapor deposition (MOCVD) are identified as processes where technical improvements are most critical to lowering costs. Such results should encourage exploration of the cost advantages of further integration and focus cost-driven technology development.     

Electrostatic polymer processing of isotactic poly(4-methyl-1-pentene) fibrous membrane

Isotactic poly(4-methyl-1-pentene) (P4M1P) is a widely used polymer in industrial applications and specifically, in medical products. Producing micro- or nanofibers would expand the usefulness of P4M1P to a broad range of medical applications. The choice and quality of solvent for the solution used for electrospinning can have a dramatic effect on the spinnability of fibers and on their morphological appearance. In this study, four solvent systems: cyclohexane, cyclohexane/acetone mixture, cyclohexane/dimethyl formamide (DMF) mixture and cyclohexane/acetone/DMF mixture have been investigated. As demonstrated by FE-SEM, electrospun fibers with different morphologies including round, twisted with a roughened texture, curled and twisted-ribbon shapes were formed. The fiber shape and morphology depended strongly on the type and amount of non-solvent used.     

The influence of packaging materials on RF performance

At frequencies beyond 1 GHz, every component of the IC package contributes to the RF performance, whether required or not. In this work, we study the effects of packaging materials namely, the substrate and the globtop/underfill material on RF performance. We have measured interconnects on two area-array CSPs, the ball grid array and the polymer stud grid array using IMEC’s MCM-D technology. The measurements on the package interconnect show that the losses in the package substrate material account for about 50% of the total losses at 1.8 GHz and this drops to less than 20% at 5.2 GHz. The losses due to impedance mismatch dominate the losses especially below 10 GHz and considerable improvement in performance cannot be obtained by using an improved/expensive substrate. The other study is about the influence of globtop/underfill materials on wirebonds (through 3D EM simulations) as well as on standard 50 Ω MCM-D transmission lines (through experiments). While a higher value of dielectric constant of the globtop/underfill material is better on wirebonds, the influence of loss tangent is felt only above values of 0.1. The influence of seven different globtop/undefill materials on 50 Ω transmission lines has been used to extract their dielectric constant and loss tangent values at 30 GHz. These results are very valuable since one can hardly find the properties of globtop/underfill materials beyond 1 GHz.     

High‐pressure processing effects on the mechanical,barrier and mass transfer properties of food packaging flexible structures: a critical review

Food products can be high‐pressure processed (HPP) either in bulk or prepackaged in flexible or semi‐rigid packaging materials. In the latter case the packaging material is subjected, together with the food, to high‐pressure treatment. A number of studies have been performed to quantify the effects of high‐pressure processing on the physical and barrier properties of the packaging material, since the integrity of the package during and after processing is of paramount importance to the safety and quality of the food product. This article reviews the results of published research concerning the effect of HPP on packaging materials. Copyright © 2004 John Wiley & Sons, Ltd.     

Promise is Debt, Threat Another Matter: The Effect of Credibility on the Interpretation of Conditional Promises and Threats.

Evidence from reasoning tasks shows that promises and threats both tend to receive biconditional interpretations. They also both display high speaker control. On the face of it, the only difference seems to be the positive or negative signing of the consequent. In a promise, the speaker tries to persuade the hearer to do something by holding out the prospect of a particular reward; in a threat, the speaker tries to refrain the hearer from doing something by holding out the prospect of a particular punishment. This paper investigates the respects in which conditional promises and threats differ further by means of an inference task. The credibility of the consequent was manipulated in order to examine whether the acceptability ratings of inferences based on promises and on threats would be equally affected. The results of the inference task and an analysis of the reasons people give for their answers suggest that the credibility of promises is less affected by the use of excessive consequents than the credibility of threats. In other words, promise remains debt, whereas threat is another matter. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

High quality LTCC resonator for voltage-controlled oscillator

Design and technology of microwave conductor lines embedded in low-temperature cofired ceramic (LTCC) multilayer substrates are summarized with a focus on achieving the highest possible quality (Q) factor for a given line inductance. The work was initiated to test the integrability of base station voltage-controlled oscillators (VCOs) in ceramic multilayer substrates. This approach leads to a miniaturization of current versions by a factor of 2 to 4. However, base station specifications for phase noise and hence resonator Q are extremely demanding. Therefore, both the design and the processing technology were optimized. By choosing a twin-line design with two parallel lines vertically separated by a single LTCC layer, Q factors of 90 and 180 have been achieved for integrated 5.5 nH inductors at frequencies of 640 MHz and 1650 MHz, respectively. Application of this result to VCO modules in standard LTCC technology already yields low phase noise levels, e.g., -136 dBc/Hz at 100 kHz offset, which is suitable for base station applications. However, further noise reduction is expected from a dedicated high Q fabrication process that uses conventional via punching and filling steps to replace the ceramic material between the two lines by conductive silver paste. This raises the Q to 120 and 200, respectively, at the two frequencies and adds extra degrees of freedom to LTCC design for low-loss wireless solutions.     

Stalked by the postmodern beast.

Compares the philosophical positions of K. J. Gergen (see record 1994-37275-001) and M. B. Smith (see record 1994-37277-001) concerning the impact of postmodernism on psychology's scientific foundations. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

Automatic conversion of triangular finite element meshes to quadrilateral elements

A method is presented for the fully automatic conversion of a general finite element mesh containing triangular elements into a mesh composed of exclusively quadrilateral elements. The initial mesh may be constructed of entirely triangular elements or may consist of a mixture of triangular and quadrilateral elements. The technique used employs heuristic procedures and criteria to selectively combine adjacent triangular elements into quadrilaterals based on preestablished criteria for element quality. Additional procedures are included to eliminate isolated triangles. The methods operates completely without user intervention once the nodal co-ordinates and element connectivity of the original mesh are supplied.